IP Library › Granted Patent US 10,005,299
Granted Patent B2
US 10,005,299 · App. 15/583,031 · Granted Jun 26, 2018

Print module with air cooling arrangement

Inventors: Mark Profaca (North Ryde, AU); David Burke (North Ryde, AU); Billy Sy (North Ryde, AU); Gilbert Alemana (North Ryde, AU); Christopher Hibbard (North Ryde, AU); Rommel Balala (North Ryde, AU)
Assignee: Memjet Technology Limited
B41J25/304B41J2/04541B41J2/155B41J2/16505B41J2/16508B41J2/16511B41J2/16535B41J2/16544B41J2/16547B41J2/16585B41J2/17596B41J25/006B41J25/34B41J29/377B41J2002/1655B41J2002/16514B41J2202/05
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Quick Facts
Patent No.
US 10,005,299
App. No.
15/583,031
Granted
Jun 26, 2018
Kind
B2
Abstract

A print module includes: a body housing first and second opposed printed circuit boards (PCBs), each of the first and second PCBs having heat-generating electronic components; an air inlet and an air outlet positioned towards an upper part of the body; an air pathway extending between the air inlet and the air outlet; a plurality of heatsinks, each heatsink being thermally coupled with one of the heat-generating components and having an array of cooling fins extending into the air pathway; and an inkjet printhead receiving power and print data from at least one of the first and second PCBs. The inkjet printhead is positioned toward a lower part of the print module.

Claims (25)

1. A print module comprising:

a body housing first and second opposed printed circuit boards (PCBs), each of the first and second PCBs having heat-generating electronic components;

an air inlet and an air outlet positioned towards an upper part of the body;

an air pathway extending between the air inlet and the air outlet;

a plurality of heatsinks, each heatsink being thermally coupled with one of the heat-generating components and having an array of cooling fins extending into the air pathway; and

an inkjet printhead receiving power and print data from at least one of the first and second PCBs,

wherein the inkjet printhead is positioned toward a lower part of the print module.

2. The print module of claim 1 , wherein a direction of ink droplet ejection is opposite to a direction of airflow through the air outlet.

3. The print module claim 1 , wherein the heat-generating electronic components are mounted on opposed surfaces of the first and second PCBs.

4. The print module of claim 3 , wherein:

a first heatsink comprises a first base in thermal contact with a first heat-generating electronic component of the first PCB and first cooling fins extending from the first base into the air pathway; and

a second heatsink comprises a second base in thermal contact with a second heat-generating electronic component of the second PCB and second cooling fins extending from the second base into the air pathway,

wherein the first and second cooling fins extend from their respective first and second heatsink bases in opposite directions.

5. The print module of claim 4 , wherein the air pathway is defined by an air duct extending between air inlet and the air outlet.

6. The print module of claim 5 , wherein the air duct isolates the air pathway from the first and second PCBs.

7. The print module of claim 5 , wherein the air duct includes a constriction for dividing an airflow through the air inlet into first and second airflows for cooling the first and second arrays of cooling fins, respectively.

8. The print module of claim 5 , wherein the air duct has at least one aperture defined in each side thereof, each heatsink being at least partially received in a complementary respective opening.

9. The print module of claim 1 , wherein each heatsink comprises a base in thermal contact with one of the heat-generating electronic components, and wherein the array of cooling fins for each heatsink extends from the base into the air pathway.

10. The print module of claim 1 , further comprising a fan for generating an airflow through the air pathway.

11. The print module of claim 10 , wherein the fan is positioned at the air inlet or the air outlet.

12. The print module of claim 1 , wherein the first PCB is a power PCB comprising one or more drive transistors supplying power to the inkjet printhead.

13. The print module of claim 1 , wherein the second PCB is a logic PCB comprising one or microprocessors supplying print data to the inkjet printhead.

14. The print module of claim 1 , wherein the first and second PCBs are connected via one or more electrical connectors.

15. The print module of claim 1 comprising a supply module engaged with a replaceable printhead cartridge, the supply module comprising the body and the printhead cartridge comprising the inkjet printhead.

16. The print module of claim 15 , wherein the supply module comprises an ink inlet module and an ink outlet module flanking either side of the body, each of the ink inlet and ink outlet modules having a respective ink coupling engaged with complementary inlet and outlet couplings of the printhead cartridge.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 28, 2017
From: PROFACA, MARK; BURKE, DAVID OLIVER; SY, BILLY; ALEMANA, GILBERT; HIBBARD, CHRISTOPHER; BALALA, ROMMEL
To: MEMJET TECHNOLOGY LTD.
Reel/Frame 043730/0331 →
Continuity (3)
Provisional Application 62330779 · May 2, 2016
Provisional Application 62408629 · Oct 14, 2016
Related Publication 20170313109A1 · Nov 2, 2017