Bumped electrode arrays for microassemblers
An apparatus including a bumped electrode array and a method of fabricating a bumped electrode array is disclosed. The method includes providing a substrate for the electrode array. The method also includes disposing a plurality of non-planar structures including electrodes above the substrate of the electrode array. The method further includes disposing a dielectric layer above the plurality of non-planar structures having a defined radius of curvature.
1. A system comprising:
an assembly medium;
a plurality of mobile particles at least partially submersed in the assembly medium; and
an array, at least partially submersed in the assembly medium, the array comprising:
a substrate;
a plurality of non-planar structures comprised of electrodes disposed above the substrate, wherein the plurality of non-planar structures comprise a plurality of first curved surfaces, wherein the plurality of non-planar structures disposed above the substrate are to manipulate each of the plurality of mobile particles into a predetermined position and orientation; and
a dielectric layer disposed above and between the plurality of non-planar structures, wherein the dielectric layer conforms to the plurality of first curved surfaces of the plurality of non-planar structures to form a plurality of second curved surfaces of the dielectric layer, wherein the plurality of second curved surfaces of the dielectric layer facilitates the movement of each of the plurality of mobile particles through the assembly medium to the predetermined position and orientation and have a defined radius of curvature.
2. The system of claim 1 , further comprising:
a power source operatively coupled to the array to provide power to the plurality of non-planar structures comprising electrodes and to provide a field to facilitate the movement of each of the plurality of mobile particles through the assembly medium to the predetermined position and orientation.
3. The system of claim 1 , further comprising:
a controller operatively coupled to the power source to control a field conducted through individual electrodes of the plurality of non-planar structures.
4. The system of claim 1 , wherein the substrate comprises a plurality of third curved surfaces, wherein the plurality of non-planar structures are disposed above and aligned with the plurality of third curved surfaces of the substrate.
5. The system of claim 1 , wherein each of the plurality of non-planar structures comprise an electrode and a reflow metal above the electrode that is reflowed to form a curved surface of the first plurality of curved surfaces.
6. The system of claim 1 , wherein the mobile particle is comprised of at least one substantially planar surface.
7. The system of claim 6 , wherein the plurality of second curved surfaces has a pitch that is less than or equal to a length of the substantially planar surface of the mobile particle.
8. The system of claim 7 , wherein the pitch is greater than or equal to 1 micron.
9. The system of claim 1 , wherein the plurality of second curved surfaces have the defined radius of curvature, a pitch, and a height to prevent a tilt angle of the mobile particle from exceeding 45 degrees.