Integrated circuits with magnetic tunnel junction memory cells and methods for producing the same
Integrated circuits and methods of producing the same are provided. In an exemplary embodiment, a method for producing an integrated circuit includes forming a memory cell with a memory cell upper surface. A capping layer is formed overlying the memory cell, and a portion of the capping layer is removed to expose the memory cell upper surface. A memory cell etch stop is formed overlying the memory cell upper surface after the portion of the capping layer is removed to expose the memory cell upper surface. The memory cell etch stop is removed from overlying the memory cell upper surface, and an interconnect is formed in electrical communication with the memory cell.
1. A method of producing an integrated circuit comprising:
forming a memory cell, wherein the memory cell comprises a memory cell upper surface;
forming a capping layer overlying the memory cell;
removing a portion of the capping layer to expose the memory cell upper surface
forming a memory cell etch stop overlying the memory cell upper surface after removing the portion of the capping layer;
removing the memory cell etch stop from overlying the memory cell upper surface; and
forming an interconnect in electrical communication with the memory cell.
2. The method of claim 1 wherein forming the capping layer comprises forming the capping layer wherein the capping layer primarily includes silicon nitride.
3. The method of claim 2 wherein forming the memory cell etch stop comprises forming the memory cell etch stop wherein the memory cell etch stop primarily comprises silicon nitride.
4. The method of claim 1 further comprising:
forming a covering layer overlying the capping layer, wherein;
removing the portion of the capping layer comprises removing a portion of the covering layer to form a peak.
5. The method of claim 4 wherein forming the memory cell etch stop comprises forming the memory cell etch stop comprising a convex shape overlying the memory cell, wherein the convex shape is convex relative to the memory cell upper surface.
6. The method of claim 4 wherein forming the covering layer comprises forming the covering layer comprising silicon dioxide.
7. The method of claim 1 wherein forming the memory cell comprises:
forming a pinning layer that is magnetic;
forming a tunnel barrier layer overlying the pinning layer, wherein the tunnel barrier layer is an electrical insulator; and
forming a free layer overlying the tunnel barrier layer, wherein the free layer is magnetic.
8. The method of claim 7 wherein forming the tunnel barrier layer comprises forming the tunnel barrier layer wherein the tunnel barrier layer comprises magnesium oxide.
9. The method of claim 1 wherein the interconnect is in direct electrical contact with the memory cell.
10. The method of claim 1 wherein:
forming the capping layer comprises forming the capping layer in direct contact with the memory cell.
11. The method of claim 10 wherein:
forming the memory cell etch stop comprises forming the memory cell etch stop in direct contact with the memory cell upper surface.
12. A method of producing an integrated circuit comprising:
forming a memory cell comprising a memory cell upper surface;
forming a memory cell etch stop with a convex shape overlying the memory cell, wherein the memory cell etch stop is convex to the memory cell upper surface;
forming a memory dielectric layer overlying the memory cell etch stop;
forming a via in the memory dielectric layer, wherein the memory cell etch stop is exposed in the via;
removing at least a portion of the memory cell etch stop from within the via; and
forming an interconnect within the via, wherein the interconnect is in electrical communication with the memory cell.
13. The method of claim 12 further comprising:
forming a capping layer overlying the memory cell before forming the memory cell etch stop.
14. The method of claim 13 wherein:
forming the memory cell etch stop comprises forming the memory cell etch stop such that the memory cell etch stop and the capping layer primarily comprise the same material.
15. The method of claim 13 further comprising:
removing the capping layer from over the memory cell upper surface prior to forming the memory cell etch stop.
16. The method of claim 12 wherein removing the memory cell etch stop from within the via comprises exposing the memory cell upper surface within the via.