Patent Assignment
Reel/Frame 064259/0400
Assignment of Assignor's Interest
Recorded: 2023-07-14
Pages: 3
Assignor
WANG, TAO
Executed: 2023-07-11
Assignee
SHANGHAI HUALI MICROELECTRONICS CORPORATION
NO. 6 LIANGTENG ROAD, PUDONG NEW AREA, SHANGHAI, 201314, CHINA
Covered Property
(1)
Method for Forming Mixed Substrate
Application:
18/221,976 →
Publication:
US 2024/0186140
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.