Power inductor and method of manufacturing the same

1. A power inductor comprising:

a substrate having a through hole in a central portion thereof;

a first internal coil pattern and a second internal coil pattern each having a spiral shape and provided on opposite surfaces of the substrate outwardly of the through hole;

a magnetic body enclosing the substrate on which the first internal coil pattern and the second internal coil pattern are provided, end portions of the first internal coil pattern and the second internal coil pattern being exposed to opposite end surfaces thereof;

a first external electrode and a second external electrode provided on the opposite end surfaces of the magnetic body to be connected to the end portions of the first internal coil pattern and the second internal coil pattern, respectively; and

an anti-plating layer covering the magnetic body between the first external electrode and the second external electrode,

wherein the anti-plating layer does not include a resin,

wherein the anti-plating layer includes an organic-inorganic hybrid composite including an inorganic silica sol and an organic silane coupling agent.

2. The power inductor of claim 1 , wherein the magnetic body includes a ferrite or a metal-polymer composite.

3. The power inductor of claim 2 , wherein the metal-polymer composite includes:

metal particles having a diameter ranging from 100 nm to 90 μm; and

a polymer in which the metal particles are dispersed.

4. The power inductor of claim 3 , wherein the metal particles are covered with a phosphate insulating layer.

5. The power inductor of claim 1 , wherein each of the first external electrode and the second external electrode includes:

a cured conductive paste layer connected to the first internal coil pattern or the second internal coil pattern; and

a plating layer plated on the cured conductive paste layer.

6. The power inductor of claim 5 , wherein the anti-plating layer further covers a portion of the cured conductive paste layer.

7. A method of manufacturing a power inductor, the method comprising steps of:

preparing a substrate having a through hole in a central portion thereof;

forming a first internal coil pattern and a second internal coil pattern each having a spiral shape on opposing surfaces of the substrate outwardly of the through hole;

forming a magnetic body enclosing the substrate on which the first internal coil pattern and the second internal coil pattern are formed, end portions of the first internal coil pattern and the second internal coil pattern being exposed to opposite end surfaces thereof;

forming an anti-plating layer to cover a portion of the magnetic body between the end surfaces of the magnetic body, the anti-plating layer not covering the end portions of the first internal coil pattern and the second internal coil pattern; and

forming a first external electrode and a second external electrode on the end surfaces of the magnetic body to be connected to the end portions of the first internal coil pattern and the second internal coil pattern wherein the anti-plating layer does not include a resin,

wherein the anti-plating layer includes an organic-inorganic hybrid composite including an inorganic silica sol and an organic silane coupling agent.

8. The method of claim 7 , wherein the magnetic body includes a ferrite or a metal-polymer composite.

9. The method of claim 7 , wherein the metal-polymer composite includes:

metal particles having a diameter ranging from 100 nm to 90 μm; and

a polymer in which the metal particles are dispersed.

10. The method of claim 9 , wherein the metal particles are covered with a phosphate insulating layer.

11. The method of claim 7 , wherein the step of forming the anti-plating layer and the step of forming the first external electrode and the second external electrode further comprise:

forming a cured conductive paste layer on the opposite end surfaces of the magnetic body to be connected to the end portions of the first internal coil pattern and the second internal coil pattern;

forming the anti-plating layer to cover a portion of the magnetic body on which the cured conductive paste layer is not formed; and

forming a plating layer on the cured conductive paste layer.

12. The method of claim 11 , wherein the anti-plating layer is formed to further cover a portion of the cured conductive paste layer.

13. The method of claim 7 , wherein the inorganic silica sol is formed by hydrolyzing and condensation-polymerizing silica with tetraethylorthosilicate.