Impedance tuning between packaging and dies
An apparatus may include a controller configured to communicate with a plurality of dies via a signal path. The controller may notify the dies of its desire to communicate with a target die. In response, the dies may set on-die termination resistances of two or more of the dies to a low resistance value, which in turn may set an overall termination resistance of the memory dies to be lower than the low resistance value. The lower overall termination resistance may be closer to a characteristic impedance of a portion of the signal path comprising packaging components of a packaging of the dies compared to the low resistance value, thereby reducing impedance mismatch between the characteristic impedance of the packaging components and the termination resistance.
1. An apparatus comprising:
a plurality of dies;
a controller configured to:
identify a target die of the plurality of dies with which to communicate; and
in response to the identification, communicate a signal to the target die via a signal path connecting the controller and the target die,
wherein during the communication, a termination resistance circuit of a non-target die is at a low resistance level.
2. The apparatus of claim 1 , wherein the non-target die is configured to adjust the termination resistance circuit of the non-target die from a high resistance level to the low resistance level prior to the communication of the signal to the target die.
3. The apparatus of claim 2 , wherein the low resistance level is in a range of about 40-60 Ohms.
4. The apparatus of claim 2 , wherein the low resistance level is a minimum level to which the termination resistance circuit is configured to be set.
5. The apparatus of claim 2 , wherein the high resistance level is greater than one kilohm (1 kΩ).
6. The apparatus of claim 1 , wherein the controller, in response to the identification, is further configured to set a termination resistance circuit of the target die to the low resistance level, wherein the termination resistance circuit of the target die and the termination resistance circuit of the non-target die form a parallel connection.
7. The apparatus of claim 6 , wherein the controller, in response to the identification is further configured to set a plurality of termination resistance circuits of a plurality of non-target dies to the low resistance level, wherein the plurality of termination resistance circuits of the plurality of non-target dies and the target resistance of the target die form a parallel connection with each other.
8. The apparatus of claim 7 , wherein a number of the plurality of non-target dies is less than a total number of the plurality of dies.
9. The apparatus of claim 1 , wherein the plurality of dies are part of a same chip group.
10. The apparatus of claim 1 , wherein the plurality of dies are configured as a stack.
11. A method comprising:
identifying, with a controller, a target die of a plurality of dies with which to communicate; and
in response to the identifying, transmitting, with the controller, a signal to the target die via a signal path connecting the controller and the target die, wherein a termination resistance circuit of a non-target die of the plurality of dies is set to a low resistance level during the transmitting of the signal.
12. The method of claim 11 , wherein the low resistance level is in a range of about 40-60 Ohms.
13. The method of claim 11 , wherein the low resistance level is a minimum level to which the termination resistance circuit is configured to be set.
14. The method of claim 11 , further comprising:
adjusting, with the non-target die, the termination resistance circuit from a high resistance level to the low resistance level prior to the transmitting of the signal to the target die.
15. The method of claim 14 , wherein the high resistance level is greater than one kilohm (1 kΩ).
16. The method of claim 11 , further comprising:
in response to the identifying, setting, with the controller, a termination resistance circuit of the target die to the low resistance level.
17. The method of claim 16 further comprising:
in response to the identifying, setting, with the controller, a plurality of termination resistance circuits of a plurality of non-target dies to the low resistance level.
18. The method of claim 17 , wherein a number of the plurality of non-target dies is less than a total number of the plurality of dies.
19. The method of claim 11 , wherein the plurality of dies are part of a same chip group.
20. The method of claim 11 , wherein the plurality of dies are configured as a stack.
21. An apparatus comprising:
a plurality of dies;
means for identifying a target die of the plurality of dies with which to communicate a signal; and
means for communicating the signal to the target die via a signal path, wherein a termination resistance of a non-target die of the plurality of dies is at a low resistance level while the signal is communicated on the signal path.