Pluggable optical module with heat sink

1. An optical module, comprising:

an optoelectronic transceiver;

a heat sink comprising a heat radiating element aligned along a length of the heat sink and configured to radiate heat received from the optoelectronic transceiver;

a housing adapted to be inserted into a bay of a network device and to direct an airflow within the bay along the length of the heat sink;

wherein the optoelectronic transceiver is encapsulated by the heat sink and the housing, and

a cover, wherein the cover comprises a first set of holes in the cover at a first portion of the cover located at a first end of the length of the heat sink and a second set of holes in the cover at a second portion of the cover located at a second end of the length of the heat sink.

2. The optical module of claim 1 , wherein the first set of holes is disposed on a first slanted surface on the cover.

3. The optical module of claim 2 , wherein the second set of holes is disposed on a second slanted surface on the cover.

4. The optical module of claim 2 , wherein the first set of holes and the second set of holes are oblique to a direction of an airflow.

5. The optical module of claim 1 , wherein at least a portion of the cover comprises a surface that is parallel to the housing.

6. The optical module of claim 1 , wherein the cover provides electromagnetic interference (EMI) shielding for at least the optoelectronic transceiver.

7. The optical module of claim 1 , wherein at least a portion of the heat sink is in direct contact with at least a portion of the optoelectronic transceiver.

8. The optical module of claim 1 , wherein at least a portion of the heat sink is in direct contact with at least a portion of a top surface of the optoelectronic transceiver.

9. The optical module of claim 1 , wherein at least a portion of the cover is in direct contact with at least a portion of the optoelectronic transceiver.

10. The optical module of claim 1 , wherein at least a portion of the cover is in direct contact with at least a portion of a bottom surface of the optoelectronic transceiver.

11. The optical module of claim 1 , wherein a height of the optical module is no greater than 13 mm.

12. The optical module of claim 1 , wherein a width of the optical module is no greater than 22.58 mm.

13. The optical module of claim 1 , wherein a length of the optical module is no greater than 108 mm.

14. The optical module of claim 1 , wherein the heat radiating element comprises a fin.

15. The optical module of claim 1 , wherein the heat sink comprises a plurality of continuous airflow channels oriented along the length of the heat sink.

16. The optical module of claim 1 , wherein the heat radiating element further comprises:

at least two interlocking metal structures.

17. The optical module of claim 1 , wherein the heat radiating element comprises a plurality of die-cast fins.

18. The optical module of claim 1 , wherein the optoelectronic transceiver comprises a circuit and a stepped edge connector.

19. The optical module of claim 1 , wherein the optoelectronic transceiver comprises a circuit and at least two stepped edge connectors.

20. The optical module of claim 1 , wherein the optoelectronic transceiver transmits data at greater than 100 Gigabits per second.

21. The optical module of claim 1 , wherein the optoelectronic transceiver transmits data at greater than 200 Gigabits per second.

22. The optical module of claim 1 , wherein the optoelectronic transceiver transmits data at greater than 400 Gigabits per second.

23. The optical module of claim 1 , wherein the heat sink dissipates a thermal load of 10 watts.

24. The optical module of claim 1 , wherein the heat sink dissipates a thermal load of 12 watts.

25. The optical module of claim 1 , wherein the heat sink dissipates a thermal load of 20 watts.

26. The optical module of claim 1 , wherein the heat sink dissipates a thermal load of 24 watts.