Plating apparatus and plating method
A plating apparatus 10 includes a rectifier 18 configured to apply a DC current to a substrate, and a plating apparatus control unit 30 that instructs the rectifier 18 on a value of the DC current. The plating apparatus control unit 30 has a setting unit 32 for setting a current value, a storage unit 34 that stores a relational expression between an instructed current value on which the rectifier 18 is instructed and an actual current value which the rectifier 18 outputs in accordance with the instructed current value, a calculation unit 38 that corrects the current value set by the setting unit 32 on the basis of the above-mentioned relational expression to calculate a corrected current value, and an instruction unit 36 that instructs the rectifier 18 on the corrected current value calculated by the calculation unit 38.
1. A plating apparatus for plating a substrate, comprising:
a rectifier for applying a DC current to the substrate; and
a plating apparatus control unit for instructing the rectifier on a value of the DC current, wherein
the plating apparatus control unit has
a setting unit for setting a current value,
a storage unit for storing a relational expression between an instructed current value on which the rectifier is instructed and an actual current value which the rectifier outputs in accordance with the instructed current value,
a calculation unit for correcting the set current value on the basis of the relational expression to calculate a corrected current value, and
an instruction unit for instructing the rectifier on the corrected current value, wherein
the plating apparatus control unit has a determination unit that determines whether or not the set current value is not more than a predetermined value,
the calculation unit is configured to correct the set current value on the basis of the relational expression to calculate the corrected current value and the instruction unit is configured to instruct the rectifier on the corrected current value when the determination unit determines that the set current value is not more than the predetermined value, and
the instruction unit is configured to instruct the rectifier on the set current value when the determination unit determines that the set current value is more than the predetermined value.
2. The plating apparatus according to claim 1 , comprising
a plurality of the rectifiers, wherein
the storage unit stores a plurality of the relational expressions respectively corresponding to the plurality of rectifiers,
the calculation unit corrects the set current value on the basis of the plurality of relational expressions to calculate a plurality of the corrected current values, and
the instruction unit instructs the plurality of rectifiers on the respective plurality of corrected current values.
3. The plating apparatus according to claim 1 , wherein
the relational expression is represented by y=ax+b (a and b are constants), where x is the actual current value and y is the instructed current value, and
the calculation unit sets a value y obtained by substituting the set current value for x in the relational expression to be the corrected current value.
4. The plating apparatus according to claim 1 , wherein
the relational expression stored in the storage unit is obtained in advance by measuring a plurality of actual current values corresponding to a plurality of instructed current values of the rectifier.