IP Library › Granted Patent US 10,008,651
Granted Patent B2
US 10,008,651 · App. 15/267,146 · Granted Jun 26, 2018

Light emitting device and wiring board thereof

Inventor: Masato Ono (Sagamihara, JP)
Assignee: NICHIA CORPORATION
H01L33/62H01L25/0753H01L33/486H05K1/181H01L2224/48465H01L2224/49113H05K2201/10106H05K2203/048H05K2203/049H05K2203/1173Y02P70/611
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Quick Facts
Patent No.
US 10,008,651
App. No.
15/267,146
Granted
Jun 26, 2018
Kind
B2
Abstract

A first conductive pattern is disposed on a substrate. A first conductive pattern includes a first element mount portion and a first wire connection portion. A second conductive pattern is disposed on the substrate to be spaced apart from the first conductive pattern. The second conductive pattern includes a second element mount portion and a groove. The second element mount portion has a first side, a second side substantially orthogonal to the first side, and a third side substantially orthogonal to the first side and substantially parallel to the second side. The groove extends substantially parallel to the first side. A rectangular first light emitting element is disposed on the first element mount portion. A rectangular second light emitting element is disposed on the second element mount portion adjacent to the first light emitting element. A wire connects the second light emitting element to the first wire connection portion.

Claims (33)

1. A light emitting device comprising:

a substrate;

a first conductive pattern disposed on the substrate and comprising:

a first element mount portion; and

a first wire connection portion;

a second conductive pattern disposed on the substrate to be spaced apart from the first conductive pattern and comprising:

a second element mount portion having a first side, a second side substantially orthogonal to the first side, and a third side substantially orthogonal to the first side and substantially parallel to the second side; and

a groove extending substantially parallel to the first side and connected to the second side or the third side;

a rectangular first light emitting element disposed on the first element mount portion;

a rectangular second light emitting element disposed on the second element mount portion adjacent to the first light emitting element; and

a wire connecting the second light emitting element to the first wire connection portion.

2. The light emitting device according to claim 1 , wherein the second light emitting clement is surrounded by the first side, the second side, the third side, and the groove.

3. The light emitting device according to claim 1 , wherein the first wire connection portion is disposed to sandwich the second side and the third side.

4. The light emitting device according to claim 1 , wherein the second side, the third side, and the groove have lengths which are not less than one-fourth of lengths of opposite sides of the second light emitting element to the second side, the third side, and the groove.

5. The light emitting device according to claim 1 , wherein the second light emitting element includes a pad portion and an auxiliary electrode portion on an upper surface of the second light emitting element, and wherein the wire is laid over the auxiliary electrode portion to connect the pad portion to the first wire connection portion.

6. The light emitting device according to claim 5 , wherein the wire is laid on the first wire connection portion at an angle of 45 degrees or 90 degrees relative to an arrangement direction of the first light emitting element and the second light emitting element on the substrate.

7. A wiring board comprising:

a substrate;

a first conductive pattern disposed on the substrate and comprising:

a first element mount portion; and

a first wire connection portion; and

a second conductive pattern. disposed on the substrate to be spaced apart from the first conductive pattern and comprising:

a second element mount portion having a first side, a second side substantially orthogonal to the first side, and a third side substantially orthogonal to the first side and substantially parallel to the second side; and

a groove extending substantially parallel to the first side and connected to the second side or the third side.

8. The wiring board according to claim 7 , wherein the first wire connection portion is disposed to sandwich the second side and the third side.

9. The light emitting device according to claim 1 , wherein the first light emitting element and the second light emitting element are to emit light in an ultraviolet region having a light emission peak wavelength of not more than 400 nm.

10. The light emitting device according to claim 1 ,

wherein the first light emitting element and the first element mount portion are electrically connected to each other via a first conductive bonding material, and

wherein the second light emitting element and the second element mount portion are electrically connected to each other via a second conductive bonding material.

11. The light emitting device according to claim 1 , wherein the substrate includes a notch provided in at least one of four corners of the substrate.

12. The wiring board according to claim 7 , wherein the substrate includes a notch provided in at least one of four corners of the substrate.

13. The light emitting device according to claim 1 , wherein the substrate includes at least one screw hole.

14. The wiring board according to claim 7 , wherein the substrate includes at least one screw hole.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 16, 2016
From: ONO, MASATO
To: NICHIA CORPORATION
Reel/Frame 039761/0393 →
Priority Claims (1)
JP 2015-187492 · Sep 24, 2015 · national
Continuity (1)
Related Publication 20170092827A1 · Mar 30, 2017