Embedded SiGe epitaxy test pad
View Patent ↗Techniques for measuring and testing a semiconductor wafer during semiconductor device fabrication include designating a test area on the top surface of the wafer and etching a first rectangular trench and a second rectangular trench on the top surface of the wafer in the test area. The trenches are oriented such that a length of the first trench is perpendicular to a length of the second trench, and positioned such that the length of the first trench, if extended, intersects the length of the second trench. A silicon-germanium compound is deposited into the first trench and the second trench, and a test pad is removed from the test area of the wafer. The test pad includes a side surface where both the first trench and the second trench are exposed. The side surface of the test pad is scanned with a transmission electron microscope to take measurements of the silicon-germanium.
1. A test pad cut from a semiconductor wafer for measuring and testing the semiconductor wafer during semiconductor device fabrication, the test pad comprising:
a first rectangular trench and a second rectangular trench on a top surface of the test pad, wherein the first rectangular trench is spaced apart from the second rectangular trench on the top surface by at least one shallow isolation area, and wherein the first rectangular trench comprises a first side and a second side such that the first side is shorter than the second side, and the second rectangular trench comprises a first side and a second side such that the first side of the second rectangular trench is shorter than the second side of the first rectangular trench, wherein the second side of the first rectangular trench is perpendicular to e the second side of the second rectangular trench such that the second side of the first rectangular trench, if extended, intersects the second side of the second rectangular trench; and
a side surface that exposes both the first rectangular trench and the second rectangular trench.
2. The test pad of claim 1 , wherein the first rectangular trench has a connected trench structure such that a rectangular shaped trench on the top surface and the side surface are connected to form a right angle in the connected trench structure.
3. The test pad of claim 1 , wherein the first rectangular trench and the second rectangular trench are separated by a shallow trench isolation area.
4. The test pad of claim 1 , wherein a width of the first rectangular trench is equal to a width of the second rectangular trench.
5. The test pad of claim 1 , further comprising:
a third rectangular trench on the top surface of the test pad that is parallel to the first rectangular trench and has a width that is different from a width of the first rectangular trench.
6. The test pad of claim 5 , wherein the width of the third rectangular trench is aligned with the width of the first rectangular trench.
7. The test pad of claim 5 , wherein a length of the third rectangular trench is equal to the length of the first rectangular trench.
8. The test pad of claim 1 , further comprising:
a plurality of additional rectangular trenches on the top surface of the test pad that are parallel to the first rectangular trench and gradually varied in width.
9. The test pad of claim 8 , wherein the plurality of additional rectangular trenches are evenly spaced apart.
10. The test pad of claim 1 , further comprising:
a layer of silicon-germanium in the first rectangular trench and the second rectangular trench that is deposited by epitaxy.