Metal FinFET anti-fuse
Semiconductor structures containing FinFET anti-fuses with reduced breakdown voltage are provided which can be readily integrated with high performance FinFETs. The anti-fuse includes at least one metal structure having a faceted sidewall. The sharp corner of the faceted sidewall of the at least one metal structure causes an electric field concentration, thus reducing the breakdown voltage of the anti-fuse.
1. A semiconductor structure comprising:
a gate structure located on a substrate;
an anti-fuse located on said substrate and on a first side of said gate structure, said anti-fuse comprising a metal structure having a faceted sidewall that is present along a lower portion of said first side of said gate structure; and
a dielectric structure located on said substrate and on a second side of said gate structure, wherein second side of said gate structure is opposite said first side of said gate structure.
2. The semiconductor structure of claim 1 , wherein said dielectric structure, said metal structure and said gate structure have topmost surfaces that are coplanar with each other.
3. The semiconductor structure of claim 2 , wherein said dielectric structure, said metal structure and said gate structure have bottommost surfaces that are coplanar with each other.
4. The semiconductor structure of claim 1 , further comprising a dielectric spacer located along an upper portion of said first and second sides of said gate structure.
5. A semiconductor structure comprising:
an anti-fuse located on a substrate, said anti-fuse comprising at first metal structure having a faceted sidewall and located on a first portion of the substrate, and a second metal structure having a faceted sidewall located on another portion of said substrate.
6. The semiconductor structure of claim 5 , wherein said faceted sidewall of said first metal structure is spaced apart from said faceted sidewall of said second metal structure.
7. The semiconductor structure of claim 6 , wherein a dielectric structure is present between said first metal structure and said second metal structure, said dielectric structure comprising an upper portion, a middle portion, and a lower portion, wherein said middle portion of said dielectric structure is located between said faceted sidewall of said first metal structure and said faceted sidewall of said second metal structure.
8. The semiconductor structure of claim 7 , further comprising a dielectric spacer located on sidewall surfaces of said upper portion of said dielectric structure.
9. The semiconductor structure of claim 8 , further comprising planarized dielectric material portions having a topmost surface that is coplanar with a topmost surface of each of said dielectric spacers, said upper portion of said dielectric structure, said first metal structure, and said second metal structure.
10. The semiconductor structure of claim 6 , wherein a gate structure is present between said first metal structure and said second metal structure, said gate structure comprising a gate dielectric material portion and a gate conductor portion.
11. The semiconductor structure of claim 10 , wherein said gate dielectric material portion is located on said faceted sidewall of said first metal structure and said faceted sidewall of said second metal structure, and wherein said gate dielectric material portion located on said faceted sidewall of said first metal structure is spaced apart from said gate dielectric material portion located on said faceted sidewall of said second metal structure.
12. The semiconductor structure of claim 10 , wherein said gate dielectric material portion is located on said faceted sidewall of said first metal structure and said faceted sidewall of said second metal structure, and wherein said gate dielectric material portion located on said faceted sidewall of said first metal structure is in direct physical contact with said gate dielectric material portion located on said faceted sidewall of said second metal structure.