Semiconductor device including transistors with different threshold voltages
A semiconductor device including a substrate includes a first region and a second region and first and second transistors in the first and second regions, respectively. The first transistor includes a first gate insulating layer on the substrate, a first lower TiN layer on and in contact with the first gate insulating layer, a first etch-stop layer on the first lower TiN layer and a first upper gate electrode on the first etch-stop layer. The second transistor includes a second gate insulating layer on the substrate, a second lower TiN layer on and in contact with the second gate insulating layer, a second etch-stop layer on the second lower TiN layer and a second upper gate electrode on the second etch-stop layer. A thickness of the first lower TiN layer is less than a thickness of the second lower TiN layer.
1. A semiconductor device, comprising:
a substrate including a first region and a second region; and
first and second transistors of the same conductivity type in the first and second regions, respectively,
wherein the first transistor includes a first gate insulating layer on the substrate, a first lower TiN layer on and in contact with the first gate insulating layer, a first etch-stop layer on the first lower TiN layer, and a first upper gate electrode on the first etch-stop layer, the first upper gate electrode including a first work function control layer, and
the second transistor includes a second gate insulating layer on the substrate, a second lower TiN layer on and in contact with the second gate insulating layer, a second etch-stop layer on the second lower TiN layer and a second upper gate electrode on the second etch-stop layer, the second upper gate electrode including a second work function control layer,
wherein a thickness of the first lower TiN layer is less than a thickness of the second lower TiN layer, and
a thickness of the first work function control layer is different from a thickness of the second work function control layer.
2. The semiconductor device as claimed in claim 1 , wherein:
each of the first transistor and the second transistor is an n-channel metal oxide semiconductor (NMOS), and
a threshold voltage of the first transistor is less than a threshold voltage of the second transistor.
3. The semiconductor device as claimed in claim 2 , wherein:
the first upper gate electrode includes:
a first insertion layer on and in contact with the first etch-stop layer, and
a first filling layer on the first insertion layer,
the second upper gate electrode includes:
a second insertion layer on and in contact with the second etch-stop layer, and
a second filling layer on the second insertion layer, and
the first insertion layer and the second insertion layer include a same material.
4. The semiconductor device as claimed in claim 2 , wherein:
the first work function control layer is on and contacts the first etch-stop layer,
the first upper gate electrode also includes a first insertion layer on the first work function control layer and a first filling layer on the first insertion layer,
the second work function control layer is on and contacts the second etch-stop layer,
the second upper gate electrode also includes a second insertion layer on the second work function control layer and a second filling layer on the second insertion layer,
the first work function control layer and the second work function control layer include a same material, and
the first insertion layer and the second insertion layer include a same material.
5. The semiconductor device as claimed in claim 1 , wherein:
each of the first transistor and the second transistor is a p-channel metal oxide semiconductor (PMOS), and
a threshold voltage of the first transistor is greater than a threshold voltage of the second transistor.
6. The semiconductor device as claimed in claim 5 , wherein:
the first work function control layer is on and contacts the first etch-stop layer,
the first upper gate electrode also includes a first insertion layer on the first work function control layer and a first filling layer on the first insertion layer
the second work function control layer is on and contacts the second etch-stop layer,
the second upper gate electrode also includes a second insertion layer on the second work function control layer and a second filling layer on the second insertion layer,
the first work function control layer and the second work function control layer include a same material, and
the first insertion layer and the second insertion layer include a same material.
7. The semiconductor device as claimed in claim 1 , wherein at least one of the first work function control layer and the second work function control layer is chamfered.
