Semiconductor device
A semiconductor device includes a semiconductor substrate having a drift layer, a base layer, a collector layer and a cathode layer. The semiconductor substrate includes a cell region and an outer peripheral region surrounding the cell region. The cell region includes an IGBT region and a diode region. The semiconductor substrate further includes a damage region arranged in the diode region and a part of the outer peripheral region adjacent to a boundary between the outer peripheral region and the diode region. A length, in a longitudinal direction of the diode region, of the part of the outer peripheral region, in which the damage region is arranged, is equal to or more than twice of a thickness of the semiconductor substrate. As a result, recovery characteristic is improved in a portion of the diode region adjacent to the boundary between the outer peripheral region and the diode region.
1. A semiconductor device comprising:
a semiconductor substrate including
a drift layer having a first conductivity type,
a base layer having a second conductivity type and arranged on the drift layer,
a collector layer having the second conductivity type, and
a cathode layer having the first conductivity type, the collector layer and the cathode layer being arranged opposite to the base layer with respect to the drift layer, wherein:
the semiconductor substrate includes a cell region and an outer peripheral region surrounding the cell region;
the cell region includes an IGBT region operating as an IGBT element and a diode region operating as a diode element;
the IGBT region and the diode region are alternately repeated in the cell region;
the collector layer is arranged in the IGBT region and the cathode layer is arranged in the diode region;
a boundary between the IGBT region and the diode region is defined by a boundary between the collector layer and the cathode layer;
the collector layer is arranged in the outer peripheral region and is in contact with the cathode layer;
a boundary between the outer peripheral region and the diode region of the cell region is defined by the boundary between the collector layer and the cathode layer;
the semiconductor substrate further includes a damage region arranged in a surface layer portion of the semiconductor substrate;
the damage region is arranged in the diode region and a part of the outer peripheral region adjacent to the boundary between the outer peripheral region and the diode region;
a direction in which the diode region and the IGBT region are repeated is defined as an arrangement direction;
a direction perpendicular to the arrangement direction is defined as a longitudinal direction of the diode region;
the damage region protrudes from the diode region into the outer peripheral region in the longitudinal direction of the diode region; and
a length, in the longitudinal direction of the diode region, of the part of the outer peripheral region, in which the damage region is arranged, is equal to or more than twice of a thickness of the semiconductor substrate.
2. The semiconductor device according to claim 1 , wherein:
the damage region protrudes from the diode region toward the IGBT region along the arrangement direction;
the damage region in the IGBT region includes an end portion adjacent to an end of the diode region in the longitudinal direction;
the damage region in the IGBT region includes a center portion adjacent to a center of the diode region in the longitudinal direction; and
a length, in the arrangement direction, of the end portion of the damage region in the IGBT region is greater than a length, in the arrangement direction, of the center portion of the damage region in the IGBT region.
3. The semiconductor device according to claim 2 , wherein:
a hole of the drift layer in the IGBT region is recombined with an electron and eliminated at the damage region in the IGBT region.
4. The semiconductor device according to claim 1 , wherein:
the IGBT region includes a damage-region-arranged portion in which the damage region is arranged, and a no-damage-region-arranged portion in which the damage region is not arranged;
the damage-region-arranged portion of the IGBT region is arranged, along a plane of the semiconductor substrate, adjacent to the boundary between the IGBT region and the diode region; and
a length, in the arrangement direction, of the damage-region-arranged portion of the IGBT region is greater than or equal to the thickness of the semiconductor substrate.
5. The semiconductor device according to claim 1 , wherein:
in the IGBT region, the base layer includes a channel region and a float region other than the channel region; and
the semiconductor substrate further includes
an emitter region having the first conductivity type and arranged in a surface layer portion of the channel region,
a hole stopper layer having the first conductivity type, arranged in the float region, and dividing the float region along a thickness direction of the semiconductor substrate, and
a carrier storage layer having the first conductivity type, arranged between the channel region and the drift layer, and having an impurity concentration higher than the drift layer.
6. The semiconductor device according to claim 1 , wherein:
a hole of the drift layer in the outer peripheral region is recombined with an electron and eliminated at the damage region in the outer peripheral region.
