Method for manufacturing an adhesive compound for use in the production of corrugated paperboard
A method of manufacturing an adhesive composition for use in the production of paperboard is provided. An amount of water contained within a source container is provided. The water is heated to a first temperature. A rheology modifier is added to the heated water to create a heated solution. A starch is added to the heated solution. The heated solution is mixed for a first period of time to create a heated mixture. Additionally, there may be more independent time segments determining an amount of time which the components of the heated solution are mixed or blended together. Additional elements of the adhesive composition are added to the heated mixture between each mixing time segment.
1. An adhesive compound comprising:
a starch;
a biocide adapted to reduce mold and bacteria, and assist in mold elimination naturally exposed to the starch;
a defoamer that reduces foam without affecting viscosity of the starch;
a penetrating agent adapted to assist liquids in penetrating paperboard mediums;
a first borax; and
a second borax, wherein the second borax is in amount ranging from 50% to 100% of the first borax.
2. The adhesive compound of claim 1 , further comprising an adhesive viscosity that is 23+/−3 Love Cup.
3. The adhesive compound of claim 1 , further comprising a starch gel temperature in a range from 139° F. to 145° F.
4. The adhesive compound of claim 1 , wherein a total amount of solids by weight (% wt. solids) is in a range from about 20% wt. solids and about 25% wt. solids.
5. The adhesive compound of claim 1 , wherein the amount of solids by weight ranges from 21.7% wt. solids to 22.8 wt. solids.
6. The adhesive compound of claim 1 , wherein the biocide less than about 5% solids by weight (% wt. solids) of the adhesive compound.
7. The adhesive compound of claim 6 , wherein the biocide is about 0.1% wt. solids of the adhesive compound.
8. The adhesive compound of claim 1 , wherein the defoamer has a mass that is in a range from about 1% to about 10% of the biocide's mass.
9. The adhesive compound of claim 8 , wherein the defoamer has a mass that is 6.25% of the biocide's mass.
10. The adhesive compound of claim 1 , wherein the penetrating agent has a mass that is in a range from about 20% to about 50% of the biocide's mass.
11. The adhesive compound of claim 10 , wherein the penetrating agent has a mass that is 35.4% of the biocide's mass.
12. The adhesive compound of claim 1 , further comprising a caustic in a range from about 1% wt. solids to about 4% wt. solids.
13. The adhesive compound of claim 1 , wherein the caustic is 2.15% wt. solids.
14. The adhesive compound of claim 1 , further comprising a rheology modifier in a range from about 2.5% wt. solids to about 6% wt. solids.
15. The adhesive compound of claim 14 , wherein the rheology modifier is 4.2% wt. solids.
16. The adhesive compound of claim 1 , wherein the starch is in a range from about 7.5% wt. solids to about 12% wt. solids of the adhesive compound.
17. The adhesive compound of claim 16 , wherein the starch is 9.7% wt. solids.
18. An adhesive compound comprising:
a starch;
a biocide adapted to reduce mold and bacteria, and assist in mold elimination naturally exposed to the starch;
a defoamer that reduces foam without affecting viscosity of the starch;
a penetrating agent adapted to assist liquids in penetrating paperboard mediums;
wherein the defoamer has a mass that is in a range from about 1% to about 10% of the biocide.
19. An adhesive compound comprising:
a starch;
a biocide adapted to reduce mold and bacteria, and assist in mold elimination naturally exposed to the starch;
a defoamer; and
a penetrating agent including a blend of hydrophilic amphoteric polymers reducing surface tension of the starch for assisting liquids to penetrate paperboard mediums.