Organic EL display unit, method of manufacturing the same, and electronic apparatus
An organic EL display unit includes a first substrate, a second substrate, a display layer, and a sealing section. The display layer is provided between the first substrate and the second substrate. The display layer includes an organic layer. The sealing section is provided continuously from an end surface of the display layer to at least a portion of respective end surfaces of the first substrate and the second substrate.
1. An organic EL display unit comprising:
a first substrate;
a second substrate;
a display layer located between the first substrate and the second substrate, the display layer including an organic layer; and
a sealing section extending continuously along an end surface of the display layer to at least a portion of respective end surfaces of the first substrate and the second substrate,
wherein
the sealing section has a layered structure including an inorganic material layer and an organic material layer,
the organic material layer includes first and second outermost edges positioned along a plane parallel to the end surface, and
the first and second outermost edges of the organic material layer are entirely covered by the inorganic material layer.
2. The organic EL display unit according to claim 1 , wherein the inorganic material layer is one of a plurality of inorganic material layers, the organic material layer is one of a plurality of organic material layers, and the layered structure of the sealing section has the inorganic material layers and the organic material layers stacked alternately.
3. The organic EL display unit according to claim 2 , wherein
the width of respective instances of the organic material layers becomes larger in an order of a stacking of the organic material layers.
4. The organic EL display unit according to claim 1 , wherein the inorganic material layer contains one or more of aluminum oxide (Al2O3), silicon oxide (SiO2), zirconium oxide (ZrO2), titanium oxide (TiO2), zinc oxide (ZnO2), indium-zinc oxide (IZO), indium-tin oxide (ITO), indium-gallium-zinc oxide (IGZO), aluminum-zinc oxide (AZO), gallium-zinc oxide (GZO), silicon nitride (SiN), and silicon oxynitride (SiON).
5. The organic EL display unit according to claim 1 , wherein the inorganic material layer contains one or more of ruthenium (R), platinum (Pt), iridium (Ir), palladium (Pd), rhodium (Rh), gold (Au), silver (Ag), copper (Cu), nickel (Ni), cobalt (Co), iron (Fe), manganese (Mn), tantalum (Ta), tungsten (W), molybdenum (Mo), titanium (Ti), aluminum (Al), silicon (Si), germanium (Ge), and zinc (Zn), or an alloy thereof.
6. The organic EL display unit according to claim 1 , further comprising a flattening film containing an organic material and provided on the end surface of the display layer.
7. The organic EL display unit according to claim 1 , wherein the inorganic material layer firstly provided on the end surface of the display layer has electrical conductivity.
8. A method of manufacturing an organic EL display unit, the method comprising:
forming, on a first substrate, a display layer including an organic layer;
joining the first substrate and the second substrate together, with the display layer being provided therebetween; and
forming a sealing section that extends continuously along an end surface of the display layer to at least a portion of respective end surfaces of the first substrate and the second substrate,
wherein
the sealing section has a layered structure including an inorganic material layer and an organic material layer,
the organic material layer includes first and second outermost edges positioned along a plane parallel to the end surface, and
the first and second outermost edges of the organic material layer are entirely covered by the inorganic material layer.
9. The method of manufacturing the organic EL display unit according to claim 8 , further comprising providing an adhesive layer on the second substrate before the joining, with the display layer being provided therebetween, of the first substrate and the second substrate together.
10. The method of manufacturing the organic EL display unit according to claim 8 , further comprising dividing, including the display layer, the first substrate and the second substrate after the joining, with the display layer being provided therebetween, of the first substrate and the second substrate together.
11. The method of manufacturing the organic EL display unit according to claim 10 , wherein the dividing is performed by dicing.
12. The method of manufacturing the organic EL display unit according to claim 10 , wherein the dividing is performed by scribing after removal, with a laser, of the adhesive layer provided between the display layer and the second substrate.
13. An electronic apparatus with an organic EL display unit, the organic EL display unit comprising:
a first substrate;
a second substrate;
a display layer located between the first substrate and the second substrate, the display layer including an organic layer; and
a sealing section that extends continuously along an end surface of the display layer to at least a portion of respective end surfaces of the first substrate and the second substrate,
wherein
the sealing section has a layered structure including an inorganic material layer and an organic material layer,
the organic material layer includes first and second outermost edges positioned along a plane parallel to the end surface, and
the first and second outermost edges of the organic material layer are entirely covered by the inorganic material layer.
14. The electronic apparatus according to claim 13 , wherein the inorganic material layer is one of a plurality of inorganic material layers, the organic material layer is one of a plurality of organic material layers, and the layered structure of the sealing section has the inorganic material layers and the organic material layers stacked alternately.
15. The electronic apparatus according to claim 14 , wherein
the width of respective instances of the organic material layers becomes larger in an order of a stacking of the organic material layers.
16. The electronic apparatus according to claim 13 , wherein the inorganic material layer contains one or more of aluminum oxide (Al2O3), silicon oxide (SiO2), zirconium oxide (ZrO2), titanium oxide (TiO2), zinc oxide (ZnO2), indium-zinc oxide (IZO), indium-tin oxide (ITO), indium-gallium-zinc oxide (IGZO), aluminum-zinc oxide (AZO), gallium-zinc oxide (GZO), silicon nitride (SiN), and silicon oxynitride (SiON).
17. The electronic apparatus according to claim 13 , wherein the inorganic material layer contains one or more of ruthenium (R), platinum (Pt), iridium (Ir), palladium (Pd), rhodium (Rh), gold (Au), silver (Ag), copper (Cu), nickel (Ni), cobalt (Co), iron (Fe), manganese (Mn), tantalum (Ta), tungsten (W), molybdenum (Mo), titanium (Ti), aluminum (Al), silicon (Si), germanium (Ge), and zinc (Zn), or an alloy thereof.
18. The electronic apparatus according to claim 13 , further comprising a flattening film containing an organic material and provided on the end surface of the display layer.
19. The electronic apparatus according to claim 13 , wherein the inorganic material layer firstly provided on the end surface of the display layer has electrical conductivity.