Corrosion preventive heatsink for network device
In one embodiment, an apparatus includes a chassis base, a printed circuit board mounted on the chassis base, a heatsink positioned over the printed circuit board to prevent corrosion of components on the printed circuit board, wherein the heatsink comprises a plurality of upward extending fins and a plurality of downward extending walls, a seal interposed between an edge of the downward extending walls and the chassis base, and a cover extending over the heatsink.
1 . An apparatus comprising:
a chassis comprising a plurality of upward extending walls;
a printed circuit board mounted on the chassis;
a heatsink positioned over the printed circuit board to prevent corrosion of the printed circuit board, wherein the heatsink comprises a plurality of upward extending fins and a plurality of downward extending walls, and the plurality of downward extending walls are positioned interior of the plurality of upward extending walls of the chassis;
power components mounted on the chassis adjacent to the heatsink; and
a seal interposed between an edge of the plurality of downward extending walls and the chassis, wherein the seal is positioned between the chassis and the printed circuit board.
2 . The apparatus of claim 1 , wherein the power components are offset from the printed circuit board.
3 . The apparatus of claim 1 , further comprising a port assembly positioned on the printed circuit board, wherein the heatsink engages with the port assembly.
4 . The apparatus of claim 1 , wherein an upward extending wall of the plurality of upward extending walls of the chassis comprises an opening that exposes the plurality of upward extending fins of the heatsink.
5 . The apparatus of claim 4 , further comprising a fan configured to direct air through the opening of the upward extending wall of the chassis and across the plurality of upward extending fins of the heatsink.
6 . The apparatus of claim 1 , wherein the plurality of downward extending walls of the heatsink engages with and extends past the printed circuit board.
7 . The apparatus of claim 1 , wherein the plurality of downward extending walls of the heatsink, the printed circuit board, and the chassis cooperatively define a sealed cavity extending between the printed circuit board and the chassis.
8 . An apparatus comprising:
a chassis;
a printed circuit board mounted on the chassis;
a heatsink positioned over the printed circuit board, wherein the heatsink comprises a plurality of fins and a plurality of walls, wherein the heatsink at least partially defines a first cavity extending between the printed circuit board and the heatsink and a second cavity extending between the printed circuit board and the chassis, and each of the plurality of walls of the heatsink is exposed to the first cavity and the second cavity; and
a seal positioned between the chassis and the printed circuit board, wherein the seal extends at least partially into the second cavity, and each of the plurality of walls of the heatsink extends past the printed circuit board and engages with the seal.
9 . The apparatus of claim 8 , further comprising a fan configured to direct air across the plurality of fins of the heatsink.
10 . The apparatus of claim 9 , wherein the printed circuit board is configured to reduce operation of the fan based on a temperature within the chassis being below a threshold temperature.
11 . The apparatus of claim 8 , wherein the chassis comprises a plurality of side walls extending exterior of the plurality of walls of the heatsink.
12 . The apparatus of claim 11 , wherein each side wall of the plurality of side walls of the chassis extends beyond the printed circuit board.
13 . An apparatus comprising:
a chassis;
a printed circuit board mounted on the chassis;
a seal positioned on the chassis; and
a heatsink positioned over the printed circuit board, wherein the heatsink comprises a plurality of fins and a plurality of walls, each of the plurality of walls comprises a first edge and a second edge, the first edge being engaged with a side of the printed circuit board facing away from the chassis, each of the plurality of walls extends past the printed circuit board such that the second edge is engaged with the seal, and each of the plurality of walls of the heatsink is exposed to a cavity extending between the printed circuit board and the chassis.
14 . The apparatus of claim 13 , wherein the second edge of each of the plurality of walls of the heatsink is positioned between the printed circuit board and the chassis.
15 . The apparatus of claim 13 , wherein each of the plurality of walls of the heatsink extends contiguously from the first edge engaged with the side of the printed circuit board to the second edge engaged with the seal.
16 . The apparatus of claim 13 , wherein the printed circuit board does not contact the seal.
17 . The apparatus of claim 1 , wherein the seal extends at least partially into a cavity extending between the printed circuit board and the chassis.
18 . The apparatus of claim 1 , wherein each of the plurality of downward extending walls of the heatsink extends past the printed circuit board and engages with the seal.
19 . The apparatus of claim 8 , wherein each of the plurality of walls of the heatsink faces the first cavity and the second cavity.
20 . The apparatus of claim 13 , wherein the seal is positioned between the chassis and the printed circuit board.