Photosensitive resin composition, wavelength conversion substrate and light emitting device

1. A photosensitive resin composition comprising:

a positive photosensitive resin having a photosensitive moiety that cleaves upon exposure to light; and

a wavelength conversion material dispersed in the photosensitive resin, wherein

the photosensitive resin and the wavelength conversion material meet the following (i) to (iv):

(i) the photosensitive moiety and a cleavage product of the photosensitive resin do not neutralize the wavelength conversion material;

(ii) the photosensitive moiety and the cleavage product do not induce hydrolysis of the wavelength conversion material;

(iii) HOMOs of the photosensitive moiety and the cleavage product are lower than a LUMO of the wavelength conversion material; and

(iv) LUMOs of the photosensitive moiety and the cleavage product are higher than a HOMO of the wavelength conversion material, excluding any combination of a chemically amplified photosensitive resin with an acidic photosensitive moiety or cleavage product and an acidic wavelength conversion material,

the photosensitive moiety and the cleavage product of the photosensitive resin are neutral, and

the photosensitive moiety of the photosensitive resin includes at least one selected from the group consisting of cyclobutane diimide, o-nitrobenzyl amide, o-nitrobenzyl ether, methyl phenyl carbonate, 1-benzyloxy-1-alkyl ethanol, and disilane structures.

2. The photosensitive resin composition according to claim 1 , wherein the photosensitive moiety of the photosensitive resin is a cyclobutane diimide structure.

3. The photosensitive resin composition according to claim 1 , wherein the wavelength conversion material has a proton-accepting or proton-donating group.

4. The photosensitive resin composition according to claim 1 , wherein the wavelength conversion material has a dehydration-condensable group.

5. The photosensitive resin composition according to claim 1 , wherein the wavelength conversion material has a coumarin or boron-dipyrromethene structure.

6. The photosensitive resin composition according to claim 1 , wherein the photosensitive resin has transparency for light of a visible spectrum.

7. The photosensitive resin composition according to claim 1 , further comprising a solvent that dissolves the photosensitive resin.

8. A wavelength conversion substrate comprising:

a substrate; and

a wavelength conversion unit provided on the substrate, wherein

the wavelength conversion unit is formed from a photosensitive resin composition according to claim 1 .

9. A light emitting device comprising:

a light source that emits excitation light; and

a wavelength conversion unit that absorbs the excitation light and emits light of a wavelength different from a wavelength of the excitation light, wherein

the wavelength conversion unit is formed from a photosensitive resin composition according to claim 1 .

10. The light emitting device according to claim 9 , wherein the light emitting device includes a wavelength conversion substrate including:

a substrate; and

the wavelength conversion unit provided on the substrate.

11. The light emitting device according to claim 10 , wherein the wavelength conversion substrate includes a structural body that abuts the wavelength conversion unit on at least one side thereof and reflects or diffuses the light emitted from the wavelength conversion unit.

12. The light emitting device according to claim 11 , wherein the structural body is formed from a material including a metallic material.

13. The light emitting device according to claim 9 , wherein the wavelength conversion unit exhibits an internal quantum yield for light emission of 80% or more.

14. The light emitting device according to claim 9 , wherein the wavelength conversion substrate includes multiple wavelength conversion units arranged in a matrix, and

the multiple wavelength conversion units have a density of 450 ppi or more.