IP Library › Assignment 072141/0132
Patent Assignment
Reel/Frame 072141/0132

Assignment of Assignor's Interest

Recorded: 2025-09-03 Pages: 7
Assignor
Assignee
SHANGHAI HUALI INTEGRATED CIRCUIT CORPORATION
NO.6, LIANGTENG RD., PUDONG DISTRICT, SHANGHAI, 201314, CHINA
Covered Properties (18)
Method for Inhibiting the Electric Crosstalk of Back Illuminated Cmos Image Sensor
Patent: 9,123,619 →
Application: 14/098,017 →
Publication: US 2014/0302630
Method of Forming Strained Source and Drain Regions in a P-Type Finfet Structure
Patent: 8,987,101 →
Application: 14/040,736 →
Publication: US 2014/0357041
Method of Removing Dummy Gate Dielectric Layer
Patent: 9,570,582 →
Application: 15/235,208 →
Method of Manufacturing a Dual-Gate Finfet
Patent: 9,680,023 →
Application: 15/235,124 →
Method for Avoiding Il Regrown in a Hkmg Process
Application: 15/429,192 →
Publication: US 2018/0175157
Fabrication Technology for Metal Gate
Application: 15/429,195 →
Publication: US 2018/0174924
Integration Process of Finfet Spacer Formation
Application: 15/429,193 →
Publication: US 2018/0175169
Methods for Fabricating Metal Gate Structures
Application: 15/429,188 →
Publication: US 2018/0174923
High Pressure Low Thermal Budge High-K Post Annealing Process
Application: 15/429,191 →
Publication: US 2018/0174848
Method for Manufacturing a Metal Gate
Application: 15/944,800 →
Publication: US 2019/0189451
Silicon-On-Insulator Structure Having Bipolar Stress, and Manufacturing Method Therefor
Application: 15/981,921 →
Publication: US 2019/0304998
Method for Optimizing a Critical Dimension for Double Patterning for NAND Flash
Application: 16/684,918 →
Publication: US 2021/0020440
Gate Structure and Photomask of Nand Memory and Method for Making the Same
Application: 16/837,961 →
Publication: US 2021/0193810
Method for Fabricating Word Lines of NAND Memory and NAND Memory Comprising Word Lines Fabricated by Adopting the Same
Application: 16/874,209 →
Publication: US 2020/0402842
Method for Making Active Area Air Gap
Application: 18/152,868 →
Publication: US 2023/0164992
Method for Manufacturing Gate of Nand Flash
Application: 18/152,870 →
Publication: US 2023/0170392
Method for Forming Mixed Substrate
Application: 18/221,976 →
Publication: US 2024/0186140
Method of Making Nand Flash Memory
Application: 18/885,259 →
Related Assignments (18)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 30, 2013
From: DING, YI; ZHANG, MINGHUA; FANG, JINGXUN; YAN, JUNHUA
To: SHANGHAI HUALI MICROELECTRONICS CORPORATION
Reel/Frame 031304/0427 →
Assignment of Assignor's Interest Feb 12, 2014
From: TIAN, ZHI; JIN, QUIMIN
To: SHANGHAI HUALI MICROELECTRONICS CORPORATION
Reel/Frame 032201/0078 →
Assignment of Assignor's Interest Dec 22, 2016
From: BAO, YU; ZHOU, XIAOQIANG; ZHOU, JUN; ZHONG, BIN
To: SHANGHAI HUALI MICROELECTRONICS CORPORATION
Reel/Frame 040740/0948 →
Assignment of Assignor's Interest Feb 12, 2017
From: YI, HAILAN; LEI, TONG; CHEN, YONGYUE
To: SHANGHAI HUALI MICROELECTRONICS CORPORATION
Reel/Frame 041232/0496 →
Assignment of Assignor's Interest Feb 12, 2017
From: LIU, YINGMING; BAO, YU; ZHOU, HAIFENG; FANG, JINGXUN
To: SHANGHAI HUALI MICROELECTRONICS CORPORATION
Reel/Frame 041232/0493 →
Assignment of Assignor's Interest Feb 12, 2017
From: WEN, ZHENPING
To: SHANGHAI HUALI MICROELECTRONICS CORPORATION
Reel/Frame 041232/0490 →
Assignment of Assignor's Interest Feb 12, 2017
From: BAO, YU
To: SHANGHAI HUALI MICROELECTRONICS CORPORATION
Reel/Frame 041232/0484 →
Assignment of Assignor's Interest Feb 13, 2017
From: LEI, TONG; CHEN, YONGYUE; ZHOU, HAIFENG
To: SHANGHAI HUALI MICROELECTRONICS CORPORATION
Reel/Frame 041232/0502 →
Assignment of Assignor's Interest Mar 21, 2017
From: BAO, YU
To: SHANGHAI HUALI MICROELECTRONICS CORPORATION
Reel/Frame 041649/0651 →
Assignment of Assignor's Interest Apr 4, 2018
From: HUANG, QIUMING
To: SHANGHAI HUALI MICROELECTRONICS CORPORATION
Reel/Frame 045439/0561 →
Assignment of Assignor's Interest May 17, 2018
From: MA, YANFEI; WANG, CHANGFENG; LIAO, DUANQUAN
To: SHANGHAI HUALI MICROELECTRONICS CORPORATION
Reel/Frame 045830/0215 →
Assignment of Assignor's Interest Nov 15, 2019
From: HE, LI; JU, XIAOHUA; HUANG, GUANQUN
To: SHANGHAI HUALI MICROELECTRONICS CORPORATION
Reel/Frame 051022/0391 →
Assignment of Assignor's Interest Apr 1, 2020
From: XU, PENGKAI; QIAO, FULONG; WANG, YI
To: SHANGHAI HUALI MICROELECTRONICS CORPORATION
Reel/Frame 052289/0971 →
Assignment of Assignor's Interest May 14, 2020
From: YAO, SHAOKANG; JU, XIAOHUA; HUANG, GUANQUN
To: SHANGHAI HUALI MICROELECTRONICS CORPORATION
Reel/Frame 052666/0040 →
Assignment of Assignor's Interest Jan 11, 2023
From: YAO, SHAOKANG; WANG, QIWEI; CHEN, HAOYU
To: SHANGHAI HUALI MICROELECTRONICS CORPORATION
Reel/Frame 062342/0043 →
Assignment of Assignor's Interest Jan 11, 2023
From: XU, PENGKAI; QIAO, FULONG
To: SHANGHAI HUALI MICROELECTRONICS CORPORATION
Reel/Frame 062342/0293 →
Assignment of Assignor's Interest Jul 14, 2023
From: WANG, TAO
To: SHANGHAI HUALI MICROELECTRONICS CORPORATION
Reel/Frame 064259/0400 →
Assignment of Assignor's Interest Sep 16, 2024
From: WU, YISHAN; YAO, SHAOKANG
To: SHANGHAI HUALI MICROELECTRONICS CORPORATION
Reel/Frame 068596/0925 →