Organic light emitting diode package structure

1. An organic light emitting diode (OLED) package structure, comprising:

a first structure layer;

a second structure layer; and

a luminous layer disposed between the first structure layer and the second structure layer,

wherein two recesses are formed by bending two respective opposite ends of the first structure layer, and wherein end sections of the second structure layer and the luminous layer are located in the two recesses; and

wherein one of the first structure layer and the second structure layer is a substrate base layer, and the other is a package layer;

wherein a sealant is disposed in the recesses; and

wherein a desiccant layer is disposed in the recesses, wherein the desiccant layer is located between the sealant and the luminous layer, so the sealant and the luminous layer are spaced apart from each other.

2. The OLED package structure as claimed in claim 1 , wherein the first structure layer comprises rounded curving structures located on the two ends thereof, an end section of each the bending structure is bent to be a rounded surface, and each of the two recesses is bounded by the bending structure and the curving structure.

3. The OLED package structure as claimed in claim 1 , wherein the substrate base layer is selected from the group consisting of glass, an organic thin film, an inorganic thin film, and a metal foil.

4. The OLED package structure as claimed in claim 1 , wherein the package layer is selected from the group consisting of glass, an organic thin film, an inorganic thin film, and a metal foil.

5. An organic light emitting diode (OLED) package structure, comprising:

a first structure layer;

a second structure layer; and

a luminous layer disposed between the first structure layer and the second structure layer,

wherein two recesses are formed by bending two respective opposite ends of the first structure layer, and end sections of the second structure layer and the luminous layer are located in the two recesses;

one of the first structure layer and the second structure layer is a substrate base layer, and the other is a package layer;

a sealant for sealing is disposed in the recesses;

a desiccant layer is disposed in the recesses, and the desiccant layer is located between the sealant and the luminous layer, so the sealant and the luminous layer are spaced apart from each other; and

the first structure layer comprises rounded curving structures located on the two ends thereof, an end section of each the bending structure is bent to be a rounded surface, and each of the two recesses is bounded by the bending structure and the curving structure.

6. An organic light emitting diode (OLED) package structure, comprising:

a first structure layer;

a second structure layer; and

a luminous layer disposed between the first structure layer and the second structure layer,

wherein two respective opposite ends of the first structure layer include two recesses, and wherein end sections of the second structure layer and the luminous layer are located in the two recesses; and

wherein one of the first structure layer and the second structure layer is a substrate base layer, and the other is a package layer;

wherein the two ends of the first structure layer include a first bending section and second bending section, and each of the two recesses is bounded by the first bending section, the second bending section, and the first structure layer near the first bending section; and

two ends of the second structure layer include a first solid section, a second solid section, a third solid section, and a fourth solid section; the first solid section and the second solid section abut against a mounting slot of the first structure layer, and a restraining slot is defined by the second solid section, wherein the third solid section, and the fourth solid section, and the second bending section are located in the restraining slot.

7. The OLED package structure as claimed in claim 6 , wherein a sealant is disposed in the restraining slot.