Thin film packaging structure, method for fabrication thereof and display device
View Patent ↗Embodiments of the disclosure provide a thin film packaging structure including a flexible thin film used for packaging a light-emitting display device, wherein the flexible thin film includes at least two layers of organic film layer, at least one layer of inorganic film layer and a light extraction film layer, each layer of the inorganic film layer is located between the two layers of the organic film layer, the light extraction film layer is located between the two layers of organic film layer or located on the outer surface of the outermost layer of the organic film layer, and the light extraction film layer includes a plurality of microstructures with the function of light extraction. The thin film packaging structure provided by embodiments of the disclosure can improve the luminous efficiency of the organic light-emitting display device packaged by the thin film packaging structure.
1. A thin film packaging structure comprising a flexible thin film used for packaging a light-emitting display device, the flexible thin film comprising at least two layers of organic film layer, at least one layer of inorganic film layer, and a light extraction film layer, each layer of the at least one inorganic film layer located between two layers of the at least two organic film layers, the light extraction film layer located between the two layers of the at least two organic film layers or located on an outer surface of an outermost layer of the organic film layer, the light extraction film layer comprising a plurality of microstructures configured for light extraction, wherein flat materials are set on the light extraction film layer, and wherein the flat materials are one of ultraviolet curing materials and thermal curing materials.
2. The thin film packaging structure according to claim 1 , wherein the microstructures comprise at least one of conical, cylindrical, and spherical structures.
3. The thin film packaging structure according to claim 1 , wherein materials of the light extraction film layer comprise at least one of organic materials and inorganic materials.
4. The thin film packaging structure according to claim 1 , wherein a protecting layer is set on the light extraction film layer when the light extraction film layer is set on the outer surface of the outmost layer of the organic film layer.
5. The thin film packaging structure according to claim 4 , wherein the materials of the protecting layer comprise organic resin.
6. A display device comprising a light-emitting display device and the thin film packaging structure according to claim 1 , wherein the thin film packaging structure covers the light-emitting display device.
7. A method for fabricating a thin film packaging structure, comprising fabricating a flexible thin film comprising at least two layers of organic film layer, at least one layer of inorganic film layer, and a light extraction film layer, wherein each layer of the at least one inorganic film layer is located between two layers of the at least two organic film layers, wherein the light extraction film layer is located between the two layers of the at least two organic film layers or located on an outer surface of an outermost layer of the organic film layer, and wherein the light extraction film layer comprises a plurality of microsctructers configured for light extraction wherein the flat materials are set on the light extraction film layer; and wherein the flat materials are one of ultraviolet curing materials and thermal curing materials.
8. The method for fabricating the thin film packaging structure according to claim 7 , wherein the microstructures comprise at least one of conical, cylindrical, and spherical structures.
9. The method for fabricating the thin film packaging structure according to claim 7 , wherein the materials of the light extraction film layer comprise at least one of organic materials and inorganic materials.
10. The method for fabricating the thin film packaging structure according to claim 7 , wherein the light extraction film layer is fabricated by at least one of printing process and a heat evaporation plating process in vacuum.
11. The method for fabricating the thin film packaging structure according to claim 7 , wherein a protecting layer is set on the light extraction film layer when the light extraction film layer is set on the outer surface of the outmost layer of the organic film layer.
12. The method for fabricating the thin film packaging structure according to claim 11 , wherein the materials of the protecting layer comprise organic resin.
13. The method for fabricating the thin film packaging structure according to claim 7 , wherein the organic film layer is fabricated by one of an ink jet printing process and a chemical vapor deposition process and cured.
14. The method for fabricating a thin film packaging structure according to claim 7 , further comprising i) coating inorganic material solution on the organic film layer and roasting and curing the inorganic material using an ultraviolet curing process to form the inorganic film layer; or ii) fabricating the inorganic film layer on the organic film layer by atomic layer deposition process.
15. The method for fabricating a thin film packaging structure according to claim 8 , further comprising i) coating inorganic material solution on the organic film layer and roasting and curing the inorganic material using an ultraviolet curing process to form the inorganic film layer; or ii) fabricating the inorganic film layer on the organic film layer by atomic layer deposition process.
16. The method for fabricating a thin film packaging structure according to claim 9 , further comprising i) coating inorganic material solution on the organic film layer and roasting and curing the inorganic material using an ultraviolet curing process to form the inorganic film layer; or ii) fabricating the inorganic film layer on the organic film layer by atomic layer deposition process.