Method of manufacturing light-emitting device

1. A method of manufacturing a light-emitting device, the method comprising:

disposing a circuit board including p- and n-electrodes on a surface of a substrate;

connecting a light-emitting element to the p- and n-electrodes of the circuit board via a conductor member;

forming protrusions on opposing sides of a gap between the p- and n-electrodes of the circuit hoard, in a plan view, the protrusions being located outside the light-emitting element;

dispensing an underfill to flow toward the light-emitting element by a capillary action through the gap between the p- and n-electrodes of the circuit board while contacting the protrusions; and

filling, by tire capillary action, a gap between the circuit board and the light-emitting element with the underfill reaching a bottom surface of the light-emitting element,

wherein the protrusions are located outside an area extending below the light-emitting element and above the circuit board.

2. The method according to claim 1 , further comprising:

disposing a phosphor layer on an upper surface of the light-emitting element.

3. The method according to claim 2 , wherein, in the plan view, the protrusions are located outside the phosphor layer.

4. The method according to claim 3 , further comprising:

disposing a bump on the bottom surface of the light-emitting element for electrically connecting the light-emitting element to the circuit board.

5. A method of manufacturing a light-emitting device that comprises a circuit board with p- and n-electrodes formed on a surface of a substrate and a light-emitting element connected to the p- and n-electrodes of the circuit board via a conductor member, the method comprising:

forming two protrusions facing each other on both sides of a gap between the p- and n-electrodes of the circuit board; and

dispensing an underfill at a position on an opposite side to the light-emitting element with respect to the two protrusions, allowing the dispensed underfill to flow toward the light-emitting element by a capillary action through the gap between the p- and n-electrodes of the circuit board while contacting the protrusions, and filling, by the capillary action, a gap between the circuit board and the light-emitting element with the underfill reaching a bottom of the light-emitting element,

wherein the protrusions are located outside an area extending below the light-emitting element and above the circuit board.

6. The method according to claim 5 , wherein the forming two protrusions comprises extending an end portion of the p- and n-electrodes above an upper surface of the p- and n-electrodes and away from the substrate such that the end portion of the p- and electrodes has a thickness more than remaining portions of the p- and n-electrodes.

7. The method according to claim 5 , wherein the forming two protrusions comprises extending the substrate above an upper surface of the p- and n-electrodes such that a portion of the substrate that protrudes from the gap between the p- and n-electrodes has a thickness more than remaining portions of the substrate.

8. The method according to claim 5 , wherein the light-emitting device comprises a Zener diode that is electrically connected to the light-emitting element, and

wherein the Zener diode is disposed off an extension line of the gap between the p- and n-electrodes of the circuit board.

9. The method according to claim 5 , further comprising:

disposing a bump in the area extending below the light-emitting element and above the circuit board, the bump electrically connecting the light-emitting element to the circuit board.

10. The method according to claim 5 , wherein the two protrusions comprise a portion of the p- and n-electrodes formed thicker than another portion thereof, or a portion of the substrate formed thicker than another portion thereof.

11. The method according to claim 5 , further comprising:

disposing a bump on the bottom of the light-emitting element for electrically connecting the light-emitting element to the circuit board.

12. The method according to claim 5 , further comprising:

disposing an annular dam on the p- and n-electrodes of the circuit board, the annular dam comprising a resin to surround the light-emitting element.

13. The method according to claim 5 , wherein the light-emitting device further comprises thereon a plate-shaped phosphor-containing a member or a phosphor sheet comprising a phosphor.

14. The method according to claim 5 , wherein the protrusions are located outside an entirety of the area extending below the light-emitting element and above the circuit board.

15. The method according to claim 5 , wherein, in a plan view, the protrusions are completely located outside the light-emitting element.

16. The method according to claim 5 , wherein, in a plan view, the protrusions are located outside the light-emitting element.

17. The method according to claim 5 , wherein the two protrusions comprise a dummy bump formed on the p- and n-electrodes.

18. The method according to claim 5 , further comprising:

disposing a phosphor layer on an upper surface of the light-emitting element.

19. The method according to claim 18 , further comprising:

disposing a bump on the bottom of the light-emitting element for electrically connecting the light-emitting element to the circuit board.

20. The method according to claim 18 , wherein, in a plan view, the protrusions are located outside the phosphor layer.