Thermally enhanced semiconductor package having field effect transistors with back-gate feature
The present disclosure relates to a thermally enhanced semiconductor package having field effect transistors (FETs) with a back-gate feature. The thermally enhanced semiconductor package includes a non-silicon thermal conductive component, a silicon layer with a thickness between 100 Å and 10 μm over the thermal conductive component, a buried oxide (BOX) layer over the silicon layer, an epitaxial layer over the BOX layer and having a source, a drain, and a channel between the source and the drain, a gate dielectric aligned over the channel, and a front-gate structure over the gate dielectric. Herein, a back-gate structure is formed in the silicon layer and has a back-gate region aligned below the channel. A FET is formed by the front-gate structure, the source, the drain, the channel, and the back-gate structure.
1. An apparatus comprising:
a thermal conductive component with no silicon;
a silicon layer over the thermal conductive component, wherein the silicon layer has a thickness between 100 Å and 10 μm;
a buried oxide (BOX) layer over the silicon layer;
an epitaxial layer over the BOX layer and having a source, a drain, a channel between the source and the drain, and epitaxial isolation regions surrounding the source and the drain;
a gate dielectric aligned over the channel;
a front-gate structure over the gate dielectric, wherein:
a back-gate structure is formed in the silicon layer and has a back-gate region aligned below the channel; and
a field effect transistor (FET) is formed by the front-gate structure, the source, the drain, the channel, and the back-gate structure; and
a front-side back-gate contact coupled to the back-gate structure via a front-side interconnect, which extends through the BOX layer and one of the epitaxial isolation regions of the epitaxial layer, wherein the one of the epitaxial isolation regions is adjacent to the drain or the source.
2. The apparatus of claim 1 wherein the epitaxial isolation regions are formed by shallow trench isolation (STI).
3. The apparatus of claim 1 wherein:
the back-gate structure further comprises back-gate extensions that surround the back-gate region; and
the front-side interconnect is in contact with one of the back-gate extensions.
4. The apparatus of claim 3 wherein the back-gate region has a higher implant density than the back-gate extensions.
5. The apparatus of claim 1 wherein the front-side interconnect is formed from polysilicon.
6. The apparatus of claim 1 wherein the silicon layer further comprises back-gate isolation regions, which surround the back-gate structure.
7. The apparatus of claim 6 wherein the back-gate isolation regions are formed by shallow trench isolation (STI).
8. The apparatus of claim 6 wherein:
the back-gate structure further comprises back-gate extensions that surround the back-gate region;
the back-gate isolation regions surround the back-gate extensions; and
the front-side interconnect is in contact with one of the back-gate extensions.
9. The apparatus of claim 8 wherein the back-gate region has a higher implant density than the back-gate extensions.
10. The apparatus of claim 1 further comprising a source contact directly over the source, a drain contact directly over the drain, and a front-gate contact directly over the front-gate structure.
11. The apparatus of claim 1 wherein the thermal conductive component has a thermal conductivity greater than 1 w/m·k.
12. The apparatus of claim 1 wherein the thermal conductive component has a thermal conductivity greater than 2.5 w/m·k.
13. An apparatus comprising:
a thermal conductive component with no silicon;
a silicon layer over the thermal conductive component, wherein the silicon layer has a thickness between 100 Å and 10 μm;
a buried oxide (BOX) layer over the silicon layer;
an epitaxial layer over the BOX layer and having a source, a drain, and a channel between the source and the drain;
a gate dielectric aligned over the channel;
a front-gate structure over the gate dielectric, wherein:
a back-gate structure is formed in the silicon layer and has a back-gate region aligned below the channel; and
a field effect transistor (FET) is formed by the front-gate structure, the source, the drain, the channel, and the back-gate structure; and
a back-side back-gate contact coupled to the back-gate structure via a back-side interconnect, which extends through the thermal conductive component.
14. The apparatus of claim 13 wherein:
the back-gate structure further comprises back-gate extensions that surround the back-gate region; and
the back-side interconnect is in contact with one of the back-gate extensions.
15. The apparatus of claim 13 wherein the back-side interconnect is in contact with the back-gate region.
16. The apparatus of claim 13 wherein the back-side interconnect is formed from polysilicon.
17. The apparatus of claim 1 wherein the BOX layer has a thickness between 5 nm-2000 nm.
18. The apparatus of claim 1 wherein the BOX layer has a thickness between 200 nm-400 nm.
19. The apparatus of claim 1 wherein the epitaxial layer has a thickness between 100 Å and 2 μm.
20. An apparatus comprising:
a thermal conductive component with no silicon;
a silicon layer over the thermal conductive component, wherein the silicon layer has a thickness between 100 Å and 10 μm;
a device layer over the silicon layer comprising:
a buried oxide (BOX) layer over the silicon layer;
an epitaxial layer over the BOX layer and having a source, a drain, and a channel between the source and the drain;
a gate dielectric aligned over the channel;
a front-gate structure over the gate dielectric, wherein:
a back-gate structure is formed in the silicon layer and has a back-gate region aligned below the channel; and
a field effect transistor (FET) is formed by the front-gate structure, the source, the drain, the channel, and the back-gate structure; and
a mold compound component surrounding the device layer and the silicon layer, and extending beyond the silicon layer to form a cavity within the mold compound component, wherein the thermal conductive component fills the cavity and is in contact with the silicon layer.