Electrostatic chucking device
Provided is an electrostatic chucking device having high heat resistance. The electrostatic chucking device of the present invention includes a first ceramic plate which includes a first surface on which a substrate is able to be placed and a second surface on the opposite side thereof, and in which an internal electrode for electrostatic adsorption is embedded; a heating member fixed to the second surface; a second ceramic plate adhered to the first ceramic plate and the heating member via a first adhesive layer; and a cooling base portion adhered to the second ceramic plate via a second adhesive layer and cools at least the second ceramic plate. The first adhesive layer has a higher heat resistance than the second adhesive layer. The second adhesive layer has a smaller Young's modulus than the first adhesive layer.
1. An electrostatic chucking device comprising:
a first ceramic plate in which an internal electrode for electrostatic adsorption is embedded, which comprises
a first surface on which the plate-shaped sample is to be placed, and
a second surface on the opposite side of the first surface;
a heating member fixed to the second surface;
a second ceramic plate adhered to the first ceramic plate and the heating member via a first adhesive layer; and
a cooling base portion bonded to the second ceramic plate via a second adhesive layer,
wherein the first adhesive layer has a higher heat resistance than the second adhesive layer, and
the second adhesive layer has a smaller Young's modulus than the first adhesive layer,
the first ceramic plate has a bank portion surrounding the second surface, and
the second ceramic plate is fitted, via the first adhesive layer, in a second recess portion formed by the bank portion and the second surface.
2. The electrostatic chucking device according to claim 1 ,
wherein the first and second adhesive layers have heat transfer coefficients which are ½ or less of the heat transfer coefficient of the second ceramic plate.
3. The electrostatic chucking device according to claim 1 ,
wherein the cooling base portion has a first recess portion, and
at least the first adhesive layer and the second ceramic plate are fitted in the first recess portion.
4. The electrostatic chucking device according to claim 1 ,
wherein the first ceramic plate is made of at least one sintered body selected from the group consisted of a composite sintered body of aluminum oxide-silicon carbide, a sintered body of aluminum oxide, a sintered body of aluminum nitride, and a sintered body of yttrium oxide.
5. The electrostatic chucking device according to claim 1 ,
wherein a plurality of auxiliary heating members are fixed to a surface of the second ceramic plate wherein the surface of the second ceramic plate is on the side of the first ceramic plate, and
a temperature of each of the auxiliary heating members is able to be individually controlled.
6. The electrostatic chucking device according to claim 1 ,
wherein the heating member comprises a plurality of separated members, and
each temperature of the separated members is able to be individually controlled.
7. The electrostatic chucking device according to claim 6 ,
wherein the second ceramic plate is divided heat-conductively in accordance with a region in which a temperature of each of the separated heating members is able to be individually controlled.
8. The electrostatic chucking device according to claim 1 ,
wherein a third adhesive layer is interposed between the second ceramic plate and the second adhesive layer, and
the third adhesive layer has a higher heat resistance than the second adhesive layer.
9. The electrostatic chucking device according to claim 1 ,
wherein one or more ceramic plates are interposed between the second ceramic plate and the second adhesive layer.