Semiconductor device and manufacturing method for the same
A semiconductor device includes interlayer insulating layers and conductive patterns alternately stacked over a pipe gate, a first slit and a second slit penetrating the interlayer insulating layers and the conductive patterns and crossing each other, an etch stop pad groove overlapping an intersection of the first slit and the second slit, arranged in the pipe gate, and connected to the first slit or the second slit, and slit insulating layers filling the first slit, the second slit and the etch stop pad groove.
1. A semiconductor device comprising:
interlayer insulating layers and conductive patterns alternately stacked over a pipe gate;
a first slit and a second slit penetrating the interlayer insulating layers and the conductive patterns, and crossing each other;
an etch stop pad groove overlapping an intersection of the first slit and the second slit, arranged in the pipe gate, and connected to the first slit or the second slit; and
slit insulating layers filling the first slit and the second slit,
wherein at least one of the slit insulating layers includes a bottom surface coplanar with an inner surface of the pipe gate along the etch stop pad groove and is extended to completely fill the etch stop pad groove.
2. The semiconductor device of claim 1 , further comprising:
an upper pipe groove arranged in the pipe gate extending along a first direction and a second direction which cross each other;
an upper pipe channel layer arranged in the upper pipe groove; and
at least one pair of upper channel pillars extended from the upper pipe channel layer to a third direction perpendicular to an upper surface of the pipe gate, and penetrating the interlayer insulating layers and the conductive patterns.
3. The semiconductor device of claim 2 , wherein the etch stop pad groove is arranged at a same height as the upper pipe groove.
4. The semiconductor device of claim 2 , wherein the second slit is arranged between the upper channel pillars and extends along the first direction.
5. The semiconductor device of claim 2 , further comprising:
a lower pipe groove arranged in the pipe gate and spaced apart from the upper pipe groove at a lower height than the upper pipe groove;
a lower pipe channel layer arranged in the lower pipe groove; and
at least one pair of lower channel pillars extending from the lower pipe channel layer in the third direction, and penetrating the interlayer insulating layers and the conductive patterns.
6. The semiconductor device of claim 5 , wherein the lower pipe groove is arranged at a lower height than the etch stop pad groove.
7. The semiconductor device of claim 1 , wherein the slit insulating layers comprise:
a first slit insulating layer filling the first slit and the etch stop pad groove; and
a second slit insulating layer filling the second slit.
8. The semiconductor device of claim 7 , further comprising:
the etch stop pad groove extending along the first slit; and
a dummy hole penetrating the pipe gate between the first slit and the etch stop pad groove, wherein the dummy hole is filled with the first slit insulating layer.
9. The semiconductor device of claim 1 , wherein the slit insulating layers comprise:
a first slit insulating layer filling the first slit; and
a second slit insulating layer filling the second slit and the etch stop pad groove.
10. The semiconductor device of claim 9 , further comprising:
the etch stop pad groove extending along the second slit; and
a dummy hole penetrating the pipe gate between the second slit and the etch stop pad groove, wherein the dummy hole is filled with the second slit insulating layer.