IP Library › Granted Patent US 9,984,029
Granted Patent B2
US 9,984,029 · App. 14/484,137 · Granted May 29, 2018

Variable interconnect pitch for improved performance

Inventors: Kern Rim (San Diego, CA); Stanley Seungchul Song (San Diego, CA); Xiangdong Chen (Irvine, CA); Raymond George Stephany (Austin, TX); John Jianhong Zhu (San Diego, CA); Ohsang Kwon (San Diego, CA); Esin Terzioglu (San Diego, CA); Choh Fei Yeap (San Diego, CA)
Assignee: QUALCOMM Incorporated
G06F13/4068G06F13/4221G06F17/5068H01L27/0207G06F17/5077H01L23/528H01L2924/0002
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Quick Facts
Patent No.
US 9,984,029
App. No.
14/484,137
Granted
May 29, 2018
Kind
B2
Abstract

A method of designing conductive interconnects includes determining a residual spacing value based at least in part on an integer multiple of a interconnect trace pitch and a designated cell height. The method also includes allocating the residual spacing to at least one interconnect trace width or interconnect trace space within the interconnect trace pitch.

Claims (24)

1. A method of arranging a plurality of conductive interconnects within a device cell having a predetermined device function and a device cell size, comprising:

determining a residual spacing value based at least in part on an integer multiple of an interconnect trace pitch and the device cell size;

identifying at least one of the plurality of conductive interconnects on a predetermined performance-sensitive route in the device cell; and

allocating the residual spacing value to an interconnect trace width of the identified at least one of the plurality of conductive interconnects within the device cell, the interconnect trace width of the identified at least one of the plurality of conductive interconnects arranged on the predetermined performance-sensitive route being greater than an interconnect trace width of at least one other of the plurality of conductive interconnects off the predetermined performance-sensitive route and within the device cell of a plurality of device cells.

2. The method of claim 1 , in which a set of interconnect trace widths and interconnect trace spacing fill a cell height of the device cell size or fill a width of a circuit block.

3. The method of claim 1 , in which allocating the residual spacing value further comprises distributing the residual spacing value evenly among interconnect trace spacing of the plurality of conductive interconnects within a cell height of the device cell size or within a width of a circuit block.

4. The method of claim 1 , in which allocating the residual spacing value further comprises distributing the residual spacing value to specific interconnect trace widths of the plurality of conductive interconnects identified on the predetermined performance-sensitive route within a cell height of the device cell size.

5. The method of claim 1 , in which allocating the residual spacing value further comprises allocating the residual spacing value to an interconnect trace spacing adjacent the identified at least one of the plurality of conductive interconnects.

6. The method of claim 1 , in which the plurality of conductive interconnects are integrated into a mobile phone, a set top box, a music player, a video player, an entertainment unit, a navigation device, a computer, a hand-held personal communication systems (PCS) unit, a portable data unit, and/or a fixed location data unit.

7. A device having conductive interconnects within a device cell having a predetermined device function and a device cell size, comprising:

a plurality of the conductive interconnects off a predetermined performance sensitive route in the device cell and having a first interconnect trace width and a first interconnect trace spacing, in which a sum of the first interconnect trace width and the first interconnect trace spacing for each of the conductive interconnects does not match the device cell size; and

at least one other of the conductive interconnects within the device cell and having a second interconnect trace width and a second interconnect trace spacing, the at least one other of the conductive interconnects arranged on the predetermined performance-sensitive route in the device cell of a plurality of device cells, in which the second interconnect trace width is greater than the first interconnect trace width.

8. The device of claim 7 , in which a set of interconnect trace widths and interconnect trace spacing fill the device cell size.

9. The device of claim 7 , in which space is allocated to an interconnect trace spacing adjacent the at least one other of the conductive interconnects within the device cell size, such that the second interconnect trace spacing is different from the first interconnect trace spacing.

10. The device of claim 7 , integrated into a mobile phone, a set top box, a music player, a video player, an entertainment unit, a navigation device, a computer, a hand-held personal communication systems (PCS) unit, a portable data unit, and/or a fixed location data unit.

11. A method of arranging a plurality of conductive interconnects within a device cell having a predetermined device function and a device cell size, comprising:

the step of determining a residual spacing value based at least in part on an integer multiple of an interconnect trace pitch and the device cell size;

the step of identifying at least one of the plurality of conductive interconnects on a predetermined performance-sensitive route in the device cell; and

the step of allocating the residual spacing value to an interconnect trace width of the identified at least one of the plurality of conductive interconnects within the device cell, the interconnect trace width of the identified at least one of the plurality of conductive interconnects arranged on the predetermined performance-sensitive route being greater than an interconnect trace width of at least one other of the plurality of conductive interconnects off the predetermined performance-sensitive route and within the device cell of a plurality of device cells.

12. The method of claim 11 , in which a set of interconnect trace widths and interconnect trace spacing fill a cell height of the device cell size or fill a width of a circuit block.

13. The method of claim 11 , in which the step of allocating the residual spacing value further comprises the step of distributing the residual spacing value evenly among interconnect trace spacing of the plurality of conductive interconnects within a cell height of the device cell size or within a width of a circuit block.

14. The method of claim 11 , in which the step of allocating the residual spacing value further comprises the step of distributing the residual spacing value to specific interconnect trace widths of the plurality of conductive interconnects identified on the predetermined performance-sensitive route within a cell height of the device cell size.

15. The method of claim 11 , in which the step of allocating the residual spacing value further comprises the step of allocating the residual spacing value to an interconnect trace spacing adjacent the identified at least one of the plurality of conductive interconnects.

16. The method of claim 11 , in which the plurality of conductive interconnects are integrated into a mobile phone, a set top box, a music player, a video player, an entertainment unit, a navigation device, a computer, a hand-held personal communication systems (PCS) unit, a portable data unit, and/or a fixed location data unit.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 5, 2015
From: RIM, KERN; SONG, STANLEY SEUNGCHUL; CHEN, XIANGDONG; STEPHANY, RAYMOND GEORGE; ZHU, JOHN JIANHONG; KWON, OHSANG; TERZIOGLU, ESIN; YEAP, CHOH FEI
To: QUALCOMM INCORPORATED
Reel/Frame 035097/0621 →
Continuity (2)
Provisional Application 61981611 · Apr 18, 2014
Related Publication 20150301973A1 · Oct 22, 2015