Method for manufacturing vertical type light emitting diode, vertical type light emitting diode, method for manufacturing ultraviolet ray light emitting diode, and ultraviolet ray light emitting diode
View Patent ↗A vertical type light emitting diode includes a nitride semiconductor having a p-n conjunction structure with a transparent material layer formed on a p type clad layer, the transparent material layer having a refractive index different from that of the p type clad layer and having a pattern structure of mesh, punched plate, or one-dimensional grid form, etc. A reflective metal electrode layer is formed on the transparent material layer as a p-electrode. A stereoscopic pattern is formed in the transparent material layer and the p-electrode deposited, and thereby forming the pattern in the p-electrode. Depositing the p-electrode on only 10 to 70% of the upper portion of the p type clad layer in an ultraviolet ray light emitting diode such that an area where the p type clad layer is exposed is wide increases the transmittance of ultraviolet rays through an area where the p-electrode is not deposited.
1. A method for manufacturing an ultraviolet light emitting diode based on a nitride semiconductor, the method comprising:
forming a nitride semiconductor layer in which an n-type clad layer, an active layer and a p-type clad layer are sequentially stacked;
forming an n-electrode on the n-type clad layer;
forming a p-electrode on an upper surface of the p-type clad layer such that the p-electrode is deposited on only 3% to 70% of an area of the upper surface of the p-type clad layer; and
forming a bonding pad on the p-electrode,
wherein the p-electrode is formed of one of ITO, ZnO, Ga 2 O 3 , SnO, CuO, Cu 2 O, AgO 2 and AgO,
wherein the p-electrode is formed as a plurality of non-parallel first p-electrode lines extending radially from the bonding pad and a plurality of second p-electrode lines extending across the first p-electrode lines, and
wherein a gap between first p-electrode lines increases radially with increased distance from the bonding pad.
2. The method of claim 1 , wherein a width of a portion of the p-electrode located adjacent to the bonding pad is formed to have a thicker width than that of a portion of the p-electrode located distal to the bonding pad.
3. The method of claim 1 , wherein the composition of materials forming the active layer is adjusted to emit light having a wavelength of 280 to 400 nm.
4. A method for manufacturing an ultraviolet light emitting diode based on a nitride semiconductor, the method comprising:
forming a nitride semiconductor layer in which an n-type clad layer, an active layer and a p-type clad layer are sequentially stacked;
forming an n-electrode on the n-type clad layer;
forming a p-electrode on an upper surface of the p-type clad layer such that the p-electrode is deposited on only 3% to 70% of an area of the upper surface of the p-type clad layer; and
forming a bonding pad on the p-electrode,
wherein the composition of materials forming the active layer is adjusted to emit light having a wavelength of 280 to 400 nm,
wherein the p-electrode is formed as a plurality of non-parallel first p-electrode lines extending radially from the bonding pad and a plurality of second p-electrode lines extending across the first p-electrode lines, and
wherein a gap between first p-electrode lines increases radially with increased distance from the bonding pad.
5. The method of claim 4 , wherein the p-electrode is formed of one of ITO, ZnO, Ga 2 O 3 , SnO, CuO, Cu 2 O, AgO 2 and AgO.
6. The method of claim 4 , wherein a width of a portion of the p-electrode located adjacent to the bonding pad is formed to have a thicker width than that of a portion of the p-electrode located distal to the bonding pad.