Antimicrobial compositions for use in wound care products
Compositions having antimicrobial activity contain surface functionalized particles comprising an inorganic copper salt which has low water solubility. These types of inorganic salts may also be introduced in porous particles to yield antimicrobial compositions. The compositions may optionally comprise additional antimicrobial agents, salts with high water solubility, organic acids, salts of organic acids and their esters. The above compositions can be incorporated in a variety of wound care products to provide antimicrobial properties.
1. An antimicrobial wound care bandage product having a copper releasing composition comprising:
(a) copper releasing particles of a copper halide with water solubility at room temperature of less than about 100 mg/liter,
wherein the surfaces of said particles are modified by at least one functionalizing agent; and
(b) at least one material selected from an organic acid or a salt of an organic acid, and wherein the pH of the copper releasing composition is in the range between about 3 and about 6.
2. The antimicrobial wound care product as in claim 1 , wherein the said copper halide is cuprous iodide.
3. The antimicrobial wound care product as in claim 1 , wherein the average size of the said particles is below 1,000 nm.
4. The antimicrobial wound care product as in claim 1 , wherein the molecular weight of the said functionalization agent is at least 60.
5. The antimicrobial wound care product as in claim 1 , wherein the salt of the organic acid comprises a cation selected from the group consisting of lithium, sodium, potassium, calcium, copper, zinc and silver.
6. The antimicrobial wound care product as in claim 1 , wherein the composition further contains at least one of an additional antimicrobial agent, antibiotic, anti-fungal agent, anti-thrombogenic agent, anesthetic, anti-inflammatory agent, analgesic, anticancer agent, vasodilation substance, wound healing agent, angiogenic control agent, antipruritic agent, immune boosting agent and a nutrient.
7. An antimicrobial wound care bandage product having a copper releasing composition comprising:
(a) copper releasing particles containing CuI;
(b) an acid selected from at least one of hydroxy acid, amino acid, acetic acid, erythorbic acid, and hyaluronic acid;
(c) a material selected from at least one of a salt or an ester of an organic acid; and
(d) the pH of the composition in the range between about 3 and about 6.
8. An antimicrobial wound care bandage product having a copper releasing composition comprising:
copper-releasing particles containing copper halide with a water solubility at room temperature of less than about 100 mg/liter,
wherein the surfaces of the copper-releasing particles are modified by at least one functionalizing agent, and
wherein the pH of the said composition is between about 3 and about 6.
9. The antimicrobial wound care product as in claim 8 , wherein said halide is cuprous iodide.
10. The antimicrobial wound care product as in claim 7 , wherein the concentration of CuI in said product is at or below 5 weight %.
11. The antimicrobial wound care product as in claim 8 , wherein the concentration of copper halide in said product is at or below 5 weight %.