Methods of designing a layout of a semiconductor device including field effect transistor and methods of manufacturing a semiconductor device using the same

1. A method of producing a layout of a semiconductor device, comprising:

providing a standard cell layout, the providing of the standard cell layout comprising creating a preliminary pin pattern of an interconnection layout of the standard cell layout in association with a lower metal layer of the semiconductor device;

performing a routing step to produce a high-level interconnection layout in which a the preliminary pin pattern is connected to a high-level interconnection pattern, the high-level interconnection layout representative of an upper level metal interconnection of the semiconductor device disposed above the lower metal layer; and

converting the preliminary pin pattern into a postliminary pin pattern in a region of the interconnection layout of the standard cell layout, based on hitting information obtained upon the completion of the routing step, the postliminary pin pattern representative of a lower level metal interconnection of the lower metal layer of the semiconductor device,

wherein the postliminary pin pattern is different from the preliminary pin pattern.

2. The method of claim 1 , wherein the postliminary pin pattern is different from the preliminary pin pattern in terms of size and arrangement.

3. The method of claim 1 , wherein the converting of the preliminary pin pattern into the postliminary pin pattern places the postliminary pin pattern in a region that was occupied by the preliminary pin pattern such that the postliminary pin pattern and the preliminary pin pattern occupy overlapping regions in the method of producing the layout.

4. The method of claim 1 , wherein the providing of the standard cell layout comprises:

providing a logic layout including logic transistors; and

laying out a lower via pattern to connect the logic layout to the preliminary pin pattern.

5. The method of claim 1 , wherein the laying out of the preliminary pin pattern comprises laying out ghost patterns, in which pin information for the routing step is contained, and

the converting of the preliminary pin pattern into the postliminary pin pattern comprises converting one of the ghost patterns that hits the high-level interconnection layout into the postliminary pin pattern.

6. The method of claim 1 , wherein the converting of the preliminary pin pattern into the postliminary pin pattern comprises preserving a first region of the preliminary pin pattern while removing a second region of the preliminary pin pattern, and

the first region comprises a first hitting region to be connected to the high-level interconnection layout.

7. The method of claim 1 , further comprising providing a plurality of cell layouts, each based on the standard cell layout,

wherein the cell layouts have different interconnection layouts from one another, and

the converting of the preliminary pin pattern into the postliminary pin pattern comprises replacing the standard cell layout with one of the cell layouts, based on the hitting information.

8. The method of claim 1 , further comprises laying out multiple ones of the standard cell layout, before the routing step.

9. A method of fabricating a semiconductor device, comprising:

a process of generating a layout of a semiconductor device, the layout comprising a standard cell layout;

manufacturing a photomask having a mask pattern based on the layout of the semiconductor device; and

forming layers of metal lines and vias on a substrate using the photomask, the vias vertically connecting different layers of the metal lines,

wherein the generating of the layout of the semiconductor device comprises:

laying out a lower via pattern on a logic layout of the standard cell layout;

laying out a preliminary pin pattern on the lower via pattern;

performing a routing step on the standard cell layout, which places a high-level interconnection layout and an upper via pattern on the preliminary pin pattern, the upper via pattern connecting the preliminary pin pattern to an element of the high-level interconnection layout; and

generating a postliminary pin pattern connecting the lower via pattern to the upper via pattern, wherein the postliminary pin pattern and the preliminary pin pattern occupy overlapping regions in the process.

10. The method of claim 9 , wherein the postliminary pin pattern is different from the preliminary pin pattern in terms of size and arrangement.

11. The method of claim 9 , wherein the laying out of the preliminary pin pattern comprises laying out a ghost pattern, in which pin information for the routing step is contained, and wherein the upper via pattern is placed on the ghost pattern in the routing step, and

the generating of the postliminary pin pattern comprises converting the ghost pattern into the pin pattern.

12. The method of claim 9 , wherein the generating of the postliminary pin pattern comprises preserving a first region of the preliminary pin pattern while removing a second region of the preliminary pin pattern, and

the first region comprises a region overlapped by the upper via pattern.

13. The method of claim 12 , wherein the first region further comprises a region overlapping the lower via pattern.

14. The method of claim 9 , wherein the process of generating of the layout of the semiconductor device further comprises generating a plurality of cell layouts each based on the standard cell layout, and wherein each one of the cell layouts comprises pin patterns that are different from those of each other of the cell layouts in terms of the sizes and arrangement of the pin patterns, and

the generating of the postliminary pin pattern comprises replacing the standard cell layout with one of the cell layouts in consideration of the location of the upper via pattern.

15. A method of fabricating a semiconductor device, comprising:

a process of generating a layout of a semiconductor device, the layout comprising a standard cell layout;

manufacturing a photomask having a mask pattern based on the layout of the semiconductor device; and

forming layers of metal lines and vias on a substrate using the photomask, the vias vertically connecting different layers of the metal lines,

wherein the generating of the layout of the semiconductor device comprises:

laying out a lower via pattern on a logic layout of the standard cell layout;

laying out a preliminary pin pattern on the lower via pattern;

performing a routing step on the standard cell layout, which places a high-level interconnection layout and an upper via pattern on the preliminary pin pattern, the upper via pattern connecting the preliminary pin pattern to an element of the high-level interconnection layout; and

changing size of the preliminary pin pattern to generate a postliminary pin pattern connecting the lower via pattern to the upper via pattern.

16. The method of claim 15 , wherein the laying out of the preliminary pin pattern comprises laying out a ghost pattern, in which pin information for the routing step is contained, and wherein the upper via pattern is placed on the ghost pattern in the routing step, and

the generating of the postliminary pin pattern comprises converting the ghost pattern into the pin pattern.

17. The method of claim 15 , wherein the generating of the postliminary pin pattern comprises preserving a first region of the preliminary pin pattern while removing a second region of the preliminary pin pattern, and

the first region comprises a region overlapped by the upper via pattern.

18. The method of claim 17 , wherein the first region further comprises a region overlapping the lower via pattern.

19. The method of claim 15 , wherein the process of generating of the layout of the semiconductor device further comprises generating a plurality of cell layouts each based on the standard cell layout, and wherein each one of the cell layouts comprises pin patterns that are different from those of each other of the cell layouts in terms of the sizes and arrangement of the pin patterns, and

the generating of the postliminary pin pattern comprises replacing the standard cell layout with one of the cell layouts in consideration of the location of the upper via pattern.