Planarized extreme ultraviolet lithography blank with absorber and manufacturing system therefor
An extreme ultraviolet (EUV) mask blank production system includes: a substrate handling vacuum chamber for creating a vacuum; a substrate handling platform, in the vacuum, for transporting an ultra-low expansion substrate loaded in the substrate handling vacuum chamber; and multiple sub-chambers, accessed by the substrate handling platform, for forming an EUV mask blank includes: a first sub-chamber for forming a multi-layer stack, above the ultra-low expansion substrate, for reflecting an extreme ultraviolet (EUV) light; and a second sub-chamber for forming a bi-layer absorber, formed above the multi-layer stack, for absorbing the EUV light at a wavelength of 13.5 nm provides a reflectivity of less than 1.9%.
1. An extreme ultraviolet lithography system comprising:
an extreme ultraviolet light source which produces extreme ultraviolet (EUV) light; a reticle which reflects the EUV light, the reticle including an ultra-low expansion substrate including surface imperfections; a planarization layer on the ultra-low expansion substrate encapsulating the surface imperfections; a multi-layer stack over the planarization layer; and a bi-layer absorber over the multi-layer stack including a primary absorber layer and a secondary absorber layer having a combined thickness of from 25.6 nm to 32.5 nm, the primary absorber layer having a thickness that provides a reflectivity of less than 1.9% at a wavelength of 13.5 nm.
2. The system as claimed in claim 1 , the reticle further comprising a capping layer formed on the multi-layer stack and the bi-layer absorber formed on the capping layer, the capping layer protecting the multi-layer stack.
3. The system as claimed in claim 1 , wherein the thickness of the primary absorber layer is in a range of 22.4 nm to 28.9 nm.
4. The system as claimed in claim 1 , wherein the thickness of the secondary absorber layer is in a range of 2 nm to 4.7 nm.
5. The system as claimed in claim 1 , the reticle further comprising an additional multi-layer stack formed directly on the planarization layer, wherein the additional multi-layer stack includes up to 60 of the multi-layer stack formed in a vertical stack.
6. The system as claimed in claim 1 wherein the bi-layer absorber includes a primary absorber layer of Tin (Sn), Platinum (Pt), Silver (Ag), Iridium (In), or Nickel (Ni).
7. The system as claimed in claim 1 wherein the bi-layer absorber includes a secondary absorber layer of Nickel (Ni), Zinc (Zn), Antimony (Sb), Chromium (Cr), Copper (Cu), Tantalum (Ta), or Tellurium (Te) on the primary absorber layer.
8. The system as claimed in claim 1 wherein the bi-layer absorber includes a primary absorber layer of Silver (Ag) and a secondary absorber layer of Nickel (Ni).
9. The system as claimed in claim 1 wherein the bi-layer absorber includes a primary absorber layer of Platinum (Pt) and a secondary absorber layer of Zinc (Zn).
10. The system as claimed in claim 1 wherein the bi-layer absorber includes a primary absorber layer of Iridium (In) and a secondary absorber layer of Tellurium (Te).
11. A method of manufacturing an extreme ultraviolet reflective element comprising:
providing an ultra-low expansion substrate including surface imperfections;
forming a planarization layer on the ultra-low expansion substrate to encapsulate the surface imperfections;
forming a multilayer stack on the planarization layer, the multilayer stack including a plurality of reflective layer pairs; and
forming a bi-layer absorber over the multilayer stack including a primary absorber layer and a secondary absorber layer having a combined thickness of from 25.6 nm to 32.5 nm, the primary absorber layer having a thickness that provides a reflectivity of less than 1.9% at a wavelength of 13.5 nm.
12. The method of claim 11 , further comprising forming a capping layer on the multi-layer stack and the bi-layer absorber formed on the capping layer, the capping layer protecting the multi-layer stack.
13. The method as claimed in claim 11 wherein the thickness of the primary absorber layer is in a range of 22.4 nm to 28.9 nm.
14. The method of claim 11 , wherein the thickness of the secondary absorber layer is in a range of 2 nm to 4.7 nm.
15. The method of claim 11 , further comprising forming an additional multi-layer stack directly on the planarization layer, wherein the additional multi-layer stack includes up to 60 of the multi-layer stack formed in a vertical stack.
16. The method as claimed in claim 11 wherein the bi-layer absorber includes a primary absorber layer of Tin (Sn), Platinum (Pt), Silver (Ag), Indium (In), or Nickel (Ni).
17. The method as claimed in claim 11 wherein the bi-layer absorber includes a secondary absorber layer of Nickel (Ni), Zinc (Zn), Antimony (Sb), Chromium (Cr), Copper (Cu), Tantalum (Ta), or Tellurium (Te) on the primary absorber layer.
18. The method as claimed in claim 11 wherein the bi-layer absorber includes a primary absorber layer of Silver (Ag) and a secondary absorber layer of Nickel (Ni).
19. The method as claimed in claim 10 wherein the bi-layer absorber includes a primary absorber layer of Platinum (Pt) and a secondary absorber layer of Zinc (Zn).
20. The method as claimed in claim 10 wherein the bi-layer absorber includes a primary absorber layer of Indium (In) and a secondary absorber layer of Tellurium (Te).