Semiconductor structure, semiconductor structure for memory device and method for forming the same
View Patent ↗A semiconductor structure for a memory device includes a substrate including a memory cell region and a peripheral circuit region defined thereon, at least an active region formed in the peripheral circuit region, a buried gate structure formed in the active region in the peripheral circuit region, a conductive line structure formed on the buried gate structure, and at least a bit line contact plug formed in the memory cell region.
1. A semiconductor structure for a memory device comprising:
a substrate comprising a memory cell region and a peripheral circuit region defined thereon;
at least an active region formed in the peripheral circuit region;
a buried gate structure formed in the active region;
a conductive line structure formed on the buried gate structure;
a local inter connection structure electrically connecting the conductive line structure and the active region in the peripheral circuit region, wherein the local inter connection structure comprises:
at least a first contact plug formed on the conductive line structure;
at least a second contact plug formed on the active region at a first side of the buried gate structure, wherein a bottom of the second contact plug is lower than a bottom of the conductive line structure; and
at least a connecting layer electrically connecting the first contact plug and the second contact plug; and
at least a bit line contact plug formed in the memory cell region.
2. The semiconductor structure for the memory device according to claim 1 , further comprising an insulating layer sandwiched between the buried gate structure and the conductive line structure, wherein the buried gate structure and the conductive line structure are physically spaced apart and electrically isolated from each other by the insulating layer, and a bottom of the conductive line structure completely contacts the insulating layer.
3. The semiconductor structure for the memory device according to claim 1 , wherein the second contact plug comprises a contact plug upper portion and a contact plug lower portion.
4. The semiconductor structure for the memory device according to claim 3 , wherein the contact plug upper portion and the first contact plug comprise a same material, and the contact plug lower portion and the conductive line structure comprise a same material.
5. The semiconductor structure for the memory device according to claim 1 , further comprising an interconnection structure formed on the active region at a second side of the buried gate structure opposite to the first side.
6. The semiconductor structure for the memory device according to claim 5 , wherein the interconnection structure electrically connecting the active region to a bit line, or alternatively electrically connecting the active region to a bit line bar.
7. A semiconductor structure comprising:
a substrate comprising a memory cell region and a peripheral circuit region defined thereon;
at least a buried gate structure formed in the peripheral circuit region;
a planar gate structure formed on the substrate in the peripheral circuit region, and the planar gate structure being directly formed on the buried gate structure;
a local inter connection structure electrically connecting the planar gate structure and an active region in the peripheral circuit region, wherein the local inter connection structure further comprises:
at least a first contact plug formed on the planar gate structure;
at least a second contact plug formed on the active region at a first side of the buried gate structure, wherein a bottom of the second contact plug is lower than a bottom of the planar gate structure; and
at least a connecting layer electrically connecting the first contact plug and the second contact plug; and
an insulating layer sandwiched between the buried gate structure and the planar gate structure, and the planar gate structure and the buried gate structure being physically spaced apart and electrically isolated from each other by the insulating layer.
8. The semiconductor structure according to claim 7 , further comprising a plurality of buried gates formed in the substrate in the memory cell region.
9. The semiconductor structure according to claim 7 , wherein the buried gate structure comprises a first width, the planar gate structure comprises a second width, and the first width is larger than the second width.
10. The semiconductor structure according to claim 7 , wherein the second contact plug comprises a contact plug upper portion and a contact plug lower portion.
11. The semiconductor structure according to claim 7 , further comprising an interconnection structure formed in the active region on a second side of the buried gate structure opposite to the first side.