Fan-out POP structure with inconsecutive polymer layer
A package includes a device die, a molding material molding at least a portion of the device die therein, and a through-via substantially penetrating through the molding material. The package further includes a dielectric layer contacting the through-via and the molding material, and a die attach film attached to a backside of the device die. The die attach film includes a portion extending in the dielectric layer.
1. A package comprising:
an encapsulating material;
a dielectric layer overlying the encapsulating material, wherein the encapsulating material comprises a first sidewall and a second sidewall opposite to each other, with a portion of the first sidewall contacting the dielectric layer;
a conductive post penetrating through the encapsulating material;
a device die; and
a die-attach film overlying and in contact with the device die, wherein edges of the die-attach film are vertically aligned to respective edges of the device die, and the die-attach film and the device die in combination penetrate through the encapsulating material, and wherein the second sidewall of the encapsulating material contacts the die-attach film and the device die.
2. The package of claim 1 , wherein a top portion of the device die extends into the dielectric layer.
3. The package of claim 1 , wherein a sidewall of the dielectric layer forms an interface with a sidewall of the die-attach film.
4. The package of claim 3 , wherein the sidewall of the dielectric layer further forms an additional interface with a sidewall of the device die.
5. The package of claim 1 , wherein the portion of the encapsulating material forms a ring encircling the die-attach film.
6. The package of claim 1 further comprising:
a package component overlying the device die and the encapsulating material;
a solder region penetrating through the dielectric layer, wherein the solder region bonds the package component to the conductive post; and
an underfill between the package component and the dielectric layer, wherein a bottom surface of the underfill forms an interface comprising:
a first portion formed between the underfill and the die-attach film; and
a second portion formed between the underfill and the dielectric layer, and the first portion and the second portion are coplanar with each other.
7. A package comprising:
an encapsulating material;
a dielectric layer extending from a top surface of the encapsulating material to an intermediate level of the encapsulating material, wherein the intermediate level is between the top surface and a bottom surface of the encapsulating material;
a die-attach film extending from the top surface of the encapsulating material into the encapsulating material;
a device die extending from the die-attach film to the bottom surface of the encapsulating material; and
a metal post extending from a bottom surface of the dielectric layer to the bottom surface of the encapsulating material.
8. The package of claim 7 , wherein the die-attach film is spaced apart from the dielectric layer by a portion of the encapsulating material, and the portion of the encapsulating material encircles the die-attach film.
9. The package of claim 7 , wherein a portion of the device die is at a same level as a portion of the dielectric layer.
10. The package of claim 7 , wherein edges of the die-attach film are vertically aligned to respective edges of the device die.
11. The package of claim 7 further comprising redistribution lines underlying the encapsulating material, wherein the redistribution lines are electrically coupled to the device die and the metal post.
12. A package comprising:
a device die;
an encapsulating material encapsulating at least a portion of the device die therein;
a through-via substantially penetrating through the encapsulating material;
a dielectric layer contacting the through-via and the encapsulating material; and
a die-attach film attached to a backside of the device die, wherein the die-attach film comprises a portion extending into the dielectric layer.
13. The package of claim 12 , wherein the dielectric layer comprises a through-opening, with the die-attach film extending into the through-opening.
14. The package of claim 13 , wherein the dielectric layer comprises edges exposed to the through-opening, and wherein the die-attach film comprises edges contacting the edges of the dielectric layer.
15. The package of claim 13 , wherein the dielectric layer comprises edges exposed to the through-opening, and wherein the die-attach film comprises edges separated from the edges of the dielectric layer by spacings, with the encapsulating material filling a portion of the through-opening.
16. The package of claim 12 further comprising a solder region extending into the dielectric layer to contact the through-via.
17. The package of claim 16 further comprising a top package bonded to the solder region.
18. The package of claim 12 , wherein the dielectric layer comprises a polymer.
19. The package of claim 12 , wherein the dielectric layer is further in contact with metal pillars in the device die.
20. The package of claim 1 further comprising an additional dielectric layer over the dielectric layer, wherein a bottom surface of the additional dielectric layer is in physical contact with the dielectric layer, the encapsulating material, and the die-attach film.