Arrangement of a temperature sensor with an electrically insulating covering
A sensor arrangement for measuring the temperature of a medium in a motor vehicle. The sensor has a sensor body and two connecting wires and is completely insulated from the medium. The sensor body is electrically insulated by the medium by way of a covering completely surrounding the sensor body, and is in heat-conducting contact with the medium by way of the connecting wires and the surrounding covering.
1. A sensor arrangement for measuring a temperature of a medium in a motor vehicle, the sensor arrangement comprising:
a sensor body and two connection wires connected to said sensor body;
a covering electrically insulating said sensor from the medium, said covering completely surrounding said sensor body;
said sensor body being in thermally conductive contact with the medium by way of said connection wires and said surrounding covering;
a contact base electrically conductively connected to each connection wire by way of a separate connection contact, said contact base being configured to carry a sensor signal; and
wherein at least a part of one said connection contact is not surrounded by said covering, and is therefore in direct thermally conductive contact with the medium.
2. The sensor arrangement according to claim 1 , wherein said covering is an electrically insulating covering composed of a material selected from the group consisting of a thermosetting plastic or a thermoplastic with fillers for increasing a thermal conductivity.
3. The sensor arrangement according to claim 2 , wherein said fillers are quartz or aluminum powders.
4. The sensor arrangement according to claim 1 , wherein said connection contacts are formed as stamped grids.
5. The sensor arrangement according to claim 1 , which comprises an apparatus for establishing contact of said connection contact with the medium, said apparatus having a contact surface that is not surrounded by said covering and is therefore in direct thermally conductive contact with the medium ( 4 ), said contact surface of said apparatus being larger than a contact surface of said connection contact.
6. The sensor arrangement according to claim 5 , wherein said apparatus is a part of said connection contact in each case.
7. The sensor arrangement according to claim 1 , wherein said covering is an element selected from the group consisting of an encapsulation, a casting, and a multipartite housing.
8. The sensor arrangement according to claim 1 , wherein said sensor is a resistor with a negative temperature coefficient.
9. The sensor arrangement according to claim 1 , wherein said sensor is a resistor with a positive temperature coefficient.