Display apparatus and method of manufacturing the same

1. A method of manufacturing a display apparatus, the method comprising:

disposing a plurality of light-emitting diodes of an emission layer of the display apparatus spaced apart from each other at a first spacing on a carrier substrate;

connecting the plurality of light-emitting diodes spaced apart from each other at the first spacing by forming an elongation member of the emission layer between adjacent light-emitting diodes and in contact with side surfaces of the adjacent light-emitting diodes, on the carrier substrate;

separating the carrier substrate from the plurality of light-emitting diodes and from the elongation member between and in contact with the side surfaces of the adjacent light-emitting diodes;

elongating the elongation member between and in contact with the adjacent light-emitting diodes to dispose the plurality of light-emitting diodes spaced apart from each other at a second spacing different from the first spacing,

the elongated elongation member between adjacent light-emitting diodes spaced apart from each other at the second spacing being maintained contacting side surfaces of each of the adjacent light-emitting diodes spaced apart from each other at the second spacing and connecting the plurality of light-emitting diodes spaced apart from each other at the second spacing to each other, and

transferring the elongated elongation member between and maintained contacting the side surfaces of each of the adjacent light-emitting diodes spaced apart from each other at the second spacing and the plurality of light-emitting diodes connected to each other thereby onto a display substrate of the display apparatus.

2. The method of claim 1 , wherein the forming the elongation member comprises filling an elastic material between the plurality of light-emitting diodes to fix the plurality of light-emitting diodes on the carrier substrate.

3. The method of claim 1 , wherein

the elongated elongation member transferred onto the display substrate defines a pixel separation member of the emission layer.

4. The method of claim 1 , wherein the elongation member has a light blocking property.

5. The method of claim 1 , wherein

the display substrate comprises:

a substrate,

a first electrode on the substrate,

a planarization layer which is between the substrate and the first electrode and in which a via hole is defined, and

a thin-film transistor between the substrate and the planarization layer, and

the method further comprises electrically connecting the first electrode to the thin-film transistor through the via hole defined in the planarization layer, and

the transferring the plurality of light-emitting diodes comprises overlapping the plurality of light-emitting diodes at the second spacing with the first electrode on the substrate of the display substrate.

6. The method of claim 5 , wherein

each of the light-emitting diodes comprises:

a first semiconductor layer,

a second semiconductor layer, and

an intermediate layer between the first semiconductor layer and the second semiconductor layer, and

the method further comprises disposing a first electrode pad of the emission layer, under the first semiconductor layer and in contact with the first electrode of the display substrate.

7. The method of claim 6 , further comprising:

disposing a second electrode on the emission layer, and

disposing a second electrode pad of the emission layer, on the second semiconductor layer and in contact with the second electrode.

8. The method of claim 7 , wherein the disposing the second electrode comprises disposing the second electrode on an entirety of the emission layer.

9. The method of claim 6 , further comprising:

disposing a second electrode on the substrate to dispose the planarization layer between the substrate and the second electrode, wherein the second electrode is spaced apart from the first electrode, and

disposing a second electrode pad of the emission layer, under the second semiconductor layer and in contact with the second electrode.

10. The method of claim 9 , further comprising exposing the second semiconductor layer from the first semiconductor layer and the intermediate layer by removing a portion of the first semiconductor layer and the intermediate layer,

wherein in the disposing the second electrode,

the second electrode pad is disposed under the exposed portion of the second semiconductor layer, and

the second electrode pad is at a same side of the light-emitting diodes as the first electrode pad.

11. A method of manufacturing a display apparatus, the method comprising:

disposing a plurality of light-emitting diodes of an emission layer of the display apparatus spaced apart from each other on a carrier substrate, the plurality of light-emitting diodes spaced apart from each other by a first spacing;

forming an elongation member of the emission layer, on the carrier substrate, to dispose portions of the elongation member between adjacent light-emitting diodes and in contact with side surfaces of the adjacent light-emitting diodes, the portions of the elongation member spaced apart from each other at a third spacing defined by a width of a light-emitting diode therebetween along the carrier substrate;

separating the carrier substrate from the plurality of light-emitting diodes and from the portions of the elongation member between and in contact with the adjacent light-emitting diodes;

elongating the elongation member to maintain the portions thereof between and in contact with the adjacent light-emitting diodes and spaced apart from each other at the third spacing defined by the width of a light-emitting diode therebetween along the carrier substrate, and

with the portions of the elongated elongation member maintained spaced apart from each other at the third spacing defined by the width of a light-emitting diode therebetween along the carrier substrate, transferring the plurality of light-emitting diodes in contact with the portions of the elongated elongation member onto a display substrate of the display apparatus.