Methods of fabricating semiconductor devices
A semiconductor device and a method for fabricating the same are disclosed. The semiconductor device comprises: a semiconductor substrate with an active area defined by a plurality of isolation features; a gate stack extending across the active area onto portions of the isolation features, wherein the gate stack comprising a gate dielectric layer on the active area and the portions of the isolation features, and a gate electrode on the gate dielectric layer; and a protective seal comprising a vertical portion lining sidewalls of the gate stack and a horizontal portion extending onto a top surface of the isolation features, wherein the horizontal portion surrounding portions of the gate stack outside the active area in a top view.
1. A method for fabricating a semiconductor device, comprising:
providing an active area and a plurality of isolation features in a semiconductor substrate;
forming a gate dielectric layer on the active area and portions of the isolation features;
forming a dummy gate on the gate dielectric layer;
forming a protective seal comprising a vertical portion lining sidewalls of the dummy gate and a horizontal portion extending onto top surfaces of the isolation features, wherein the horizontal portion surrounding portions of the dummy gate outside the active area in a top view;
removing the dummy gate by etching to form a gate trench; and
filling the gate trench with a gate electrode.
2. The method of claim 1 , wherein the forming the protective seal comprises:
depositing a seal material conformally covering the dummy gate and the top surfaces of the isolation features;
forming an etch mask covering the seal material on the top surfaces of the isolation features which surround portions of the dummy gate outside the active area in a top view, while exposing the seal material on a top surface of the dummy gate;
performing an etching process to the seal material exposed by the etch mask, to obtain the protective seal; and
removing the etch mask.
3. The method of claim 1 , wherein the dummy gate is selected from the group consisting of polycrystalline silicon, amorphous silicon, microcrystal silicon, and combinations thereof.
4. The method of claim 1 , wherein the etching is a wet etching employing a solution comprising dilute HF (DHF) solution, buffered oxide etch (BOE) solution, hot phosphoric acid, or H 2 O 2 .
5. The method of claim 1 , wherein the isolation features are shallow trench isolation (STI) features.
6. The method of claim 1 , wherein the gate dielectric layer comprises a high-k (HK) dielectric material.
7. The method of claim 1 , wherein the gate dielectric layer is selected from the group consisting of: hafnium oxide, HfSiO, HfSiON, HfTaO, HfTiO, HfZrO, zirconium oxide, aluminum oxide, hafnium dioxide-alumina (HfO 2 —Al 2 O 3 ) alloy, and combinations thereof.
8. The method of claim 1 , wherein the gate electrode comprises a metal gate.
9. The method of claim 1 , wherein the protective seal comprises silicon nitride, silicon oxynitride, or combinations thereof.
10. The method of claim 1 , wherein the protective seal has a thickness of 1 to 40 nm.
11. The method of claim 1 , wherein an edge portion of the gate dielectric layer is higher than a center portion of the gate dielectric layer.
12. A method for fabricating a semiconductor device, comprising:
providing a semiconductor substrate having an active area and an isolation feature;
forming a gate dielectric layer on the active area such that an edge portion of the gate dielectric layer is higher than a center portion of the gate dielectric layer;
forming a dummy gate on the gate dielectric layer;
forming a protective seal comprising a first portion on a sidewall of the dummy gate and a second portion on a top surface of the isolation feature;
removing the dummy gate to form a gate trench; and
filling the gate trench with a gate electrode.
13. The method of claim 12 , further comprising:
depositing a seal material conformally on a top surface of the dummy gate and the top surface of the isolation feature;
forming an etch mask to cover the seal material on the top surface of the isolation feature and to expose the seal material on the top surface of the dummy gate;
performing an etching process on the seal material on the top surface of the dummy gate to obtain the protective seal; and
removing the etch mask.
14. The method of claim 12 , wherein the dummy gate is selected from the group consisting of: polycrystalline silicon, amorphous silicon, microcrystal silicon, and combinations thereof.
15. The method of claim 13 , wherein the etching is a wet etching employing a solution comprising dilute HF (DHF) solution, buffered oxide etch (BOE) solution, hot phosphoric acid, or H 2 O 2 .
16. The method of claim 12 , wherein the isolation feature is a shallow trench isolation (STI) feature.
17. The method of claim 12 , wherein the gate dielectric layer comprises a high-k dielectric material.
18. The method of claim 1 , wherein the gate dielectric layer is selected from the group consisting of: hafnium oxide, HfSiO, HfSiON, HfTaO, HfTiO, HfZrO, zirconium oxide, aluminum oxide, hafnium dioxide-alumina (HfO 2 —Al 2 O 3 ) alloy, and combinations thereof.
19. A method for fabricating a semiconductor device, comprising:
providing a semiconductor substrate that has an active area and an isolation feature;
forming a gate dielectric layer on the active area;
forming a dummy gate on the gate dielectric layer;
forming a protective seal surrounding the dummy gate, in contact with the gate dielectric layer, and comprising a first portion on a sidewall of the dummy gate and a second portion extending on a top surface of the isolation feature;
removing the dummy gate to form a gate trench; and
filling the gate trench with a gate electrode.
20. The method of claim 19 , wherein forming the gate dielectric layer is such that an edge portion of the gate dielectric layer is higher than a center portion of the gate dielectric layer.