Dual solder layer for fluidic self assembly and electrical component substrate and method employing same
A dual solder layer for fluidic self assembly, an electrical component substrate, and method employing same is described. The dual solder layer comprises a layer of a self-assembly solder disposed on a layer of a base solder which is disposed on the solder pad of an electrical component substrate. The self-assembly solder has a liquidus temperature less than a first temperature and the base solder has a solidus temperature greater than the first temperature. The self-assembly solder liquefies at the first temperature during a fluidic self assembly method to cause electrical components to adhere to the substrate. After attachment, the substrate is removed from the bath and heated so that the base solder and self-assembly solder combine to form a composite alloy which forms the final electrical solder connection between the component and the solder pad on the substrate.
1. An electrical component substrate, comprising at least one solder pad having a dual solder layer, the dual solder layer comprising a first layer of a self-assembly solder and a second layer of a base solder, the second layer of the base solder being disposed on the solder pad and the first layer of the self-assembly solder being disposed on the second layer, wherein the self-assembly solder has a liquidus temperature less than a first temperature and the base solder has a solidus temperature greater than the first temperature.
2. The electrical component substrate of claim 1 , wherein the first temperature is less than about 150° C.
3. The electrical component substrate of claim 1 , wherein the first temperature is less than about 100° C.
4. The electrical component substrate of claim 1 , wherein a thickness of the first layer is less than a thickness of the second layer.
5. The electrical component substrate of claim 1 wherein a molar fraction of the self-assembly solder in the dual solder layer is less than about 10%.
6. The electrical component substrate of claim 1 wherein a mass ratio of the self-assembly solder to the base solder is less than 1.
7. The electrical component substrate of claim 1 wherein a mass ratio of the self-assembly solder to the base solder is between 0.5 and 1.
8. The electrical component substrate of claim 1 wherein the self-assembly solder is gallium or an alloy of gallium.
9. The electrical component substrate of claim 1 wherein the self-assembly solder and the base solder contain a same low melting point element selected from Bi, In and Sn.
10. The electrical component substrate of claim 1 wherein the self-assembly solder and the base solder contain Bi, and a mass fraction, RM, of the self-assembly solder to the base solder is determined by a formula
R
M
=
x
Bi
-
SA
x
Bi
-
Comp
-
1
wherein x Bi-SA is a mass concentration of Bi in the self-assembly solder and x Bi-Comp is a mass concentration of Bi in a composite solder formed by combining the self-assembly solder and the base solder.
11. The electrical component substrate of claim 1 wherein a molar fraction of the self-assembly solder in the dual solder layer is at least 10%.
12. The electrical component substrate of claim 1 wherein a molar fraction of the self-assembly solder in the dual solder layer is at least 50%.
13. The electrical component substrate of claim 1 wherein a melting point of the base solder is above an operating temperature of an electrical component to be mounted to the electrical substrate and below a temperature at which the electrical component or substrate is damaged.
14. The electrical component substrate of claim 1 wherein the self-assembly solder contains at least one of a low melting point element selected from Ga, In, Bi, Se, Sn and Zn.