Methods for fabricating metal gate structures
One aspect of the present disclosure is a method of fabricating metal gate by forming a silicon-nitride layer (SiN) over a dummy gate at a second metal gate type transistor region (e.g. NMOS) avoid dummy gate loss during a CMP process for a PMOS gate. The method can comprise after performing a patterning process to remove hard masks at PMOS and NMOS regions, forming a SiN layer over the NMOS region; performing a patterning process to open the PMOS region and filling gate materials in the PMOS region; performing a CMP to polish a top surface of PMOS such that the polishing stops at SiN. In this way, dummy gate loss can be reduced during the first aluminum CMP step and thus can reduce initial height of dummy gate as compared to the convention method, and improve the filling process of the dummy gate as compared to the conventional method.
1. A method for fabricating metal gates for a semiconductor device, the method comprising:
providing a substrate; and
providing a first metal gate type transistor region and a second metal gate type transistor region on the substrate, wherein each of the first metal gate type transistor region and second metal gate type transistor region comprise a dummy gate;
providing a zero order interlayer dielectric layer (ILD 0 layer) around the first metal gate type transistor region and the second metal gate type transistor region;
forming a hard mask layer over the ILD 0 layer;
performing a patterning processing to remove portion of the hard mask layer to reveal dummy gates at the first metal gate type transistor region and the second metal gate type transistor region;
forming a silicon-nitride (SiN) layer over the dummy gate at the second metal gate type transistor region;
performing a patterning process to remove the dummy gate in the first metal gate type transistor region and to form a first metal gate in the first metal gate type transistor region, the first metal gate being of the first metal gate type;
performing a first chemical mechanical polishing (CMP) process to polish the first metal gate in the first metal gate type transistor region such that the polishing by the CMP process stops at the SiN layer; and
removing the SiN layer.
2. The method of claim 1 , wherein the first metal gate type is PMOS, and the second metal gate type is NMOS.
3. The method of claim 1 , wherein the first metal gate type is NMOS, and the second metal gate type is PMOS.
4. The method of claim 1 , further comprising:
forming a hard mask layer over the ILD 0 layer after the first layer is removed
performing a patterning process to remove the dummy gate in the second metal gate type transistor region and to form a second metal gate in the second metal gate type transistor region, the second metal gate being of the second metal gate type;
performing a chemical mechanical polishing (CMP) process to polish the second metal gate in the second metal gate type transistor region, wherein the CMP process comprises removing the hard mask layer.
5. The method of claim 1 , wherein the hard mask layer comprises titanium nitride (TiN).
6. The method of claim 1 , wherein the thickness of the SiN layer is at least 100 Angstroms.
7. The method of claim 1 , wherein the SiN layer is removed using a dry etching process.