IP Library Granted Patent US 10,095,288
Granted Patent B2
US 10,095,288 · App. 15/074,414 · Granted Oct 9, 2018

Systems and methods for thermal management of an information handling system including determination of optimum slot location for information handling resource

Inventors: Hasnain Shabbir (Round Rock, TX); Dominick A. Lovicott (Round Rock, TX); Dinesh Kunnathur Ragupathi (Round Rock, TX); Daniel Whittington (Austin, TX)
Assignee: DELL PRODUCTS L.P.
G06F1/206G05B15/02G06F13/4018G06F13/4068
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,095,288
App. No.
15/074,414
Filed
Mar 18, 2016
Granted
Oct 9, 2018
Kind
B2
Art Unit
2121
USPC
700/300
Abstract

A system may include a plurality of temperature sensors configured to sense temperatures at a plurality of locations associated with an information handling system, a cooling subsystem comprising at least one cooling fan configured to generate a cooling airflow in the information handling system, and a thermal manager communicatively coupled to the plurality of temperature sensors and the cooling subsystem. The thermal manager may be configured to, based on at least a power provided to a subsystem of the information handling system, estimate a thermal condition proximate to the subsystem, correlate each of a plurality of components of the subsystem and a linear airflow velocity requirement of the component to a respective speed of the at least one cooling fan required to provide such airflow requirement, and set a speed of the at least one cooling fan based on the respective speeds.

Claims (39)

1. A system comprising:

a plurality of temperature sensors configured to sense temperatures at a plurality of locations associated with an information handling system;

a cooling subsystem comprising at least one cooling fan configured to generate a cooling airflow in the information handling system; and

a thermal manager communicatively coupled to the plurality of temperature sensors and the cooling subsystem and configured to:

based on at least a power provided to a subsystem of the information handling system, estimate a thermal condition proximate to the subsystem;

correlate each of a plurality of components of the subsystem and a linear airflow velocity requirement of the component to a respective speed of the at least one cooling fan required to provide said linear airflow velocity requirement; and

set a speed of the at least one cooling fan based on the respective speeds;

wherein the thermal manager is further configured to, for each of the plurality of components of the subsystem, determine the respective speed by correlating the linear airflow velocity requirement of such component to a bulk linear airflow velocity requirement for such component based on at least one characteristic of the component and a component inventory of the subsystem and correlate the bulk linear airflow velocity requirement to the respective speed.

2. The system of claim 1 , wherein each of the components comprises a slot, and characteristics of the component include at least one of whether the slot is populated, a form factor of a card populating the slot, and a lane width of the card populating the slot.

3. The system of claim 1 , wherein, for each of the plurality of components of the subsystem, the linear airflow velocity requirement of such component is correlated to the bulk linear airflow requirement velocity for such component by a scaling factor based on at least one characteristic of the component and a component inventory of the subsystem.

4. The system of claim 1 , wherein the thermal manager is configured to, based on at least one characteristic of the component and a component inventory of the subsystem and correlating the bulk linear airflow velocity requirement to the respective speed, and based at least on linear airflow velocity requirements of the components, determine whether a configuration of the components can be provided by the at least one cooling fan.

5. The system of claim 1 , wherein the thermal manager is configured to, based on at least one characteristic of the component and a component inventory of the subsystem and correlating the bulk linear airflow velocity requirement to the respective speed, and based at least on linear airflow velocity requirements of the components, recommend to a user of the information handling system an optimized configuration of the components.

6. The system of claim 1 , wherein the required linear airflow velocity is set by a user of the information handling system.

7. The system of claim 1 , wherein the thermal manager is configured to communicate to a user of the information handling system per-component airflow rates of the subsystem.

8. A method comprising:

sensing temperatures at a plurality of locations associated with an information handling system; and

based on at least a power provided to a subsystem of the information handling system:

estimating a thermal condition proximate to the subsystem;

correlating each of a plurality of components of the subsystem and a linear airflow velocity requirement of the component to a respective speed of the at least one cooling fan required to provide said linear airflow velocity requirement;

setting a speed of the at least one cooling fan based on the respective speeds; and

for each of the plurality of components of the subsystem, determining the respective speed by correlating the linear airflow velocity requirement of such component to a bulk linear airflow velocity requirement for such component based on at least one characteristic of the component and a component inventory of the subsystem and correlating the bulk linear airflow velocity requirement to the respective speed.

9. The method of claim 8 , wherein each of the components comprises a slot, and characteristics of the component include at least one of whether the slot is populated, a form factor of a card populating the slot, and a lane width of the card populating the slot.

10. The method of claim 8 , wherein, for each of the plurality of components of the subsystem, the linear airflow velocity requirement of such component is correlated to the bulk linear airflow velocity requirement for such component by a scaling factor based on at least one characteristic of the component and a component inventory of the subsystem.

11. The method of claim 8 , further comprising, based on at least one characteristic of the component and a component inventory of the subsystem and correlating the bulk linear airflow velocity requirement to the respective speed, and based at least on linear airflow velocity requirements of the components, determining whether a configuration of the components can be provided by the at least one cooling fan.

12. The method of claim 8 , further comprising, based on at least one characteristic of the component and a component inventory of the subsystem and correlating the bulk linear airflow velocity requirement to the respective speed, and based at least on linear airflow velocity requirements of the components, recommending to a user of the information handling system an optimized configuration of the components.

13. The method of claim 8 , wherein the required linear airflow velocity is set by a user of the information handling system.

14. The method of claim 8 , further comprising communicating to a user of the information handling system per-component airflow rates of the subsystem.

