IP Library › Granted Patent US 10,008,265
Granted Patent B2
US 10,008,265 · App. 14/923,247 · Granted Jun 26, 2018

Method and apparatus for providing three-dimensional integrated nonvolatile memory (NVM) and dynamic random access memory (DRAM) memory device

Inventor: Fu-Chang Hsu (San Jose, CA)
Assignee: NEO Semiconductor, Inc.
G11C14/0018G11C5/025G11C11/401G11C16/0483G11C16/10H01L27/1157H01L27/11582
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Quick Facts
Patent No.
US 10,008,265
App. No.
14/923,247
Granted
Jun 26, 2018
Kind
B2
Abstract

A memory system is configured to store information using a hybrid volatile and nonvolatile memory device. The memory system, in one aspect, includes memory components, a drain select gate (“DSG”) transistor, and a capacitor component. Each memory component, in one example, includes a source terminal, a gate terminal, a drain terminal, and a nonvolatile cell. The memory components are organized in a string formation and the components are interconnected between source terminals and drain terminals. The drain terminal of DSG transistor is coupled to the source terminal of a memory component and the gate terminal of DSG transistor is coupled to a DSG signal. The drain terminal of the capacitor is coupled to the source terminal of the first DSG transistor. The capacitor component is configured to perform a dynamic random-access memory (“DRAM”) function.

Claims (28)

1. A memory device able to store information, comprising:

a plurality of memory components able to store information, each of the plurality of memory components having a source terminal, a gate terminal, a drain terminal, and a nonvolatile cell, wherein the plurality of memory components is organized in a string and the memory components are interconnected between source terminals and drain terminals;

a first drain select gate (“DSG”) transistor having a source terminal, a drain terminal, and a gate terminal, the drain terminal of the first DSG transistor coupling to the source terminal of the plurality of memory components, the gate terminal of the first DSG transistor coupled to a first DSG signal; and

a capacitor component having a source terminal, a drain terminal, and a gate terminal, wherein the capacitor component is physically situated adjacent to the string and connects the drain terminal of the capacitor to the source terminal of the first DSG transistor, wherein the capacitor component is configured to perform a dynamic random-access memory (“DRAM”) function.

2. The device of claim 1 , further comprising a second DSG transistor having a source terminal, a drain terminal, and a gate terminal, the draining terminal of the second DSG transistor coupled to the source terminal of the capacitor component.

3. The device of claim 2 , further comprising a source select gate (“SSG”) component having a source terminal, a drain terminal, and a gate terminal, the source terminal of the SSG component coupled to a drain terminal of one of the plurality of memory components organized in the string.

4. The device of claim 3 , wherein the gate terminal the SSG component is coupled to an SSG signal, and the drain terminal of the SSG component is coupled to a source line.

5. The device of claim 3 , wherein the gate terminal the second DSG component is coupled to a DSG signal, and the source terminal of the second DSG component is coupled to a bit line.

6. The device of claim 3 , wherein the plurality of memory components is NAND based flash memory.

7. The device of claim 3 , wherein each gate terminal of the plurality of memory components is coupled to a unique word line.

8. The device of claim 1 , wherein the plurality of memory components is Silicon-Oxide-Nitride-Oxide-Silicon (“SONOS”) based nonvolatile memory storages.

9. The device of claim 3 , wherein the plurality of memory components, the first DSG transistor, the second DSG transistor, and the capacitor component are configured in stacking structure of a three dimensional (“3D”) layout.

10. The device of claim 9 , wherein the capacitor component is physically situated over the plurality of memory components in the 3D layout.

11. A nonvolatile memory system capable of storing data comprising multiple sets of the plurality of memory components structured in 3D layout of claim 10 .

12. A memory device able to store information, comprising:

a plurality of non-volatile memory (“NVM”) components able to store information persistently, the plurality of NVM components is organized in a string and are interconnected between source terminals and drain terminals;

a drain select gate (“DSG”) transistor having a source terminal, a drain terminal, and a gate terminal, the drain terminal of the DSG transistor connected to the source terminal of the plurality of NVM components, the gate terminal of the DSG transistor connected to a DSG signal; and

a capacitor component having a source terminal, a drain terminal, and a gate terminal, wherein the capacitor component is physically situated adjacent to the string, and the drain terminal of the capacitor is physically connected to the source terminal of the first DSG transistor and the source terminal the capacitor is electrically coupled to a bit line, wherein the capacitor component is configured to perform a dynamic random-access memory (“DRAM”) function.

13. The device of claim 12 , further comprising a second DSG transistor having a source terminal, a drain terminal, and a gate terminal, the draining terminal of the second DSG transistor coupled to the source terminal of the capacitor component.

14. The device of claim 13 , further comprising a source select gate (“SSG”) component having a source terminal, a drain terminal, and a gate terminal, the source terminal of the SSG component coupled to a drain terminal of one of the plurality of memory components organized in the string.

15. The device of claim 14 , wherein the gate terminal the SSG component is coupled to an SSG signal, and the drain terminal of the SSG component is coupled to a source line.

16. The device of claim 14 , wherein the gate terminal the second DSG transistor is coupled to a DSG signal, and the source terminal of the second DSG transistor is coupled to a bit line.

17. The device of claim 16 , wherein the plurality of NVM components is NAND based flash memory.

18. The device of claim 14 , wherein each gate terminal of the plurality of NVM components is coupled to a unique word line.

19. The device of claim 12 , wherein the plurality of NVM components is Silicon-Oxide-Nitride-Oxide-Silicon (“SONOS”) based nonvolatile memory storages.

20. The device of claim 14 , wherein the plurality of NVM components, the first DSG transistor, the second DSG transistor, and the capacitor component are configured in stacking structure of a three dimensional (“3D”) layout.

21. The device of claim 20 , wherein the capacitor component is physically situated over the plurality of NVM components in the 3D layout.

22. A nonvolatile memory system capable of storing data comprising multiple sets of the plurality of NVM components structured in 3D layout of claim 12 .

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 14, 2016
From: HSU, FU-CHANG
To: NEO SEMICONDUCTOR, INC.
Reel/Frame 037496/0202 →
Continuity (6)
Continuation In Part 14846673 · Sep 4, 2015
Provisional Application 62068693 · Oct 26, 2014
Provisional Application 62424614 · Oct 16, 2015
Provisional Application 62137242 · Mar 24, 2015
Provisional Application 62046902 · Sep 6, 2014
Related Publication 20160071591A1 · Mar 10, 2016
Cited By (1)
US 12,707,651