Adhesive and method of encapsulating organic electronic device using the same
An adhesive, and an encapsulated product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable resin and a moisture absorbent, and the adhesive includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive.
1. An adhesive comprising:
a curable resin, and
a moisture absorbent,
wherein the adhesive comprises a first region in direct contact with an organic electronic device (OED) upon encapsulation of the OED, and a second region not coming in contact with the organic electronic device (OED),
wherein the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive, and
wherein the first region comprises an inorganic filler.
2. The adhesive of claim 1 , wherein the curable resin has a water vapor transmission rate (WVTR) of 50 g/m 2 ·day or less when measured in a cured state.
3. The adhesive of claim 1 , wherein the curable resin is a thermosetting resin, a photocurable resin or a dual curable resin.
4. The adhesive of claim 1 , wherein the curable resin contains at least one curable functional group selected from the group consisting of a glycidyl group, an isocyanate group, a hydroxyl group, a carboxyl group, an amide group, an epoxide group, a cyclic ether group, a sulfide group, an acetal group and a lactone group.
5. The adhesive of claim 1 , wherein the curable resin is an epoxy resin having a ring structure in the molecular structure.
6. The adhesive of claim 1 , wherein the curable resin is a silane-modified epoxy resin.
7. The adhesive of claim 1 , wherein the moisture absorbent is a moisture-reactive absorbent, a physical absorbent, or a mixture thereof.
8. The adhesive of claim 7 , wherein the moisture-reactive absorbent is selected from the group consisting of alumina, metal oxide, metal salt and phosphorus pentoxide, and the physical absorbent is selected from the group consisting of silica, zeolite, zirconia, titania and montmorillonite.
9. The adhesive of claim 8 , wherein the moisture-reactive absorbent is at least one selected from the group consisting of P 2 O 5 , Li 2 O, Na 2 O, BaO, CaO, MgO, Li 2 SO 4 , Na 2 SO 4 , CaSO 4 , MgSO 4 , CoSO 4 , Ga 2 (SO 4 ) 3 , Ti(SO 4 ) 2 , NiSO 4 , CaCl 2 , MgCl 2 , SrCl 2 , YCl 3 , CuCl 2 , CsF, TaF 5 , NbF 5 , LiBr, CaBr 2 , CeBr 3 , SeBr 4 , VBr 3 , MgBr 2 , BaI 2 , MgI 2 , Ba(ClO 4 ) 2 and Mg(ClO 4 ) 2 .
10. The adhesive of claim 1 , wherein the second region of the adhesive comprises 1 to 100 parts by weight of the moisture absorbent, based on 100 parts by weight of the curable resin.
11. The adhesive of claim 1 , wherein the first region of the adhesive comprises 0 to 20 parts by weight of the moisture absorbent, based on 100 parts by weight of the curable resin.
12. The adhesive of claim 1 , wherein the second region further comprises an inorganic filler.
13. The adhesive of claim 12 , wherein each of the inorganic filler in the first region and the second region is at least one selected from the group consisting of clay, talc and acicular silica.
14. The adhesive of claim 12 , wherein the adhesive comprises 1 to 50 parts by weight of the filler, based on 100 parts by weight of the curable resin.
15. The adhesive of claim 1 , wherein the adhesive further comprises a curing agent.
16. The adhesive of claim 15 , wherein the curing agent is selected from the group consisting of an amine-based compound, an imidazole-based compound, a phenol-based compound, a phosphorus-based compound and an acid anhydride-based compound.
17. The adhesive of claim 15 , wherein the adhesive comprises 1 to 10 parts by weight of the curing agent, based on 100 parts by weight of the curable resin.
18. The adhesive of claim 1 , wherein the adhesive further comprises a film formability improving resin having a weight average molecular weight of 20,000 or more.
19. The encapsulated organic electronic device (OED) on a substrate comprising:
the adhesive defined in claim 1 for encapsulating the organic electronic device (OED),
wherein the first region of the adhesive covers the organic electronic device (OED).
20. The product of claim 19 , wherein the organic electronic device is an organic light emitting diode (OLED).
21. The product of claim 19 , wherein the organic electronic device (OED) comprises a passivation layer.
22. A method of encapsulating an organic electronic device (OED), comprising:
applying the adhesive defined in claim 1 to a substrate having the organic electronic device (OED) formed thereon so that the first region of the adhesive covers the organic electronic device (OED); and
curing the adhesive.
23. The method of claim 22 , wherein the application of the adhesive to the organic electronic device is performed by subjecting the adhesive to a hot-roll lamination, hot press or vacuum press method.
24. The method of claim 22 , wherein the application of the adhesive to the organic electronic device is performed at a temperature of 50 to 90° C.
25. The method of claim 22 , wherein the curing of the adhesive is performed by heating the adhesive in a temperature range of 70 to 110° C. or irradiating the adhesive with UV rays.
26. The method of claim 22 , wherein the organic electronic device (OED) comprises a passivation layer.
27. The adhesive of claim 1 , wherein the adhesive has a viscosity of 10 6 dynes/cm 2 or more at room temperature.