7. The semiconductor device according to claim 1 , wherein:
the damage region is arranged in a surface layer portion of the drift layer.
8. A semiconductor device comprising:
a semiconductor substrate including
a drift layer having a first conductivity type,
a base layer having a second conductivity type and arranged on the drift layer,
a collector layer having the second conductivity type, and
a cathode layer having the first conductivity type, the collector layer and the cathode layer being arranged opposite to the base layer with respect to the drift layer, wherein:
the semiconductor substrate includes a cell region and an outer peripheral region surrounding the cell region;
the cell region includes an IGBT region operating as an IGBT element and a diode region operating as a diode element;
the IGBT region and the diode region are alternately repeated in the cell region;
the collector layer is arranged in the IGBT region and the cathode layer is arranged in the diode region;
a boundary between the IGBT region and the diode region is defined by a boundary between the collector layer and the cathode layer;
the collector layer is arranged in the outer peripheral region and is in contact with the cathode layer;
a boundary between the outer peripheral region and the diode region of the cell region is defined by the boundary between the collector layer and the cathode layer;
the semiconductor substrate further includes a damage region arranged in a surface layer portion of the semiconductor substrate;
the damage region is arranged in the diode region and a part of the outer peripheral region adjacent to the boundary between the outer peripheral region and the diode region;
a direction in which the diode region and the IGBT region are repeated is defined as an arrangement direction;
a direction perpendicular to the arrangement direction is defined as a longitudinal direction of the diode region;
a length, in the longitudinal direction of the diode region, of the part of the outer peripheral region, in which the damage region is arranged, is equal to or more than twice of a thickness of the semiconductor substrate;
the damage region protrudes from the diode region toward the IGBT region along the arrangement direction;
the damage region in the IGBT region includes an end portion adjacent to an end of the diode region in the longitudinal direction;
the damage region in the IGBT region includes a center portion adjacent to a center of the diode region in the longitudinal direction; and
a length, in the arrangement direction, of the end portion of the damage region in the IGBT region is greater than a length, in the arrangement direction, of the center portion of the damage region in the IGBT region.
9. A semiconductor device comprising:
a semiconductor substrate including
a drift layer having a first conductivity type,
a base layer having a second conductivity type and arranged on the drift layer,
a collector layer having the second conductivity type, and
a cathode layer having the first conductivity type, the collector layer and the cathode layer being arranged opposite to the base layer with respect to the drift layer, wherein:
the semiconductor substrate includes a cell region and an outer peripheral region surrounding the cell region;
the cell region includes an IGBT region operating as an IGBT element and a diode region operating as a diode element;
the IGBT region and the diode region are alternately repeated in the cell region;
the collector layer is arranged in the IGBT region and the cathode layer is arranged in the diode region;
a boundary between the IGBT region and the diode region is defined by a boundary between the collector layer and the cathode layer;
the collector layer is arranged in the outer peripheral region and is in contact with the cathode layer;
a boundary between the outer peripheral region and the diode region of the cell region is defined by the boundary between the collector layer and the cathode layer;
the semiconductor substrate further includes a damage region arranged in a surface layer portion of the semiconductor substrate;
the damage region is arranged in the diode region and a part of the outer peripheral region adjacent to the boundary between the outer peripheral region and the diode region;
a direction in which the diode region and the IGBT region are repeated is defined as an arrangement direction;
a direction perpendicular to the arrangement direction is defined as a longitudinal direction of the diode region;
a length, in the longitudinal direction of the diode region, of the part of the outer peripheral region, in which the damage region is arranged, is equal to or more than twice of a thickness of the semiconductor substrate;
the IGBT region includes a damage-region-arranged portion in which the damage region is arranged, and a no-damage-region-arranged portion in which the damage region is not arranged;
the damage-region-arranged portion of the IGBT region is arranged, along a plane of the semiconductor substrate, adjacent to the boundary between the IGBT region and the diode region; and
a length, in the arrangement direction, of the damage-region-arranged portion of the IGBT region is greater than or equal to the thickness of the semiconductor substrate.