15. A method comprising:

sensing temperatures at a plurality of locations associated with an information handling system; and

based on at least a power provided to a subsystem of the information handling system:

estimating a thermal condition proximate to the subsystem;

correlating each of a plurality of components of the subsystem and a linear airflow velocity requirement of the component to a respective speed of the at least one cooling fan required to provide said linear airflow velocity requirement;

setting a speed of the at least one cooling fan based on the respective speeds;

for each of the plurality of components of the subsystem, determining the respective speed by correlating the linear airflow velocity requirement of such component to a bulk linear airflow velocity requirement for such component based on at least one characteristic of the component and a component inventory of the subsystem and correlating the bulk linear airflow velocity requirement to the respective speed;

communicating to a user of the information handling system per-component airflow rates of the subsystem; wherein the required linear airflow velocity is set by a user of the information handling system.

16. The method of claim 15 , wherein each of the components comprises a slot, and characteristics of the component include at least one of whether the slot is populated, a form factor of a card populating the slot, and a lane width of the card populating the slot.

17. The method of claim 15 , wherein, for each of the plurality of components of the subsystem, the linear airflow velocity requirement of such component is correlated to the bulk linear airflow velocity requirement for such component by a scaling factor based on at least one characteristic of the component and a component inventory of the subsystem.

18. The method of claim 15 , further comprising, based on at least one characteristic of the component and a component inventory of the subsystem and correlating the bulk linear airflow velocity requirement to the respective speed, and based at least on linear airflow velocity requirements of the components, determining whether a configuration of the components can be provided by the at least one cooling fan.

19. The method of claim 15 , further comprising, based on at least one characteristic of the component and a component inventory of the subsystem and correlating the bulk linear airflow velocity requirement to the respective speed, and based at least on linear airflow velocity requirements of the components, recommending to a user of the information handling system an optimized configuration of the components.

Assignments (15)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (045455/0001) Recorded May 20, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO ASAP SOFTWARE EXPRESS, INC.); DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC CORPORATION (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MAGINATICS LLC); EMC IP HOLDING COMPANY LLC (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MOZY, INC.); SCALEIO LLC
Reel/Frame 061753/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (040136/0001) Recorded Apr 26, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO ASAP SOFTWARE EXPRESS, INC.); DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC CORPORATION (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MAGINATICS LLC); EMC IP HOLDING COMPANY LLC (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MOZY, INC.); SCALEIO LLC
Reel/Frame 061324/0001 →
RELEASE OF SECURITY INTEREST Recorded Nov 3, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL, L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; WYSE TECHNOLOGY L.L.C.
Reel/Frame 058216/0001 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
SECURITY AGREEMENT Recorded Mar 21, 2019
From: CREDANT TECHNOLOGIES, INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049452/0223 →
SECURITY AGREEMENT Recorded Sep 21, 2016
From: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; SPANNING CLOUD APPS LLC; WYSE TECHNOLOGY L.L.C.
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
Reel/Frame 040134/0001 →
SECURITY AGREEMENT Recorded Sep 21, 2016
From: ASAP SOFTWARE EXPRESS, INC.; AVENTAIL LLC; CREDANT TECHNOLOGIES, INC.; DELL USA L.P.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL SOFTWARE INC.; DELL SYSTEMS CORPORATION; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; FORCE10 NETWORKS, INC.; MAGINATICS LLC; MOZY, INC.; SCALEIO LLC; SPANNING CLOUD APPS LLC; WYSE TECHNOLOGY L.L.C.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 040136/0001 →
RELEASE OF REEL 038664 FRAME 0908 (NOTE) Recorded Sep 14, 2016
From: BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
To: DELL SOFTWARE INC.; DELL PRODUCTS L.P.; SECUREWORKS, CORP.; WYSE TECHNOLOGY L.L.C.
Reel/Frame 040027/0390 →
RELEASE OF REEL 038665 FRAME 0041 (TL) Recorded Sep 14, 2016
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: DELL SOFTWARE INC.; DELL PRODUCTS L.P.; SECUREWORKS, CORP.; WYSE TECHNOLOGY L.L.C.
Reel/Frame 040028/0375 →
RELEASE OF REEL 038665 FRAME 0001 (ABL) Recorded Sep 13, 2016
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: DELL SOFTWARE INC.; DELL PRODUCTS L.P.; SECUREWORKS, CORP.; WYSE TECHNOLOGY L.L.C.
Reel/Frame 040021/0348 →
SUPPLEMENT TO PATENT SECURITY AGREEMENT (NOTES) Recorded May 11, 2016
From: DELL SOFTWARE INC.; WYSE TECHNOLOGY, L.L.C.; DELL PRODUCTS L.P.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS FIRST LIEN COLLATERAL AGENT
Reel/Frame 038664/0908 →
SUPPLEMENT TO PATENT SECURITY AGREEMENT (TERM LOAN) Recorded May 11, 2016
From: DELL PRODUCTS L.P.; DELL SOFTWARE INC.; WYSE TECHNOLOGY, L.L.C.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 038665/0041 →
SUPPLEMENT TO PATENT SECURITY AGREEMENT (ABL) Recorded May 11, 2016
From: DELL PRODUCTS L.P.; DELL SOFTWARE INC.; WYSE TECHNOLOGY, L.L.C.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 038665/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 21, 2016
From: SHABBIR, HASNAIN; LOVICOTT, DOMINICK A.; RAGUPATHI, DINESH KUNNATHUR; WHITTINGTON, DANIEL
To: DELL PRODUCTS L.P.
Reel/Frame 038054/0266 →
Continuity (1)
Related Publication 20170269653A1 · Sep 21, 2017