IP Library › Granted Patent US 10,028,378
Granted Patent B2
US 10,028,378 · App. 15/373,573 · Granted Jul 17, 2018

Suspension board with circuit and producing method thereof

Inventors: Hiroyuki Tanabe (Osaka, JP); Naohiro Terada (Osaka, JP); Yuu Sugimoto (Osaka, JP); Daisuke Yamauchi (Osaka, JP)
Assignee: NITTO DENKO CORPORATION
H05K1/05G11B5/4826G11B5/4853H05K1/11H05K1/18H05K3/4007H05K3/44G11B5/484H05K1/0278H05K1/0393H05K2201/10227
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Quick Facts
Patent No.
US 10,028,378
App. No.
15/373,573
Granted
Jul 17, 2018
Kind
B2
Abstract

A suspension board with circuit includes a metal supporting board, a base insulating layer disposed at one side in a thickness direction of the metal supporting board, and a conductor layer disposed at one side in the thickness direction of the base insulating layer and including a connecting terminal electrically connected to a slider. The base insulating layer has a terminal region, when projected in the thickness direction, overlapped with at least the connecting terminal and a circumferential region not overlapped with the terminal region and around the terminal region, and the thickness of the terminal region is thicker than that of the circumferential region.

Claims (28)

1. A suspension board with circuit comprising:

a metal supporting board, a base insulating layer disposed at one side in a thickness direction of the metal supporting board, and a conductor layer disposed at one side in the thickness direction of the base insulating layer and including a connecting terminal electrically connected to a slider, wherein:

the base insulating layer includes a first base insulating layer disposed at the one side in the thickness direction of the metal supporting board and a second base insulating layer covering the first base insulating layer and disposed at the one side in the thickness direction of the metal supporting board,

the base insulating layer has a terminal region, when projected in the thickness direction, overlapped with at least the connecting terminal and a circumferential region not overlapped with the terminal region and around the terminal region,

in an entire region of the base insulating layer, the conductor layer is not located between the first base insulating layer and the second base insulating layer, and

the thickness of the terminal region is thicker than that of the circumferential region.

2. The suspension board with circuit according to claim 1 , wherein

the terminal region includes

a first terminal region-insulating layer made of the first base insulating layer and disposed at the one side in the thickness direction of the metal supporting board and

a second terminal region-insulating layer made of the second base insulating layer and disposed at one side in the thickness direction of the first terminal region-insulating layer; and

the circumferential region includes at least a second circumferential region-insulating layer made of the second base insulating layer and disposed at the one side in the thickness direction of the metal supporting board.

3. The suspension board with circuit according to claim 2 further comprising:

a cover insulating layer covering the conductor layer so as to expose the connecting terminal and disposed at the one side in the thickness direction of the base insulating layer and a pedestal supporting the slider, wherein

the pedestal includes

a first base pedestal layer made of the first base insulating layer and disposed at the one side in the thickness direction of the metal supporting board,

a second base pedestal layer made of the second base insulating layer and disposed at one side in the thickness direction of the first base pedestal layer, and

a cover pedestal layer made of the cover insulating layer and disposed at one side in the thickness direction of the second base pedestal layer.

4. The suspension board with circuit according to claim 1 , wherein

the terminal region includes

a first terminal region-insulating layer made of the first base insulating layer and disposed at the one side in the thickness direction of the metal supporting board and

a second terminal region-insulating layer made of the second base insulating layer and disposed at one side in the thickness direction of the first terminal region-insulating layer; and

the circumferential region includes at least a first circumferential region-insulating layer made of the first base insulating layer and disposed at the one side in the thickness direction of the metal supporting board.

5. The suspension board with circuit according to claim 4 further comprising:

a cover insulating layer covering the conductor layer so as to expose the connecting terminal and disposed at the one side in the thickness direction of the base insulating layer and a pedestal supporting the slider, wherein

the pedestal includes

a first base pedestal layer made of the first base insulating layer and disposed at the one side in the thickness direction of the metal supporting board,

a second base pedestal layer made of the second base insulating layer and disposed at one side in the thickness direction of the first base pedestal layer, and

a cover pedestal layer made of the cover insulating layer and disposed at one side in the thickness direction of the second base pedestal layer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 5, 2017
From: TANABE, HIROYUKI; TERADA, NAOHIRO; SUGIMOTO, YUU; YAMAUCHI, DAISUKE
To: NITTO DENKO CORPORATION
Reel/Frame 040860/0972 →
Priority Claims (1)
JP 2015-242585 · Dec 11, 2015 · national
Continuity (1)
Related Publication 20170171969A1 · Jun 15, 2017
Cited By (1)
US 12,573,422