Process of forming transparent conductive coatings with sintering additives
A process is disclosed for the delayed sintering of metal nanoparticles in a self-assembled transparent conductive coating by incorporating a sintering additive into the water phase of the emulsion used to form the coating. The sintering additive reduces the standard reduction potential of the metal ion of the metal forming the nanoparticles by an amount greater than 0.1V but less than the full reduction potential of the metal ion. Emulsion compositions used in the process are also disclosed.
1. A process for forming a transparent conductive coating on a substrate comprising:
(1) forming an emulsion by mixing together (a) an oil phase comprising a solvent that is non-miscible with water having dispersed therein metal nanoparticles, and (b) a water phase comprising water or a water-miscible solvent and an additive for delayed sintering of the nanoparticles that reduces the standard reduction potential of the metal ion of the metal forming the nanoparticles by an amount greater than 0.1 V but less than the full reduction potential of the metal ion, wherein the additive is selected from the group consisting of a halide and a halogenated compound;
(2) applying the emulsion to a substrate to form a wet coating; and
(3) evaporating the liquid from the coating to cause the nanoparticles to self-assemble and form a dry coating comprising a network of electrically-conductive traces that define randomly-shaped cells that are transparent to light.
2. The process of claim 1 wherein the dry coating has a sheet resistance less than 100 ohm/sq.
3. The process of claim 2 wherein the dry coating has a sheet resistance less than 10 ohm/sq.
4. The process of claim 1 , wherein the additive is present in the water phase at a concentration of 0.001M to 0.1M.
5. The process of claim 1 , wherein the additive is a halogenated compound.
6. The process of claim 5 , wherein the halogenated compound comprises a quaternary ammonium salt or an ionic liquid.
7. The process of claim 1 , wherein the additive is a halide.
8. The process of claim 7 wherein the halide comprises sodium chloride, ammonium chloride or potassium chloride.
9. The process of claim 1 wherein the pH of the water phase is less than 3.0 after addition of the additive and greater than 8.0 when mixed with the oil phase.
10. A process for forming a transparent conductive coating on a substrate comprising:
(1) forming an emulsion by mixing together (a) an oil phase comprising a solvent that is non-miscible with water having dispersed therein metal nanoparticles, and (b) a water phase comprising water or a water-miscible solvent and an additive for delayed sintering of the nanoparticles that reduces the standard reduction potential of the metal ion of the metal forming the nanoparticles by an amount greater than 0.1 V but less than the full reduction potential of the metal ion;
(2) applying the emulsion to a substrate to form a wet coating; and
(3) evaporating the liquid from the coating to form a dry coating comprising a network of electrically-conductive traces that define randomly-shaped cells that are transparent to light, wherein the additive is selected from the group consisting of hydrochloric acid, sulfuric acid, phosphoric acid a halide, and a halogenated compound.
11. The process of claim 10 , wherein the dry coating has a sheet resistance less than 100 ohm/sq.
12. The process of claim 11 , wherein the dry coating has a sheet resistance less than 10 ohm/sq.
13. The process of claim 10 , wherein the additive is present in the water phase at a concentration of 0.001M to 0.1M.
14. The process of claim 10 , wherein the additive is a halide.
15. The process of claim 14 , wherein the halide comprises sodium chloride, ammonium chloride, or potassium chloride.
16. The process of claim 10 , wherein the pH of the water phase is less than 3.0 after addition of the additive and greater than 8.0 when mixed with the oil phase.
17. A process for forming a transparent conductive coating on a substrate comprising:
(1) forming an oil phase comprising a solvent that is non-miscible with water having dispersed therein metal nanoparticles;
(2) forming a water phase comprising water or a water-miscible solvent and an additive for delayed sintering of the nanoparticles that reduces the standard reduction potential of the metal ion of the metal forming the nanoparticles by an amount greater than 0.1 V but less than the full reduction potential of the metal ion, wherein the additive is selected from the group consisting of an acid, a halide, and a halogenated compound;
(3) forming an emulsion by mixing together the oil phase and the water phase;
(4) applying the emulsion to a substrate to form a wet coating; and
(5) evaporating the liquid from the coating to form a dry coating comprising a network of electrically-conductive traces that define randomly-shaped cells that are transparent to light.
18. The process of claim 17 , wherein the additive is a halide or a halogenated compound.
19. The process of claim 17 , wherein the additive is an acid selected from the group consisting of hydrochloric acid, sulfuric acid, and phosphoric acid.