Semiconductor devices with source/drain stress liner
A semiconductor device includes a substrate including a first region and a second region, a first fin-type pattern in the first region, a second fin-type pattern in the second region, a first gate structure intersecting the first fin-type pattern, the first gate structure including a first gate spacer, a second gate structure intersecting the second fin-type pattern, the second gate structure including a second gate spacer, a first epitaxial pattern formed on opposite sides of the first gate structure, on the first fin-type pattern, the first epitaxial pattern having a first impurity, a second epitaxial pattern formed on opposite sides of the second gate structure, on the second fin-type pattern, the second epitaxial pattern having a second impurity, a first silicon nitride film extending along a sidewall of the first gate spacer, and a first silicon oxide film extending along a sidewall of the first gate spacer.
1. A semiconductor device, comprising:
a substrate including a first region and a second region;
a first fin-type pattern in the first region;
a second fin-type pattern in the second region;
a first gate structure intersecting the first fin-type pattern on the first fin-type pattern, the first gate structure including a first gate spacer;
a second gate structure intersecting the second fin-type pattern on the second fin-type pattern, the second gate structure including a second gate spacer;
a first epitaxial pattern formed on opposite sides of the first gate structure, on the first fin-type pattern, the first epitaxial pattern having a first impurity;
a second epitaxial pattern formed on opposite sides of the second gate structure, on the second fin-type pattern, the second epitaxial pattern having a second impurity;
a first silicon nitride film extending along a sidewall of the first gate spacer, a sidewall of the second gate spacer, an upper surface of the first epitaxial pattern, and an upper surface of the second epitaxial pattern;
a first silicon oxide film extending along the sidewall of the first gate spacer between the first gate spacer and the first silicon nitride film and extending along the first epitaxial pattern between the upper surface of the first epitaxial pattern and the first silicon nitride film and extending along the first epitaxial pattern between a sidewall of the first epitaxial pattern and the first silicon nitride film; and
a second silicon oxide film extending along the sidewall of the second gate spacer between sidewall of the second gate spacer and the first silicon nitride film,
wherein a thickness of the first silicon oxide film is different from a thickness of the second silicon oxide film.
2. The semiconductor device of claim 1 , wherein the first silicon oxide film is in contact with the first gate spacer, the first silicon nitride film and the first epitaxial pattern.
3. The semiconductor device of claim 1 , wherein the first silicon oxide film does not extend between the second gate spacer and the first silicon nitride film and between the second epitaxial pattern and the first silicon nitride film.
4. The semiconductor device of claim 1 , wherein the first impurity is a p-type impurity, and the second impurity is an n-type impurity, and
the thickness of the first silicon oxide film is greater than the thickness of the second silicon oxide film.
5. The semiconductor device of claim 1 , further comprising a field insulating film defining the first fin-type pattern and the second fin-type pattern, on the substrate,
wherein a thickness of the first silicon nitride film on the field insulating film in the second region is greater than a thickness of the first silicon nitride film on the field insulating film in the first region.
6. The semiconductor device of claim 1 , further comprising a second silicon nitride film extending along the sidewall of the first gate spacer between the first silicon oxide film and the first gate spacer,
wherein the second region is free of the second silicon nitride film.
7. The semiconductor device of claim 6 , wherein the first silicon oxide film is in contact with the first silicon nitride film and the second silicon nitride film.
8. The semiconductor device of claim 1 , wherein the first region is a PMOS formation region, and the second region is an NMOS formation region.
9. A semiconductor device, comprising:
a first fin-type pattern in a first region of a substrate;
a second fin-type pattern in a second region of the substrate;
a first gate structure on the first fin-type pattern and including a first gate spacer;
a second gate structure on the second fin-type pattern and including a second gate spacer;
a first epitaxial pattern on opposite sides of the first gate structure and having a first impurity;
a second epitaxial pattern on opposite sides of the second gate structure and having a second impurity;
a first silicon nitride film extending along a sidewall of the first gate spacer, along an upper surface of the first epitaxial pattern and along a sidewall of the first epitaxial pattern; and
a first silicon oxide film extending along a portion of the sidewall of the first gate spacer, along the upper surface of the first epitaxial pattern and along the sidewall of the first epitaxial pattern; and
a second silicon oxide film extending along the sidewall of the second gate spacer between sidewall of the second gate spacer and the first silicon nitride film,
wherein a thickness of the first silicon oxide film is different from a thickness of the second silicon oxide film.
10. The semiconductor device of claim 9 , wherein the first silicon oxide film is between the first gate spacer and the first silicon nitride film and between the upper surface of the first epitaxial pattern and the first silicon nitride film and between the sidewall of the first epitaxial pattern and the first silicon nitride film.
11. The semiconductor device of claim 9 , wherein there is no silicon oxide film between the second epitaxial pattern and the first silicon nitride film.
12. The semiconductor device of claim 9 , further comprising a second silicon nitride film extending along the sidewall of the first gate spacer between the first silicon oxide film and the first gate spacer,
wherein the second region is free of the second silicon nitride film, and
wherein the first silicon oxide film is in contact with the first silicon nitride film and the second silicon nitride film.
13. The semiconductor device of claim 9 , wherein the first silicon oxide film is in contact with the first gate spacer and the first silicon nitride film.
14. A semiconductor device, comprising:
a first fin-type pattern in a first region of a substrate;
a second fin-type pattern in a second region of the substrate;
a field insulating film defining the first fin-type pattern and the second fin-type pattern, on the substrate,
a first gate structure on the first fin-type pattern and including a first gate spacer;
a second gate structure on the second fin-type pattern and including a second gate spacer;
a first epitaxial pattern on opposite sides of the first gate structure and having a first impurity;
a second epitaxial pattern on opposite sides of the second gate structure and having a second impurity;
an interlayer insulating film formed between the first epitaxial pattern and second epitaxial pattern;
a first silicon nitride film extending along a sidewall of the first gate spacer; and
a first silicon oxide film extending along a portion of the sidewall of the first gate spacer, extending along a sidewall of the first epitaxial pattern and extending between the field insulating film and the interlayer insulating film, wherein the first silicon nitride film is further formed on a sidewall of the second gate spacer, an upper surface of the first epitaxial pattern, and an upper surface of the second epitaxial pattern, and wherein there is no silicon oxide film between the second gate spacer and the first silicon nitride film and no silicon oxide film between the second epitaxial pattern and the first silicon nitride film.
15. The semiconductor device of claim 14 , wherein the first silicon oxide film is between the first gate spacer and the first silicon nitride film.
16. The semiconductor device of claim 14 , further comprising a second silicon nitride film extending along the sidewall of the first gate spacer between the first silicon oxide film and the first gate spacer, wherein the second region is free of the second silicon nitride film, and wherein the first silicon oxide film is in contact with the first silicon nitride film and the second silicon nitride film.
17. The semiconductor device of claim 14 , wherein the first silicon oxide film is in contact with the first gate spacer and the first silicon nitride film.
18. The semiconductor device of claim 14 , wherein the first silicon nitride film extends along an upper surface of the first epitaxial pattern and along a sidewall of the first epitaxial pattern, and wherein the first silicon oxide film extends along the upper surface of the first epitaxial pattern and along the sidewall of the first epitaxial pattern.