IP Library › Granted Patent US 10,090,036
Granted Patent B2
US 10,090,036 · App. 15/385,593 · Granted Oct 2, 2018

Non-volatile memory cell having pinch-off ferroelectric field effect transistor

Inventor: Jan Van Houdt (Bekkevoort, BE)
Assignee: IMEC vzw
G11C11/223G11C11/2273G11C16/0475H01L27/1159
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,090,036
App. No.
15/385,593
Granted
Oct 2, 2018
Kind
B2
Abstract

The disclosed technology relates generally to non-volatile memory devices, and more particularly to ferroelectric non-volatile memory devices. In one aspect, a non-volatile memory cell includes a pinch-off ferroelectric memory FET and at least one select device electrically connected in series to the pinch-off ferroelectric memory FET.

Claims (23)

1. A non-volatile memory cell, comprising:

a pinch-off ferroelectric field effect transistor (FET) comprising a channel layer electrically connecting a source region and a drain region, wherein each of the channel layer, the source region and the drain region is formed of a semiconductor region doped with a first dopant type; and

at least one select device electrically connected in series to the pinch-off ferroelectric FET.

2. The non-volatile memory cell according to claim 1 , wherein the at least one select device comprises at least one select transistor.

3. The non-volatile memory cell according to claim 2 , wherein the at least one select device comprises a select transistor having a channel layer formed of a semiconductor region doped with a second dopant type opposite the first dopant type, the channel layer of the select transistor electrically connecting a source region and a drain region each doped with the first dopant type, wherein the drain region of the select transistor and the source region of the pinch-off ferroelectric FET are formed of a common highly doped region.

4. The non-volatile memory cell according to claim 3 , wherein the common highly doped region is electrically floating.

5. The non-volatile memory cell according to claim 3 , wherein the pinch-off ferroelectric FET comprises:

a ferroelectric gate stack comprising at least one ferroelectric layer and a gate electrode formed on the at least one ferroelectric layer;

an n-type source region and an n-type drain region; and

an n-type channel layer electrically connecting the n-type source region and the n-type drain region,

wherein the pinch-off ferroelectric FET has a negative threshold voltage, and

wherein the at least one select transistor is an n-MOS transistor.

6. The non-volatile memory cell according to claim 5 , wherein each of the n-type source and drain regions of the pinch-off ferroelectric FET comprises a highly doped n + region.

7. The non-volatile memory cell according to claim 6 , wherein the at least one select device comprises an n-type source region and an n-type drain region each comprising a highly doped n + region.

8. The non-volatile memory cell according to claim 7 , wherein the n-type drain region of the select device serves as the n-type source region of the pinch-off ferroelectric FET.

9. The non-volatile memory cell according to claim 5 , wherein the pinch-off ferroelectric FET further comprises at least one dielectric layer interposed between the at least one ferroelectric layer and the n-type channel and/or interposed between the at least one ferroelectric layer and the gate electrode.

10. The non-volatile memory cell according to claim 5 , wherein the n-type channel layer is formed in in a counterdoped n-type substrate region formed in a p-type substrate.

11. The non-volatile memory cell according to claim 5 , wherein the n-type channel layer is formed in an n-type region under the ferroelectric gate stack, and wherein the n-type region is formed on a p-type substrate or an insulator.

12. The non-volatile memory cell according to claim 3 , wherein the at least select one select device and the pinch-off ferroelectric FET are electrically connected in series between a bit line and an array ground.

13. The non-volatile memory cell according to claim 12 , wherein the pinch-off ferroelectric FET is positioned at the bit line side and the select device is positioned at the side of the array ground.

14. The non-volatile memory cell according to claim 12 , wherein the pinch-off ferroelectric FET is positioned at the side of the array ground and the select device is positioned at the bit line side.

15. A non-volatile memory array, comprising a plurality of memory cells according to claim 1 , logically arranged in rows and columns.

16. A method of operation of a non-volatile memory device according to claim 1 , wherein data of the ferroelectric pinch-off memory gate stack in accumulation mode is read out without applying a voltage to the gate electrode of the ferroelectric pinch-off memory FET.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 3, 2017
From: VAN HOUDT, JAN
To: IMEC VZW
Reel/Frame 041172/0592 →
Priority Claims (1)
EP 15201648 · Dec 21, 2015 · regional
Continuity (1)
Related Publication 20170178712A1 · Jun 22, 2017
Cited By (8)
US 12,256,547 US 12,324,357 US 12,402,319 US 12,550,382 US 12,615,769 US 12,660,250 US 12,682,953 US 12,694,931