Light emitting device with a light emitting junction formed by stacking semiconductor layers
A light emitting device includes a substrate, a light emitting chip, a first electrode, and a second electrode. The light emitting chip includes a first and a second semiconductor layers. The first semiconductor layer is disposed on the substrate. The second semiconductor layer is stacked on the first semiconductor layer and forms a light emitting junction with the first semiconductor layer. The first electrode connects to the first semiconductor layer and the second electrode connects to the second semiconductor layer. The light emitting device may further include a transparent layer that is disposed on the substrate and surrounds and contacts the lateral of the light emitting chip. A refraction index of the transparent layer is between a refraction index of the light emitting chip and that of a vacuum. The first electrode may penetrate the second semiconductor layer to connect to the first semiconductor.
1. A light emitting device, comprising:
a substrate;
a light emitting chip, comprising:
a first semiconductor layer, disposed above the substrate, and
a second semiconductor layer, stacked above the first semiconductor layer and forming a light emitting junction with the first semiconductor layer;
a transparent layer, disposed above the substrate, surrounding and contacting a lateral of the light emitting chip, wherein the transparent layer has a refraction index between that of the light emitting chip and that of a vacuum;
a first electrode, electrically connected to the first semiconductor layer; and
a second electrode, electrically connected to the second semiconductor layer;
wherein the substrate comprises a driving device, the second electrode extends from a surface of the second semiconductor layer, along a space between the lateral of the light emitting chip and the transparent layer, to the substrate, and the second electrode is electrically connected to the second semiconductor layer and the driving device and electrically isolated from the first semiconductor layer on the surface of the second semiconductor layer.
2. A light emitting device, comprising:
a substrate;
a light emitting chip, comprising:
a first semiconductor layer, disposed above the substrate, and
a second semiconductor layer, stacked above the first semiconductor layer and forming a light emitting junction with the first semiconductor layer;
a transparent layer, disposed above the substrate, surrounding and contacting a lateral of the light emitting chip, wherein the transparent layer has a refraction index between that of the light emitting chip and that of a vacuum;
a first electrode, electrically connected to the first semiconductor layer; and
a second electrode, electrically connected to the second semiconductor layer;
wherein the substrate comprises a driving device, the first electrode is disposed between the first semiconductor layer and the substrate and extends to the driving device, and the first electrode being electrically connected to the first semiconductor layer and the driving device.
3. The light emitting device according to claim 1 , wherein the second electrode is stacked above the second semiconductor layer and the transparent layer, and the transparent layer separates the lateral of the light emitting chip from the second electrode.
4. The light emitting device according to claim 1 , wherein the light emitting device further comprises a partition wall surrounding the light emitting chip, wherein the transparent layer is located between the light emitting chip and the partition wall, the first electrode extends from a surface of the first semiconductor layer, along the space between the lateral of the light emitting chip and the transparent layer, to the substrate, and the first electrode further extends onto the partition wall and is electrically isolated from the second semiconductor layer at the lateral of the light emitting chip.
5. The light emitting device according to claim 1 , wherein the light emitting device further comprises a partition wall surrounding the light emitting chip, wherein the transparent layer is located between the light emitting chip and the partition wall, and the second electrode is stacked above the second semiconductor layer and the transparent layer and extends onto the partition wall.
6. A light emitting device, comprising:
a substrate;
a light emitting chip, comprising:
a first semiconductor layer, disposed above the substrate; and
a second semiconductor layer, stacked above the first semiconductor layer and forming a light emitting junction with the first semiconductor layer;
a first electrode, comprising a first contact portion and a first extension portion, wherein the first contact portion penetrates and electrically isolated from the second semiconductor layer, the first contact portion is further electrically connected to the first semiconductor layer, the first extension portion is stacked above the first contact portion and the second semiconductor layer, and the first extension portion electrically isolated from the second semiconductor layer; and
a second electrode, comprising a second contact portion and a second extension portion, wherein the second contact portion is stacked above the second semiconductor layer, electrically connected to the second semiconductor layer and electrically isolated from the first electrode, and the second extension portion is stacked above the second contact portion.
7. The light emitting device according to claim 6 , wherein the first extension portion extends from the first contact portion onto an edge of a lateral of the light emitting chip, the second contact portion substantially occupies an entire surface of the second semiconductor layer and is away from the first extension portion and the first contact portion, and the first extension portion occupies less area on the second semiconductor layer than the second contact portion does.
8. The light emitting device according to claim 6 , wherein the second contact portion substantially occupies an entire surface of the second semiconductor layer, a first part of the first contact portion further penetrates the second contact portion, a second part of the first contact portion is laid on a part of the second contact portion and partially covers the second contact portion, and the second part of the first contact portion is electrically isolated from the second contact portion on the light emitting chip.
9. The light emitting device according to claim 6 , wherein the device further comprises a transparent layer, disposed on the substrate, surrounding and contacting a lateral of the light emitting chip, wherein the transparent layer exhibits a refraction index between that of the light emitting chip and that of a vacuum.
10. The light emitting device according to claim 9 , wherein the first extension portion and the second extension portion extend onto the transparent layer respectively, and the transparent layer separates the lateral of the light emitting chip from the first electrode and from the second electrode.
11. The light emitting device according to claim 9 , wherein the light emitting device further comprises a partition wall surrounding the light emitting chip, wherein the transparent layer is located between the light emitting chip and the partition wall, and the first extension portion and the second extension portion extend onto the partition wall respectively.
12. The light emitting device according to claim 6 , wherein the first electrode and the second electrode are separated from a lateral of the light emitting chip and are not adhered to the lateral of the light emitting chip therein.