Curable fiberglass binder
A curable formaldehyde-free binding composition for use with fiberglass is provided. Such curable composition comprises an addition product of an amine and a reactant to form an amino-amide intermediate. To the amino-amide is added an aldehyde or ketone to form the curable binder composition. The composition when applied to fiberglass is cured to form a water-insoluble binder which exhibits good adhesion to glass. In a preferred embodiment the composition when applied to fiberglass provides a sufficient blackness required in facer products.
1. A curable composition for use in the binding of fiberglass comprising:
an aldehyde or ketone;
an amino-amide which is a conjugate addition product of an amine and a reactant; and
a thickener, wherein:
the amine comprises 1,6-hexanediamine,
the reactant comprises maleic anhydride,
the aldehyde or ketone comprises a reducing sugar,
the amino-amide is oligomerized by heating at a temperature from 120° C. to 150° C. prior to adding the aldehyde or ketone to the amino-amide, and
the curable composition is formaldehyde-free.
2. The curable composition of claim 1 , wherein the thickener is based on polysaccharides.
3. The curable composition of claim 1 , wherein the thickener has a weight average molecular weight of at least about 100,000 and below about 2,000,000.
4. The curable composition of claim 1 , wherein the thickener is based on hydroxyalkyl cellulose or carboxyalkyl cellulose.
5. The curable composition of claim 1 , wherein the thickener is present in the curable composition from 0.05 to 0.7 weight percent (based on dry mass).
6. The curable composition of claim 1 , wherein the composition comprises carbon black.
7. The curable composition of claim 1 , wherein the carbon black is present in the curable compositions from 10 to 50 weight percent (based on dry mass).
8. The curable composition of claim 6 , wherein the carbon black has particle size of 70 nm or less.
9. The curable composition of claim 1 , wherein an aldehyde is used with the amino-amide.
10. The curable composition of claim 1 , wherein the amino-amide is an oligomer.
11. The curable composition of claim 1 , wherein:
the amino-amide comprises an amide group and a carboxylic acid group, and
the amide group and the carboxylic acid group are formed by an amine group of the 1,6-hexanediamine covalently bonding with a carbonyl group of the maleic anhydride.
12. The curable composition of claim 1 , wherein the amino-amide is a monomer, dimer, trimer, or tetramer.
13. The curable composition of claim 1 , wherein the amino-amide comprises an amic acid function.