High temperature dielectric materials, method of manufacture thereof and articles comprising the same
Disclosed herein is a dielectric composite comprising an organic polymer that has a glass transition temperature greater than or equal to about 250° C.; and a dielectric filler present in an amount effective to impart to the dielectric composite a dielectric constant that varies by less than 5% over a temperature range of 25° C. to 300° C., with an applied alternating electric field having a frequency of 10 4 Hz and a maximum operating electric field strength of at least 250 megavolt per meter. Disclosed herein too is a method of manufacturing the dielectric composite and articles that contain the dielectric composite.
1. A dielectric composite comprising:
an organic polymer that has a glass transition temperature greater than or equal to about 250° C.; where the organic polymer is a crosslinked polymer, and where the crosslinked polymer is crosslinked divinyltetramethyldisiloxane-bis(benzocyclobutene) having the structure (2):
and
a dielectric filler present in an amount effective to impart to the dielectric composite a dielectric constant that varies by less than 5% over a temperature range of 25° C. to 300° C., with an applied alternating electric field having a frequency of 10 4 Hz and a maximum operating electric field strength of at least 250 megavolt per meter.
2. The dielectric composite of claim 1 , where the dielectric filler is a metal oxide, a metal carbide, a metal oxycarbide, a metal nitride, a metal oxynitride, a metal boride, a metal borocarbide, a boronitride, a metal silicide, a metal iodide, a metal bromide, a metal sulfide, a metal selenide, a metal telluride, a metal fluoride, a metal borosilicide or a combination thereof.
3. The dielectric composite of claim 1 , where the dielectric filler is alumina, magnesia, zirconia, titania, antimony tin oxide, calcium copper titanate, lead titanate, lead magnesium titanate, barium neodymium titanate, lead zirconium titanate, strontium titanate, calcium titanate, boron nitride, hexagonal boron nitride, aluminum nitride, silicon nitride, silicon carbide, diamond of natural or synthetic origin, or a combination thereof.
4. The dielectric composite of claim 1 , where the dielectric filler is exfoliated hexagonal boron nitride and exfoliated boron nitride.
5. The dielectric composite of claim 1 , where the dielectric filler is present in the dielectric composite in an amount of 5 to 30 weight percent, based on the total weight of the dielectric composite.
6. The dielectric composite of claim 1 , where the organic polymer is used in amounts of 70 to 95 weight percent, based on a total weight of the dielectric composite.
7. The dielectric composite of claim 1 , wherein the maximum operating electric field strength is at least 350 megavolt per meter.
8. The dielectric composite of claim 1 , wherein the dielectric constant varies by less than 2% over a temperature range of 25° C. to 300° C., with an applied alternating electric field having a frequency of 10 4 Hz.
9. The dielectric composite of claim 1 , wherein the dielectric constant varies by less than 2% over a temperature range of 25° C. to 300° C., with an applied direct bias electric field of 50 megavolt per meter.
10. An article comprising the composite of claim 1 .
11. A method of manufacturing a dielectric composite comprising:
blending an organic polymer that has a glass transition temperature greater than or equal to about 250° C.; and a dielectric filler to produce the dielectric composite; where the dielectric filler is present in an amount effective to impart to the dielectric composite a dielectric constant that varies by less than 5% over a temperature range of 25° C. to 300° C., with an applied alternating electric field having a frequency of 10 4 Hz and a maximum operating electric field strength of at least 250 megavolt per meter; where the organic polymer is crosslinked divinyltetramethyldisiloxane-bis(benzocyclobutene) having the structure (2):
12. The method of claim 11 , where the dielectric filler is exfoliated boron nitride and/or exfoliated hexagonal boron nitride.
13. The method of claim 11 , where the blending comprises dry blending, solution blending and/or melt blending.
14. The method of claim 13 , further comprising molding the dielectric composite.
15. A capacitor comprising:
a first electrode;
a second electrode; and
a dielectric composite comprising an organic polymer that has a glass transition temperature greater than or equal to about 250° C.; and a dielectric filler present in an amount effective to impart to the dielectric composite a dielectric constant that varies by less than 5% over a temperature range of 25° C. to 300° C., with an applied alternating electric field having a frequency of 10 4 Hz and a maximum operating electric field strength of at least 250 megavolt per meter; and where the organic polymer is crosslinked divinyltetramethyldisiloxane-bis(benzocyclobutene) having the structure (2):
16. The capacitor of claim 15 , wherein the dielectric filler is exfoliated boron nitride and/or exfoliated hexagonal boron nitride.
17. The capacitor of claim 15 , wherein the dielectric composite has a concentration of boron nitride nanosheets in an amount of about 10% by volume.