8. A semiconductor device, comprising:
a substrate including first through fourth regions; and
first through fourth transistors of the same conductivity type located in the first through fourth regions, respectively,
wherein the first transistor includes a first gate insulating layer on the substrate, a first lower TiN layer on and contacting the first gate insulating layer, a first etch-stop layer on the first lower TiN layer, and a first upper gate electrode including a first work-function control layer on and contacting the first etch-stop layer,
the second transistor includes a second gate insulating layer on the substrate, a second lower TiN layer on and contacting the second gate insulating layer, a second etch-stop layer on the second lower TiN layer, and a second upper gate electrode including a second work function control layer on and contacting the second etch-stop layer,
the third transistor includes a third gate insulating layer on the substrate, a third lower TiN layer on and contacting the third gate insulating layer, a third etch-stop layer on the third lower TiN layer, and a third upper gate electrode on the third etch-stop layer, the third upper gate electrode further including a third work function control layer that contacts the third etch-stop layer, and
the fourth transistor includes a fourth gate insulating layer on the substrate, a fourth lower TiN layer on and contacting the fourth gate insulating layer, a fourth etch-stop layer on the fourth lower TiN layer, and a fourth upper gate electrode on the fourth etch-stop layer, the fourth upper gate electrode includes a fourth work function control layer that contacts the fourth etch-stop layer,
wherein a thickness of the first work function control layer is substantially equal to a thickness of the second work function control layer,
a thickness of the third work function control layer is substantially equal to a thickness of the fourth work function control layer,
the thickness of the third work function control layer is less than a thickness of the first work function control layer,
a thickness of the first lower TiN layer is substantially equal to a thickness of the third lower TiN layer, a thickness of the second lower TiN layer is substantially equal to a thickness of the fourth lower TiN layer, and
the thickness of the first lower TiN layer is greater than a thickness of the second lower TiN layer.
9. The semiconductor device as claimed in claim 8 , wherein each of the first through fourth transistors is a PMOS.
10. The semiconductor device as claimed in claim 9 , wherein:
a threshold voltage of the first transistor is less than a threshold voltage of the second transistor, and
a threshold voltage of the third transistor is less than a threshold voltage of the fourth transistor.
11. The semiconductor device as claimed in claim 9 , wherein the threshold voltage of the second transistor is less than the threshold voltage of the third transistor.
12. The semiconductor device as claimed in claim 8 , wherein:
the first upper gate electrode includes a first insertion layer and a first filling layer sequentially formed on the first work function control layer,
the second upper gate electrode includes a second insertion layer and a second filling layer sequentially formed on the second work function control layer,
the third upper gate electrode includes a third insertion layer contacting the third etch-stop layer and a third filling layer formed on the third insertion layer,
the fourth upper gate electrode includes a fourth insertion layer contacting the fourth etch-stop layer and a fourth filling layer formed on the fourth insertion layer, and
the first through fourth insertion layers include a same material, and the first through fourth filling layers include a same material.
13. The semiconductor device as claimed in claim 12 , wherein each of the first through fourth transistors is an NMOS.
14. The semiconductor device as claimed in claim 13 , wherein:
a threshold voltage of the first transistor is greater than a threshold voltage of the second transistor, and
a threshold voltage of the third transistor is greater than a threshold voltage of the fourth transistor.
15. The semiconductor device as claimed in claim 13 , wherein the threshold voltage of the second transistor is greater than a threshold voltage of the third transistor.
16. The semiconductor device as claimed in claim 8 , wherein at least one of the first through fourth work function control layers is chamfered.
17. A semiconductor device, comprising:
a substrate including a first region and a second region; and
first and second transistors formed in the first and second regions, respectively,
wherein the first transistor includes a first fin pattern on the substrate, a first gate insulating layer on the first fin pattern, a first lower TiN layer on the first gate insulating layer to intersect the first fin pattern and contact the first gate insulating layer, a first TaN layer on the first lower TiN layer, a first TiAlC layer on the first TaN layer, a first TiN layer between and contacting the first TaN layer and the first TiAlC layer, and a first filling layer on the first TiAlC layer, and
the second transistor includes a second fin pattern on the substrate, a second gate insulating layer on the second fin pattern, a second lower TiN layer on the second gate insulating layer to intersect the second fin pattern and contact the second gate insulating layer, a second TaN layer on the second lower TiN layer, a second TiAlC layer on the second TaN layer, a second TiN layer between and contacting the second TaN layer and the second TiAlC layer and a second filling layer on the second TiAlC layer,
wherein a thickness of the first lower TiN layer is less than a thickness of the second lower TiN layer, and
a thickness of the first TiN layer is substantially equal to a thickness of the second TiN layer.
18. The semiconductor device as claimed in claim 17 , wherein:
each of the first transistor and the second transistor is an NMOS, and
a threshold voltage of the first transistor is less than a threshold voltage of the second transistor.
19. The semiconductor device as claimed in claim 17 , wherein:
each of the first transistor and the second transistor is a PMOS, and
a threshold voltage of the first transistor is greater than a threshold voltage of the second transistor.
20. The semiconductor device as claimed in claim 17 , wherein at least one of the first TiN layer and the second TiN layer is chamfered.