Ceramic electronic component

1. A ceramic electronic component comprising:

a laminated body including a plurality of ceramic layers and a plurality of conductor layers that are stacked alternately; and

first and second external electrodes provided on portions of the laminated body, and electrically connected to at least some conductor layers of the plurality of conductor layers; wherein

the laminated body includes a first end surface and a second end surface opposing each other in a length direction, a first principal surface and a second principal surface opposing each other in a height direction, the first and second principal surfaces connecting the first end surface and the second end surface, and a first side surface and a second side surface opposing each other in a width direction, the first and second side surfaces connecting the first principal surface and the second principal surface and connecting the first end surface and the second end surface;

the first and second external electrodes each includes a sintered metal layer provided on the laminated body, a conductive resin layer including a mixture of a resin and a metal, the conductive resin layer provided on the sintered metal layer, and a plated layer covering the conductive resin layer;

the first external electrode extends from the first end surface to at least a portion of the second principal surface, a portion of the first side surface, and a portion of the second side surface;

the second external electrode extends from the second end surface to at least a portion the second principal surface, a portion of the first side surface, and a portion of the second side surface;

the laminated body includes a first outer layer portion and a second outer layer portion;

the second outer layer portion includes an outside outer layer portion and an inside outer layer portion;

the inside outer layer portion contains Si; and

the outside outer layer portion contains more Si than the inside outer layer portion.

2. The ceramic electronic component according to claim 1 , wherein a Si content ratio at a boundary portion between the outside outer layer portion and the inside outer layer portion is higher than that in a central portion of the outside outer layer portion.

3. The ceramic electronic component according to claim 1 , wherein the plated layer includes a Ni plated layer covering the conductive resin layer, and a Sn plated layer covering the Ni plated layer.

4. The ceramic electronic component according to claim 1 , wherein the width of the laminated body is less than a length of the laminated body.

5. The ceramic electronic component according to claim 1 , wherein a thickness of each of the plurality of ceramic layers is about 0.5 μm or more and about 10 μm or less.

6. The ceramic electronic component according to claim 1 , wherein, in the length direction, a maximum length of the conductive resin layer provided on one surface among the first and the second principal surfaces and the first and second side surfaces is shorter than a maximum length of the conductive resin layer provided on another surface among the first and second principal surfaces and the first and second side surfaces.

7. The ceramic electronic component according to claim 1 , wherein, in the length direction, a maximum length of the sintered metal layer provided on the second principal surface is about 5 μm or more and about 110 μm or less.

8. The ceramic electronic component according to claim 1 , wherein, in the length direction, a maximum length of the sintered metal layer provided on each of the first side surface and the second side surface is about 25 μm or more and about 145 μm or less.

9. A ceramic electronic component comprising:

a laminated body including a plurality of ceramic layers and a plurality of conductor layers that are stacked alternately; and

first and second external electrodes provided on portions of the laminated body, and electrically connected to at least some conductor layers of the plurality of conductor layers; wherein

the laminated body includes a first end surface and a second end surface opposing each other in a length direction, a first principal surface and a second principal surface opposing each other in a height direction, the first and second principal surfaces connecting the first end surface and the second end surface, and a first side surface and a second side surface opposing each other in a width direction, the first and second side surfaces connecting the first principal surface and the second principal surface and connecting the first end surface and the second end surface;

the first and second external electrodes each includes a sintered metal layer provided on the laminated body, a conductive resin layer including a mixture of a resin and a metal, the conductive resin layer provided on the sintered metal layer, and a plated layer covering the conductive resin layer;

the first external electrode extends from the first end surface to at least a portion of the second principal surface, a portion of the first side surface, and a portion of the second side surface;

the second external electrode extends from the second end surface to at least a portion the second principal surface, a portion of the first side surface, and a portion of the second side surface;

the laminated body includes a first outer layer portion and a second outer layer portion having a height that is greater than of the first outer layer portion;

the height of the second outer layer portion is about 30 μm or more;

the second outer layer portion includes an outside outer layer portion and an inside outer layer portion;

the inside outer layer portion contains Si;

the outside outer layer portion contains more Si than the inside outer layer portion;

the sintered metal layer contain Cu and a glass component; and

the conductive resin layer contains Cu filler having at least two different shapes.

10. The ceramic electronic component according to claim 9 , wherein a height of the laminated body in the height direction is larger than a width of the laminated body in the width direction.

11. The ceramic electronic component according to claim 9 , wherein a Si content ratio at a boundary portion between the outside outer layer portion and the inside outer layer portion is higher than that in a central portion of the outside outer layer portion.

12. The ceramic electronic component according to claim 9 , wherein the glass component contains at least one of B, Si, Ba, Mg, Al, and Li.

13. The ceramic electronic component according to claim 9 , wherein the Cu filler includes Cu particles having a flattened shape and Cu particles having a spherical shape; and

a ratio between a number of the Cu particles having the spherical shape and a number of the Cu particles having the flattened shape falls within a range of 3:7 to 7:3.

14. The ceramic electronic component according to claim 9 , wherein the plated layer includes a Ni plated layer covering the conductive resin layer, and a Sn plated layer covering the Ni plated layer.

15. The ceramic electronic component according to claim 9 , wherein a width of the laminated body is less than a length of the laminated body.

16. The ceramic electronic component according to claim 9 , wherein a thickness of each of the plurality of ceramic layers is about 0.5 μm or more and about 10 μm or less.

17. The ceramic electronic component according to claim 9 , wherein, in the length direction, a maximum length of the conductive resin layer provided on one surface among the first and the second principal surfaces and the first and second side surfaces is shorter than a maximum length of the conductive resin layer provided on another surface among the first and second principal surfaces and the first and second side surfaces.

18. The ceramic electronic component according to claim 9 , wherein, in the length direction, a maximum length of the sintered metal layer provided on the second principal surface is about 5 μm or more and about 110 μm or less.

19. The ceramic electronic component according to claim 9 , wherein, in the length direction, a maximum length of the sintered metal layer provided on each of the first side surface and the second side surface is about 25 μm or more and about 145 μm or less.

20. The ceramic electronic component according to claim 9 , wherein an average particle size of the Cu filler of the conductive resin layer is about 10.0 μm or less.