Semiconductor device and method for fabricating the same
A semiconductor device, including a first fin-type pattern; a first gate spacer on the first fin-type pattern, intersecting the first fin-type pattern, and including an upper portion and a lower portion; a second gate spacer on the first fin-type pattern, intersecting the first fin-type pattern, and being spaced apart from the first gate spacer; a first trench defined by the first gate spacer and the second gate spacer; a first gate electrode partially filling the first trench; a first capping pattern on the first gate electrode and filling the first trench; and an interlayer insulating layer covering an upper surface of the capping pattern, a width of the upper portion of the first gate spacer decreasing as a distance from an upper surface of the first fin-type pattern increases, and an outer sidewall of the upper portion of the first gate spacer contacting the interlayer insulating layer.
1. A semiconductor device, comprising:
a first fin-type pattern;
a first gate spacer on the first fin-type pattern, the first gate spacer including an upper portion and a lower portion;
a second gate spacer on the first fin-type pattern, the second gate spacer being spaced apart from the first gate spacer;
a first trench defined by the first gate spacer and the second gate spacer;
a gate insulating layer along a bottom surface and a sidewall of the first trench;
a first gate electrode on the gate insulating layer, the first gate electrode partially filling the first trench;
a capping pattern on the first gate electrode, the capping pattern filling the first trench;
an interlayer insulating layer covering an upper surface of the capping pattern; and
a protruding spacer protruding from a sidewall of the lower portion of the first gate spacer into the interlayer insulating layer, wherein:
a width of the upper portion of the first gate spacer decreases as a distance from an upper surface of the first fin-type pattern increases,
an outer sidewall of the upper portion of the first gate spacer contacting the interlayer insulating layer,
a height of the first gate spacer from the upper surface of the first fin-type pattern and a height of the second gate spacer from the upper surface of the first fin-type pattern are different from each other, and
the protruding spacer includes a different material from the lower portion of the first gate spacer, and includes a same material as the upper portion of the first gate spacer.
2. The semiconductor device as claimed in claim 1 , further comprising a source/drain region adjacent to the first gate spacer, the source/drain region being within the first fin-type pattern,
wherein a self-aligned contact vertically overlapping the source/drain region, is not formed.
3. The semiconductor device as claimed in claim 1 , wherein the capping pattern includes a different material from the upper portion of the first gate spacer such that the capping pattern is more resistant to an etching process than the upper portion of the first gate spacer.
4. The semiconductor device as claimed in claim 1 , wherein a thickness of the upper portion of the first gate spacer is less than a thickness of the capping pattern.
5. The semiconductor device as claimed in claim 1 , wherein the lower portion of the first gate spacer is on a portion of the sidewall of the capping pattern, and on the sidewall of the first gate electrode.
6. The semiconductor device as claimed in claim 1 , further comprising an insert spacer between a lower surface of the first gate spacer and the first fin-type pattern, and between a lower surface of the second gate spacer and the first fin-type pattern,
wherein the insert spacer includes a different material from the first gate spacer.
7. The semiconductor device as claimed in claim 1 , wherein the lower portion of the first gate spacer and the upper portion of the first gate spacer include a same material.
8. The semiconductor device as claimed in claim 1 , further comprising:
a source/drain region adjacent to the second gate spacer, the source/drain region being within the first fin-type pattern, and
a self-aligned contact vertically overlapped with the source/drain region, the self-aligned contact contacting the second gate spacer.
9. A semiconductor device, comprising:
a first fin-type pattern;
a first gate spacer on the first fin-type pattern, the first gate spacer including an upper portion and a lower portion;
a second gate spacer on the first fin-type pattern, a height of the first gate spacer from an upper surface of the first fin-type pattern being greater than a height of the second gate spacer from the upper surface of the first fin-type pattern;
a first trench defined by the first gate spacer and the second gate spacer;
a gate insulating layer along a bottom surface and a sidewall of the first trench;
a first gate electrode on the gate insulating layer, the first gate electrode partially filling the first trench;
a capping pattern on the first gate electrode; and
a protruding spacer protruding from a sidewall of the lower portion of the first gate spacer into an interlayer insulating layer, wherein
the protruding spacer includes a different material from the lower portion of the first gate spacer, and includes a same material as the upper portion of the first gate spacer.
10. The semiconductor device as claimed in claim 9 , wherein:
a width of the upper portion of the first gate spacer decreases as a distance from the upper surface of the first fin-type pattern increases.
11. The semiconductor device as claimed in claim 10 , wherein a thickness of the upper portion of the first gate spacer is less than a thickness of the capping pattern.
12. The semiconductor device as claimed in claim 11 , wherein:
each of the first gate spacer and the second gate spacer includes SiOCN; and
the capping pattern includes SiN.