Structurally embedded and inhospitable environment systems and devices having autonomous electrical power sources

1. An embeddable integrated electrical package, comprising:

at least one electrically-driven component;

an electrical power source component configured to provide an electrical energy source for the at least one electrically-driven component, the electrical power source component comprising:

a first conductor, formed of a first conductive material and having a first surface and a second surface, the first surface of the first conductor facing away from a build surface and being conditioned to have a work function in a range of 1.0 electron volts (eV) or less,

a dielectric layer with a thickness of 200 angstroms or less formed over the conditioned first surface of the first conductor, and

a second conductor, formed of a second conductive material and having a first surface with a work function in a range of 2.0 eV or greater, and a second surface, arranged over the formed dielectric layer such that the first surface of the second conductor faces the dielectric layer,

the first conductor, the dielectric layer and the second conductor forming a layered structure of an electrical power source component element;

a first electrical lead and a second electrical lead electrically connecting the at least one electrically-driven component and the electrical power source component; and

an encasement for the at least one electrically-driven component and the electrical power source component forming a common outer shell to provide the embeddable integrated electrical package.

2. The embeddable integrated electrical package of claim 1 , a structure of the electrical power source component having an overall thickness in a range of less than 5 mils.

3. The embeddable integrated electrical package of claim 1 , the first surface of the first conductor being at least one of surface treated or surface conditioned to lower the work function of the first surface to be in the range of 1.0 eV or less.

4. The embeddable integrated electrical package of claim 1 , further comprising a separate material layer having a work function in the range of 1.0 eV or less arranged on the first surface of the first conductor.

5. The embeddable integrated electrical package of claim 4 , the separate material layer being formed to have a thickness in a range of 1 nm or less.

6. The embeddable integrated electrical package of claim 1 , the first conductor and the second conductor each having a thickness in a range of 10 nm or less.

7. The embeddable integrated electrical package of claim 1 , the conductive material from which the first conductor is formed being graphene.

8. The embeddable integrated electrical package of claim 1 , the dielectric layer having a thickness in a range of 100 angstroms or less and being sandwiched between the first surface of the first conductor and the first surface of the second conductor.

9. The embeddable integrated electrical package of claim 8 , the dielectric layer having a thickness in a range of 20 angstroms to 60 angstroms.

10. The embeddable integrated electrical package of claim 8 , the dielectric layer varying in thickness across a platform of the dielectric layer between the first surface of the first conductor and first surface of the second conductor.

11. The embeddable integrated electrical package of claim 1 , the dielectric layer being formed at least in part of a plurality of tapered shapes, each of the plurality of tapered shapes having a tapered structure in which a cross-sectional area of the each of the plurality of tapered shapes is comparatively larger at an end facing the first surface of the second conductor and comparatively smaller at an end facing the first surface of the first conductor.

12. The embeddable integrated electrical package of claim 1 , the dielectric layer being a porous layer, pores in the porous layer being filled at least in part with a metal cation.

13. The embeddable integrated electrical package of claim 1 , the electrical power source component being comprised of a plurality of electrical power source component elements and a plurality of insulating layers arranged in a stacked structure,

the plurality of electrical power source component elements being separated by the plurality of insulating layers in the stacked structure, and

the plurality of electrical power source component elements being electrically interconnected with one another.

14. The embeddable integrated electrical package of claim 13 , each of the plurality of insulating layers having a thickness of less than 10 μm.

15. The embeddable integrated electrical package of claim 13 , the electrical power source component further comprising an outer insulating layer substantially encasing the stacked structure.

16. The embeddable integrated electrical package of claim 13 , the first electrical lead being electrically connected to an uppermost electrical power source component element in the stacked structure and the second electrical lead being electrically connected to a lowermost electrical power source component element in the stacked structure.

17. The embeddable integrated electrical package of claim 1 , the embeddable integrated electrical package comprising an integral portion of a structural member.

18. The embeddable integrated electrical package of claim 17 , the structural member substantially fully encasing the embeddable integrated electrical package.

19. The embeddable integrated electrical package of claim 17 , the structural member being one of a portion of a building structure or a portion of a vehicle structure.

20. The embeddable integrated electrical package of claim 1 , the at least one electrically-driven component comprising one or more of an environmental sensor, a seismic sensor, a wireless communicating component, and a haptic alert/warning device.