Laminated ceramic electronic component and method for manufacturing same
A laminated ceramic electronic component that includes a laminate having a plurality of dielectric layers and a plurality of internal electrode layers laminated together. External electrodes having underlying electrode layers and plating layers are formed on both end surfaces of the laminate. When a cross-section including the underlying electrode layers is observed, the underlying electrode layers contain a plurality of Cu crystals and glass, and an average value of lengths of demarcation lines of the Cu crystals having different crystal orientations is 3 μm or less.
1. A laminated ceramic electronic component comprising:
a laminate having a plurality of dielectric layers and a plurality of internal electrode layers respectively laminated, and having a first main surface and a second main surface opposed to each other in a lamination direction, a first side surface and a second side surface opposed to each other in a width direction orthogonal to the lamination direction, and a first end surface and a second end surface opposed to each other in a length direction orthogonal to the lamination direction and the width direction;
a first external electrode covering the first end surface and extending from the first end surface onto the first and second main surfaces and the first and second side surfaces, the first external electrode being connected to a first set of internal electrodes of the plurality of internal electrodes; and
a second external electrode covering the second end surface and extending from the second end surface onto the first and second main surfaces and the first and second side surfaces, the second external electrode being connected to a second set of internal electrodes of the plurality of internal electrodes,
each of the first external electrode and the second external electrode including a plating layer and an underlying electrode layer, the underlying electrode layer containing a plurality of Cu crystals and glass, the plurality of Cu crystals having different crystal orientations, and an average crystal length of the Cu crystals having different crystal orientations is between 0.3 μm and 3 μm.
2. The laminated ceramic electronic component according to claim 1 , wherein the laminate has a dimension in the length direction of 0.25 mm or less, a dimension in the lamination direction of 0.125 mm or less and a dimension in the width direction of 0.125 mm or less.
3. The laminated ceramic electronic component according to claim 1 , wherein, in a cross-section including the laminate and the first external electrode or the second external electrode, the plurality of Cu crystals and the glass are each in contact with the laminate at 5 or more locations at an interface between the laminate and the first external electrode or the second external electrode within 2 μm from the interface between the laminate and the first external electrode or the second external electrode.
4. The laminated ceramic electronic component according to claim 3 , wherein, the plurality of Cu crystals and the glass are in contact with the laminate at no more than 15 locations at the interface between the laminate and the first external electrode or the second external electrode within the 2 μm from the interface between the laminate and the first external electrode or the second external electrode.
5. The laminated ceramic electronic component according to claim 1 , wherein the underlying electrode layer contains Al or Zr.